Abstract:
An automatic tile-based game machine includes a table. The table is provided with a shuffle mechanism, four conveying mechanisms, four stack mechanisms, four lift mechanisms and a central lift mechanism. The four conveying mechanisms the four stack mechanisms and the four lift mechanisms are disposed on four sides of the table. The central lift mechanism is disposed at the center of the table. The present invention has a simple configuration and the tiles can be shuffled quickly. Only one set of the tiles is required.
Abstract:
Housing of electronic device includes a metal base and a ceramic pattern portion formed in the exterior surface of the base; The pattern portion is formed by etching of base and enamel of the etched area of the base. The disclosure also described a method to make the housing.
Abstract:
The present invention provides a headset, a method for controlling usage of the headset and a terminal. The headset includes a memory configured to store an authentication password; and a usage control unit configured to send, after a connection is established between the headset and a terminal, a request of inputting authentication password to the terminal when the headset is in a protected state, receive an authentication password inputted from the terminal, authenticate the received authentication password using the stored authentication password, and control an execution of a predetermined function of the headset based on an authentication result. The present invention protects the headset by limiting the usage right of the headset, so as to reduce the probability of headset loss.
Abstract:
An improved structure of a power supply is based on an emitter-switched PWM controller and special structure transformer. An improved structure of a power supply mainly describes two primary side regulation (here called “PSR”) solutions based on above PWM controller that is used in charger/adapter solutions. These PSR solutions employ a transformer with special winding structure. It is required that adjacent reeling between its input bias winding and output winding, in which the input side of the transformer is connected to an AC input and an emitter-switched PWM controller, and the output side of the transformer is connected to a rectified diode. The present invention further provides low cost PSR solutions with higher system reliability, better line/load regulation, and short circuit characteristic.
Abstract:
Driving directions can be helpful if in addition to spatial information, landmark information is provided. Landmarks assist in adding context to directions as well as allowing for a greater likelihood of success of an operator following directions. There can be employment of physical identification of landmarks as well as processing regarding the utility of a landmark in regards to driving directions. Driving directions can be highly useful if integrated landmarks relate to knowledge possessed by an operator of a vehicle. Landmark based driving direction can be integrated with advertisements that relate to the directions.
Abstract:
An improved structure of a power supply mainly discloses three PSR solutions based on a PWM controller that is used in charger/adapter solutions, in which a low voltage PNP transistor and zener diode composes error signal amplification circuit, or −431 typed shunt regulators senses and amplifies the input error signal caused by the changes of load or line voltage, or one diode and two resistors form sense circuit of error signal. These PSR solutions employ a transformer, in which the input side of the transformer is connected to an AC input and PWM controller, and the output side of the transformer is connected to a rectified diode. The present invention further provides low cost PSR solutions with higher system reliability, better line/load regulation, and short circuit characteristic.
Abstract:
A semiconductor component having test pads and a method and apparatus for testing the same is described. In an example, an un-bumped substrate is obtained having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. In another example, a substrate is fabricated having a pattern of bond pads configured to support bumped contacts and a plurality of test pads. Each of the plurality of test pads is in electrical communication with a respective one of the bond pads. The substrate is tested using the plurality of test pads. An insulating layer is formed over the plurality of test pads.
Abstract:
The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.
Abstract:
The present invention provides a method, device and optical package (10,22) for enhancing a temperature stability by controlling a variable characteristic of an optical package and optical interconnect system. The device includes an optical emitter (14) for generating a predetermined beam of light (16) having a predetermined wavelength, a photo-sensing unit (20) for receiving a portion (18) of the predetermined beam of light (16), and a stability-enhancing broad bandwidth holographic optical element (12), wherein the predetermined wavelength of the predetermined beam of light substantially coincides with a working range wavelength of a broad bandwidth of the stability-enhancing broad bandwidth holographic optical element (12), for enhancing the temperature stability of the optical package and the optical interconnect system in response to changes in a thermal expansion of the stability-enhancing broad bandwidth holographic optical element (12) and the changes in the predetermined wavelength of the predetermined optical beam caused by temperature variations.