公开(公告)号：US20220386009A1

公开(公告)日：2022-12-01

申请号：US17804274

申请日：2022-05-26

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11134328B2

公开(公告)日：2021-09-28

申请号：US16878556

申请日：2020-05-19

Applicant: Apple Inc.

Inventor： Jared M. Kole ,  Daniel R. Bloom ,  Audrey L. Sheng ,  Tian Shi Li ,  Eugene Antony Whang ,  Edward Siahaan ,  Phillip Qian ,  Alex C. Hellwig ,  Oliver M. Hewitt ,  Yuta Kuboyama ,  Christopher S. Erickson ,  Sneha Kadetotad ,  Edwin J. Corona Aparicio ,  Rajesh Anantharaman ,  Jacob E. Mattingley ,  Tsu-Hui Lin ,  Robert D. Zupke ,  Dustin A. Hatfield ,  Axit H. Patel

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US20210029435A1

公开(公告)日：2021-01-28

申请号：US17061098

申请日：2020-10-01

Applicant: Apple Inc.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Lee M. Panecki ,  Phillip Qian ,  Benjamin A. Shaffer ,  Christopher J. Stringer ,  Eugene A. Whang ,  David H. Narajowski ,  Scott Y. Oshita ,  Dustin A. Hatfield ,  Zachary G. Segraves ,  Sean J. Docherty

IPC: H04R1/10 ,  H04R5/033

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US10149041B2

公开(公告)日：2018-12-04

申请号：US15796639

申请日：2017-10-27

Applicant: Apple Inc.

Inventor： Phillip Qian ,  Edward Siahaan ,  Erik L. Wang ,  Christopher J. Stringer ,  Matthew Dean Rohrbach ,  Daniel Max Strongwater ,  Jason J. LeBlanc

IPC: H04R1/10 ,  A61B5/024 ,  A61B5/00 ,  H04R5/04 ,  H04R1/40 ,  A61B5/01 ,  A61B5/1455 ,  H04R5/033 ,  H04R3/00

Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be sitting in.

公开(公告)号：US10128608B2

公开(公告)日：2018-11-13

申请号：US15471697

申请日：2017-03-28

Applicant: APPLE INC.

Inventor： Darshan R. Kasar ,  Craig M. Stanley ,  David B. Flamholz ,  Phillip Qian ,  Matthew E. Lang ,  Ferdinand S. Toting ,  Eric S. Jol ,  Trent K. Do ,  Joel C. Yamasaki ,  Hani Esmaeili ,  Nathan A. Van Nortwick ,  Richard J. Blanco ,  Jonathan C. Lorman ,  Daniel Wagman ,  Edward S. Huo

IPC: H01R13/52 ,  H01R24/62 ,  H01R13/631 ,  H01R13/66 ,  H01R13/717 ,  H01R24/28 ,  H01R24/76 ,  H01R24/00 ,  H01R24/60 ,  H01R107/00

Abstract: A plug connector for an electronic device has a deformable seal positioned on it such that when the plug connector is mated to the electronic device a liquid-tight seal is formed between the plug connector and the electronic device. A seal may also be positioned within a receptacle connector cavity of the electronic device such that it forms a liquid-tight seal to a plug connector when the plug connector is mated to the electronic device.

公开(公告)号：US09997876B2

公开(公告)日：2018-06-12

申请号：US15472096

申请日：2017-03-28

Applicant: APPLE INC.

Inventor： Darshan R. Kasar ,  Joel C. Yamasaki ,  Phillip Qian

IPC: H01R13/52 ,  H01R13/66 ,  H01R13/631 ,  H01R13/717 ,  H01R24/62 ,  H01R107/00

CPC classification number: H01R13/5219 ,  H01R13/521 ,  H01R13/5227 ,  H01R13/631 ,  H01R13/6683 ,  H01R13/6691 ,  H01R13/717 ,  H01R24/00 ,  H01R24/28 ,  H01R24/60 ,  H01R24/62 ,  H01R24/76 ,  H01R2107/00

Abstract: Accessories for an electronic device are sealed and include a connector having a deformable seal positioned on it such that when the connector is mated to the electronic device a liquid-tight seal is formed between the accessory and the electronic device. The accessories have functions that are useful in moist, wet and/or dirty environments.

公开(公告)号：US20180069356A1

公开(公告)日：2018-03-08

申请号：US15472096

申请日：2017-03-28

Applicant: APPLE INC.

Inventor： Darshan R. Kasar ,  Joel C. Yamasaki ,  Phillip Qian

IPC: H01R24/62 ,  H01R13/52 ,  H01R13/631 ,  H01R13/717 ,  H01R13/66

CPC classification number: H01R13/5219 ,  H01R13/521 ,  H01R13/5227 ,  H01R13/631 ,  H01R13/6683 ,  H01R13/6691 ,  H01R13/717 ,  H01R24/00 ,  H01R24/28 ,  H01R24/60 ,  H01R24/62 ,  H01R24/76 ,  H01R2107/00

Abstract: Accessories for an electronic device are sealed and include a connector having a deformable seal positioned on it such that when the connector is mated to the electronic device a liquid-tight seal is formed between the accessory and the electronic device. The accessories have functions that are useful in moist, wet and/or dirty environments.

公开(公告)号：US20170078785A1

公开(公告)日：2017-03-16

申请号：US14856298

申请日：2015-09-16

Applicant: Apple Inc.

Inventor： Phillip Qian ,  Edward Siahaan ,  Erik L. Wang ,  Christopher J. Stringer ,  Matthew Dean Rohrbach ,  Daniel Max Strongwater ,  Jason J. LeBlanc

IPC: H04R1/10

CPC classification number: H04R1/1091 ,  A61B5/01 ,  A61B5/02416 ,  A61B5/14552 ,  A61B5/14557 ,  A61B5/6817 ,  H04R1/1016 ,  H04R1/1041 ,  H04R1/105 ,  H04R1/1083 ,  H04R1/406 ,  H04R3/005 ,  H04R5/033 ,  H04R5/04 ,  H04R2201/109 ,  H04R2420/03 ,  H04R2420/07 ,  H04R2460/03

Abstract: This application relates to earbuds configured with one or more biometric sensors. At least one of the biometric sensors is configured to be pressed up against a portion of the tragus for making biometric measurements. In some embodiments, the housing of the earbud can be symmetric so that the earbud can be worn interchangeably in either a left or a right ear of a user. In such an embodiment, the earbud can include a sensor and circuitry configured to determine and alter operation of the earbud in accordance to which ear the earbud is determined to be positioned within.

公开(公告)号：US20240357271A1

公开(公告)日：2024-10-24

申请号：US18626112

申请日：2024-04-03

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

CPC classification number: H04R1/1008 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/105 ,  H04R1/1066 ,  H04R1/1075 ,  H04R1/1083 ,  H04R5/0335 ,  H04R5/04 ,  G10K11/17861 ,  G10K11/17873

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.

公开(公告)号：US11985463B2

公开(公告)日：2024-05-14

申请号：US18197672

申请日：2023-05-15

Applicant: APPLE INC.

Inventor： Edward Siahaan ,  Daniel R. Bloom ,  Jason J. LeBlanc ,  Phillip Qian

IPC: H04R25/00 ,  H04R1/10 ,  H04R5/033 ,  H04R5/04 ,  G10K11/178

CPC classification number: H04R1/1008 ,  H04R1/1033 ,  H04R1/1041 ,  H04R1/105 ,  H04R1/1066 ,  H04R1/1075 ,  H04R1/1083 ,  H04R5/0335 ,  H04R5/04 ,  G10K11/17861 ,  G10K11/17873

Abstract: This disclosure includes several different features suitable for use in circumaural and supra-aural headphones designs. Designs that include earpad assemblies that improve acoustic isolation are discussed. User convenience features that include automatically detecting the orientation of the headphones on a user's head are also discussed. Various power-saving features, design features, sensor configurations and user comfort features are also discussed.