公开(公告)号：US20140162798A1

公开(公告)日：2014-06-12

申请号：US14123487

申请日：2012-06-02

申请人： Yong Hoon Kim

发明人： Yong Hoon Kim

IPC分类号： A63B69/36

CPC分类号： A63B69/36 ,  G06K9/00342

摘要： A housing type golf simulation apparatus and features the housing that the internal space is available having front, rear, upper and left/right side; monitor installation section which is provided backward in the rear side direction from the said front housing so that the monitor can be seated in the said front housing; golf simulation computer which is provided in the said internal space; and the monitor to be seated in the said monitor installation section. Thus, it is advantageous to implement various additional functions in the housing while installing, managing and moving the entire golf simulation apparatus in an integrated module.

摘要翻译： 一种外壳式高尔夫模拟装置，其特征在于，内部空间具有前，后，上，左/右侧的外壳; 监视器安装部，其从所述前壳体向后方设置，使得所述监视器能够坐在所述前壳体中; 设置在所述内部空间中的高尔夫模拟计算机; 并将显示器安装在所述显示器安装部分中。 因此，在集成模块中安装，管理和移动整个高尔夫模拟装置的同时，在壳体中实现各种附加功能是有利的。

公开(公告)号：US08664751B2

公开(公告)日：2014-03-04

申请号：US13115431

申请日：2011-05-25

申请人： Yong-hoon Kim ,  Hee-Seok Lee ,  Jin-ha Jeong

发明人： Yong-hoon Kim ,  Hee-Seok Lee ,  Jin-ha Jeong

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01012 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1617 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package includes a substrate in which a plurality of wires are formed; at least one semiconductor chip electrically connected to portions of the plurality of wires; and a shielding can mounted on the substrate, surrounding the at least one semiconductor chip, electrically connected to at least one wire of the plurality of wires and including a soft magnetic material. The semiconductor package can prevent or substantially reduce electromagnetic interference (EMI).

摘要翻译： 半导体封装包括其中形成有多根导线的基板; 至少一个半导体芯片电连接到多个导线的部分; 并且屏蔽可以安装在基板上，围绕至少一个半导体芯片，电连接到多根导线中的至少一根导线并且包括软磁性材料。 半导体封装可以防止或显着降低电磁干扰（EMI）。

公开(公告)号：US08513996B2

公开(公告)日：2013-08-20

申请号：US13166051

申请日：2011-06-22

申请人： Yong Hoon Kim ,  Chun Seok Jeong

发明人： Yong Hoon Kim ,  Chun Seok Jeong

IPC分类号： H03K3/017

CPC分类号： H03K5/1565

摘要： A semiconductor memory apparatus may comprise a duty cycle correction circuit configured to perform a duty correction operation with respect to an input clock signal when a delay locked signal is activated, and perform the duty correction operation with respect to the input signal when a precharge signal is activated, to generate a corrected clock signal.

摘要翻译： 半导体存储装置可以包括占空比校正电路，其被配置为当延迟锁定信号被激活时对输入时钟信号执行占空比校正操作，并且当预充电信号为...时，对输入信号执行占空比校正操作 激活，以产生校正的时钟信号。

公开(公告)号：US20130085178A1

公开(公告)日：2013-04-04

申请号：US13643597

申请日：2011-04-28

申请人： Je-Yong Choi ,  Min-su Han ,  Jae-Hwan Jeong ,  Kyung Eun Lim ,  Yong-Hoon Kim ,  Young-Hyun Hwang ,  In-Kyeom Kim

发明人： Je-Yong Choi ,  Min-su Han ,  Jae-Hwan Jeong ,  Kyung Eun Lim ,  Yong-Hoon Kim ,  Young-Hyun Hwang ,  In-Kyeom Kim

IPC分类号： A61K31/352

CPC分类号： A61K31/352 ,  A61K31/366 ,  A61K31/585

摘要： A method for preventing or treating a bone disease, includes administering to a patient having the bone disease a pharmaceutical composition comprising glyceollin as an active ingredient. The active ingredient, glyceollin promotes degradation of the Runx2 protein in osteoblasts and inhibits the mRNA expression of Rankl in osteoblasts to prevent the differentiation of osteoclasts. Furthermore, glyceollin is capable of ameliorating osteoporosis in animal models for osteoporosis. The composition promises drug or food for prevention or treatment of not only osteoporosis but also bone diseases caused by cancer metastatic to the bone.

摘要翻译： 一种预防或治疗骨疾病的方法包括向具有骨疾病的患者施用包含甘草素作为活性成分的药物组合物。 活性成分，glyceollin促进成骨细胞中Runx2蛋白的降解，并抑制成骨细胞中Rankl的mRNA表达，以防止破骨细胞的分化。 此外，血清素能够改善骨质疏松症的动物模型中的骨质疏松症。 该组合物承诺用于预防或治疗不仅骨质疏松症的药物或食物，还包括由转移到骨骼的癌症引起的骨骼疾病。

公开(公告)号：US20130043584A1

公开(公告)日：2013-02-21

申请号：US13400035

申请日：2012-02-17

申请人： HEUNG-KYU KWON ,  SEONG-HO SHIN ,  YUN-SEOK CHOI ,  YONG-HOON KIM

发明人： HEUNG-KYU KWON ,  SEONG-HO SHIN ,  YUN-SEOK CHOI ,  YONG-HOON KIM

IPC分类号： H01L23/498 ,  H01L23/522

CPC分类号： H01L24/06 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49866 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/45139 ,  H01L2224/48227 ,  H01L2224/48229 ,  H01L2224/49175 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A package stack structure may an upper package include an upper package substrate having a first edge and a second edge opposite to the first edge. The upper package substrate has a first region arranged near the first edge and a second region arranged near the second edge. A first upper semiconductor device is mounted on the upper package substrate. The package stack structure may also include a lower package having a lower package substrate and a lower semiconductor device. The lower package is connected to the upper package through a plurality of inter-package connectors. The plurality of the inter-package connectors may include first inter-package connectors configured to transmit data signals; second inter-package connectors configured to transmit address/control signals; third inter-package connectors configured to provide a supply voltage for an address/control circuit; and fourth inter-package connectors configured to provide a supply voltage for a data circuit.

摘要翻译： 封装堆叠结构可以是上封装包括具有第一边缘和与第一边缘相对的第二边缘的上封装基板。 上封装衬底具有布置在第一边缘附近的第一区域和布置在第二边缘附近的第二区域。 第一上半导体器件安装在上封装衬底上。 封装堆叠结构还可以包括具有下封装衬底和下半导体器件的下封装。 下封装通过多个封装间连接器连接到上封装。 多个包装间连接器可以包括被配置为传送数据信号的第一包装间连接器; 配置成发送地址/控制信号的第二串联连接器连接器; 第三组件间连接器，被配置为提供地址/控制电路的电源电压; 以及被配置为提供数据电路的电源电压的第四组件间连接器。

公开(公告)号：US08291210B2

公开(公告)日：2012-10-16

申请号：US12986264

申请日：2011-01-07

申请人： Yong-Hoon Kim ,  Yun-Tae Lee ,  Sung-Up Choi

发明人： Yong-Hoon Kim ,  Yun-Tae Lee ,  Sung-Up Choi

IPC分类号： G06F9/24

CPC分类号： G06F9/4401

摘要： An electronic information system comprises an external storage device and an application processor. The external storage device stores boot code and the application processor is adapted to receive the boot code from the external storage device and to perform a system booting operation during a power-up operation by executing the boot code.

摘要翻译： 电子信息系统包括外部存储装置和应用处理器。 外部存储装置存储引导代码，并且应用处理器适于从外部存储设备接收引导代码，并且在上电操作期间通过执行引导代码执行系统引导操作。

公开(公告)号：US08214896B2

公开(公告)日：2012-07-03

申请号：US12167574

申请日：2008-07-03

申请人： Seong Ho Cheong ,  Yong Hoon Kim

发明人： Seong Ho Cheong ,  Yong Hoon Kim

IPC分类号： G06F21/00

CPC分类号： G06F21/83 ,  G06F21/606

摘要： Provided is a method of securing a Universal Serial Bus (USB) keyboard. According to the method, a keyboard security operation is performed at a host controller driver level, which is one level lower than a USB hub driver level. Thus, it is possible to rapidly and effectively prevent a malicious program from leaking information input from a keyboard that is in communication with a main frame and transfers data via a USB.

摘要翻译： 提供了一种固定通用串行总线（USB）键盘的方法。 根据该方法，在主机控制器驱动器级别执行键盘安全操作，该级别低于USB集线器驱动程序级别。 因此，可以快速有效地防止恶意程序泄漏从与主框架通信的键盘输​​入的信息，并经由USB传送数据。

公开(公告)号：US20120086109A1

公开(公告)日：2012-04-12

申请号：US13172174

申请日：2011-06-29

申请人： Yong-Hoon Kim ,  Hee-Seok Lee ,  Jin-Ha Jeong ,  Ji-Hyun Lee

发明人： Yong-Hoon Kim ,  Hee-Seok Lee ,  Jin-Ha Jeong ,  Ji-Hyun Lee

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/481 ,  H01L24/48 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06537 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0233 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Example embodiments relate to a semiconductor device. The semiconductor device may include a first semiconductor chip including a semiconductor substrate, a first through via that penetrates the semiconductor substrate, a second semiconductor chip stacked on one plane of the first semiconductor chip, and a shielding layer covering at least one portion of the first and/or second semiconductor chip and electrically connected to the first through via.

摘要翻译： 示例实施例涉及半导体器件。 半导体器件可以包括第一半导体芯片，其包括半导体衬底，穿透半导体衬底的第一通孔，堆叠在第一半导体芯片的一个平面上的第二半导体芯片，以及覆盖第一半导体衬底的至少一部分的屏蔽层 和/或第二半导体芯片，并且电连接到第一通孔。

公开(公告)号：US20110008048A1

公开(公告)日：2011-01-13

申请号：US12662674

申请日：2010-04-28

申请人： Yong-hoon Kim ,  Hee-Seok Lee

发明人： Yong-hoon Kim ,  Hee-Seok Lee

IPC分类号： H04B10/00 ,  H04J14/02

CPC分类号： H04J14/0283 ,  H04J14/0201

摘要： An optical system and an SSD module that maintain optimal SI, PI and EMI characteristics without a shield based on a ground voltage and an impedance match. The optical system includes a solid state drive (SSD) module and an input/output (I/O) interface. The SSD module includes a plurality of solid state memory units. The input/output (I/O) interface receives data to be written to at least one of the solid state memory units from a main memory unit, the input/output (I/O) interface transmits data written in at least one of the solid state memory units to the main memory unit. The SSD module and the I/O interface transmit and receive data using an optical medium.

摘要翻译： 一种光学系统和一个SSD模块，可以根据接地电压和阻抗匹配保持最佳的SI，PI和EMI特性，而不需要屏蔽。 光学系统包括固态驱动器（SSD）模块和输入/输出（I / O）接口。 SSD模块包括多个固态存储器单元。 输入/输出（I / O）接口从主存储器单元接收要写入至少一个固态存储器单元的数据，输入/输出（I / O）接口发送写入至少一个 固态存储器单元到主存储器单元。 SSD模块和I / O接口使用光学介质发送和接收数据。

公开(公告)号：US07803506B2

公开(公告)日：2010-09-28

申请号：US11811979

申请日：2007-06-13

申请人： Kyoung-Yoon Bang ,  Hae-Young Jeong ,  Yong-Hoon Kim ,  Yo-Han Choi ,  Hyung-Joo Lee

发明人： Kyoung-Yoon Bang ,  Hae-Young Jeong ,  Yong-Hoon Kim ,  Yo-Han Choi ,  Hyung-Joo Lee

IPC分类号： G03F9/00 ,  G01B11/08

CPC分类号： G01B11/24 ,  G03F7/70625 ,  G06T7/001 ,  G06T2207/30148

摘要： A method of measuring a critical dimension may include forming an object pattern on a substrate and forming a plurality of reference patterns on the substrate, wherein each of the plurality of reference patterns has a different critical dimension. An optical property of each of the plurality of reference patterns may be measured to provide a respective measured optical property for each of the reference patterns, and an optical property of the object pattern may be measured to provide a measured optical property of the object pattern. The measured optical property of the object pattern may be compared with the measured optical properties of the reference patterns, and a critical dimension of the object pattern may be determined as being the same as the critical dimension of the reference pattern having the measured optical property that is closest to the measured optical property of the object pattern. Related devices are also discussed.

摘要翻译： 测量临界尺寸的方法可以包括在衬底上形成对象图案并在衬底上形成多个参考图案，其中多个参考图案中的每一个具有不同的临界尺寸。 可以测量多个参考图案中的每一个的光学特性以为每个参考图案提供相应的测量光学特性，并且可以测量对象图案的光学特性以提供对象图案的测量光学特性。 可以将对象图案的测量光学性质与参考图案的测量光学性质进行比较，并且可以将对象图案的临界尺寸确定为与具有测量的光学性质的参考图案的临界尺寸相同， 最接近被测物体图案的光学特性。 还讨论了相关设备。