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    WOVEN MATERIAL INCLUDING DOUBLE LAYER CONSTRUCTION
    21.
    发明申请
    WOVEN MATERIAL INCLUDING DOUBLE LAYER CONSTRUCTION 审中-公开
    包括双层建筑的材料

    公开(公告)号：US20160309857A1

    公开(公告)日：2016-10-27

    申请号：US14930558

    申请日：2015-11-02

    Applicant: Apple Inc.

    Inventor： Edward Siahaan ,  Whitney D. Mattson ,  Yoji Hamada

    IPC: A44C5/00 ,  D03D17/00 ,  D03D41/00 ,  D03D11/00

    CPC classification number: A44C5/0053 ,  D03D3/005 ,  D03D3/02 ,  D03D11/00 ,  D03D15/0033 ,  D03D17/00 ,  D03D41/00

    Abstract: A woven material including a four layer construction formed by distinct groups of warp threads, and a method of forming the woven material. The woven material may include a first group of warp threads, and an interior weft thread portion coupled to the first group of warp threads. The woven material may also include a second group of warp threads substantially surrounding the first group of warp threads and the interior weft thread portion, and an exterior weft thread portion coupled to the second group of warp threads.

    Abstract translation: 包括由不同组的经线形成的四层结构的编织材料以及形成织造材料的方法。 编织材料可以包括第一组经线和连接到第一组经线组的内部纬纱部分。 织造材料还可以包括基本上围绕第一组经线和内部纬纱部分的第二组经线，以及联接到第二组经线组的外部纬纱部分。

    Methods for Attaching Structures Using Heat Activated Thermoset Film and Induction Heating
    23.
    发明申请
    Methods for Attaching Structures Using Heat Activated Thermoset Film and Induction Heating 有权
    使用热活性热固性薄膜和感应加热连接结构的方法

    公开(公告)号：US20150298392A1

    公开(公告)日：2015-10-22

    申请号：US14254431

    申请日：2014-04-16

    Applicant: Apple Inc.

    Inventor： John B. Ardisana, II ,  Eric S. Jol ,  Edward Siahaan

    IPC: B29C65/32 ,  B29C65/48

    CPC classification number: B29C65/4835 ,  B29C65/32 ,  B29C65/3644 ,  B29C65/3652 ,  B29C65/3676 ,  B29C65/368 ,  B29C65/5021 ,  B29C65/5057 ,  B29C65/78 ,  B29C66/1122 ,  B29C66/50 ,  B29C66/545 ,  B29C66/61 ,  B29K2101/10 ,  B29L2031/36

    Abstract: An electronic device assembly may have electronic components enclosed within plastic and/or metal housing structures. The assembly may include first and second housing structures that are joined using heat activated thermoset polymer film. The heat activated thermoset polymer film may be heated using a metal structure such as a strip or pattern of metal that is placed along or near a joint between the first and second housing structures. The temperature of the metal and associated layers of the thermoset polymer film may be raised by heating the metal using external equipment such as an induction heater. The metal layer that is heated using electromagnetic induction may be formed on the heat activated thermoset film or may be formed in or on one of the housing structures adjacent to the heat activated thermoset polymer film.

    Abstract translation: 电子设备组件可以具有封装在塑料和/或金属外壳结构内的电子部件。 组件可以包括使用热活化的热固性聚合物膜连接的第一和第二壳体结构。 热活化的热固性聚合物膜可以使用诸如沿着或靠近第一和第二壳体结构之间的接头放置的金属条或金属图案的金属结构来加热。 可以通过使用诸如感应加热器的外部设备加热金属来提高热固性聚合物膜的金属和相关层的温度。 使用电磁感应加热的金属层可以形成在热活化的热固性膜上，或者可以形成在与热活化的热固性聚合物膜相邻的外壳结构中的一个中。

    Hotbar device and methods for assembling electrical contacts to ensure co-planarity
    24.
    发明授权
    Hotbar device and methods for assembling electrical contacts to ensure co-planarity 有权
    Hotbar器件和组装电触点的方法，以确保共面性

    公开(公告)号：US08893952B2

    公开(公告)日：2014-11-25

    申请号：US14037156

    申请日：2013-09-25

    Applicant: Apple Inc.

    Inventor： Eric S. Jol ,  Mathias W. Schmidt ,  Edward Siahaan ,  Albert J. Golko

    IPC: B23K37/04 ,  B23K1/00 ,  H01R43/02 ,  H01R12/57

    CPC classification number: H01R43/0249 ,  B23K1/0016 ,  B23K2101/38 ,  H01R12/57 ,  H01R43/0256 ,  H01R43/0263

    Abstract: Devices and methods for assembling co-planar electrical contacts in a connector are provided herein. In one aspect, an exemplary method of assembly comprises depositing solder in a connector plug enclosure, positioning electrical contacts on the solder deposits, advancing the hotbar toward the enclosure contacting each of the electrical contacts so as to planarize a top surface of each of the electrical contacts with the enclosure and melting the solder with the heated hotbar to solder the electrical contacts to the enclosure. In one aspect, an exemplary hotbar device includes a magnet for releasably coupling the electrical contacts to the hotbar. In another aspect, the hotbar includes metallic portions for heating the electrical contacts and insulated ceramic portions for contacting the enclosure. In another aspect, an electrically conductive hotbar includes side portions that extend away from the bottom heating surface facilitating more uniform current flow through the hotbar.

    Abstract translation: 本文提供了用于在连接器中组装共面电触头的装置和方法。 在一个方面，一种组装的示例性方法包括将焊料沉积在连接器插头外壳中，将电触点定位在焊料沉积物上，使热条朝向接触每个电触头的外壳移动，以使每个电触头的顶表面平坦化 与外壳接触并用加热的热棒熔化焊料，以将电触点焊接到外壳。 在一个方面，示例性的热条装置包括用于将电触点可释放地连接到热棒的磁体。 另一方面，热水箱包括用于加热电触点和用于接触外壳的绝缘陶瓷部分的金属部分。 在另一方面，导电热棒包括远离底部加热表面延伸的侧部部分，有助于流过热棒的更均匀的电流流动。

    AUDIO MODIFICATION USING INTERCONNECTED ELECTRONIC DEVICES
    27.
    发明公开
    AUDIO MODIFICATION USING INTERCONNECTED ELECTRONIC DEVICES 审中-公开

    公开(公告)号：US20230410826A1

    公开(公告)日：2023-12-21

    申请号：US18458841

    申请日：2023-08-30

    Applicant: Apple Inc.

    Inventor： Kathleen A. Bergeron ,  Edward Siahaan ,  Jeffrey J. Terlizzi

    IPC: G10L21/0208

    CPC classification number: G10L21/0208

    Abstract: Systems and methods are provided for reducing unwanted noise in an electronic audio signal, wherein a computing device having a microphone is configured to receive signals from a sensor on an external device such as a camera, second microphone, or movement sensor. The signals from the sensor are used to identify sound information or characteristics of sounds made by a source of noise, and the audio signal of the microphone is modified to reduce unwanted sounds based on that sound information or based on sounds identified a second audio signal obtained by the second microphone, thereby improving teleconference and video conference audio quality and removing distracting noises from transmitted audio output.

    HEADPHONES WITH AN ANTI-BUCKLING ASSEMBLY
    30.
    发明申请
    HEADPHONES WITH AN ANTI-BUCKLING ASSEMBLY 有权

    公开(公告)号：US20220386009A1

    公开(公告)日：2022-12-01

    申请号：US17804274

    申请日：2022-05-26

    Applicant: APPLE INC.

    Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

    IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04

    Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

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