公开(公告)号：US20170206922A1

公开(公告)日：2017-07-20

申请号：US15474851

申请日：2017-03-30

Applicant: Applied Materials, Inc.

Inventor： Christopher Dennis BENCHER ,  Roman GOUK ,  Steven VERHAVERBEKE ,  Li-Qun XIA ,  Yong-Won LEE ,  Matthew D. SCOTNEY-CASTLE ,  Martin A. HILKENE ,  Peter I. PORSHNEV

IPC: G11B5/85 ,  G11B5/74

CPC classification number: G11B5/85 ,  G11B5/743 ,  G11B5/855

Abstract: A method and apparatus for forming magnetic media substrates is provided. A patterned resist layer is formed on a substrate having a magnetically susceptible layer. A conformal protective layer is formed over the patterned resist layer to prevent degradation of the pattern during subsequent processing. The substrate is subjected to an energy treatment wherein energetic species penetrate portions of the patterned resist and conformal protective layer according to the pattern formed in the patterned resist, impacting the magnetically susceptible layer and modifying a magnetic property thereof. The patterned resist and conformal protective layers are then removed, leaving a magnetic substrate having a pattern of magnetic properties with a topography that is substantially unchanged.

公开(公告)号：US20170098537A1

公开(公告)日：2017-04-06

申请号：US15268173

申请日：2016-09-16

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/02041 ,  H01L21/02057 ,  H01L21/0206 ,  H01L21/02101 ,  H01L21/67034 ,  H01L21/6704 ,  H01L21/6719

Abstract: Embodiments described herein generally relate to a processing chamber having a reduced volume for performing supercritical drying processes or other phase transition processes. The chamber includes a substrate support moveably disposed on a first track and a door moveably disposed on a second track. The substrate support and door may be configured to move independently of one another and the chamber may be configured to minimize vertical movement of the substrate within the chamber.

公开(公告)号：US20160260896A1

公开(公告)日：2016-09-08

申请号：US15157120

申请日：2016-05-17

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Steven VERHAVERBEKE ,  Alexander KONTOS ,  Adolph Miller ALLEN ,  Kevin MORAES

IPC: H01L43/12

CPC classification number: H01L43/12 ,  G11B5/746 ,  G11B5/855 ,  G11C11/16 ,  H01F41/34 ,  H01L21/2855 ,  H01L21/3081

Abstract: A method and apparatus for forming a magnetic layer having a pattern of magnetic properties on a substrate is described. The method includes using a metal nitride hardmask layer to pattern the magnetic layer by plasma exposure. The metal nitride layer is patterned using a nanoimprint patterning process with a silicon oxide pattern negative material. The pattern is developed in the metal nitride using a halogen and oxygen containing remote plasma, and is removed after plasma exposure using a caustic wet strip process. All processing is done at low temperatures to avoid thermal damage to magnetic materials.

公开(公告)号：US20220375787A1

公开(公告)日：2022-11-24

申请号：US17323381

申请日：2021-05-18

Applicant: Applied Materials, Inc.

Inventor： Wei-Sheng LEI ,  Kurtis LESCHKIES ,  Roman GOUK ,  Giback PARK ,  Kyuil CHO ,  Tapash CHAKRABORTY ,  Han-Wen CHEN ,  Steven VERHAVERBEKE

IPC: H01L21/768 ,  H01L21/48

Abstract: The present disclosure relates to micro-via structures for interconnects in advanced wafer level semiconductor packaging. The methods described herein enable the formation of high-quality, low-aspect-ratio micro-via structures with improved uniformity, thus facilitating thin and small-form-factor semiconductor devices having high I/O density with improved bandwidth and power.

公开(公告)号：US20220373883A1

公开(公告)日：2022-11-24

申请号：US17883422

申请日：2022-08-08

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Jean DELMAS ,  Steven VERHAVERBEKE ,  Chintan BUCH

IPC: G03F7/00 ,  B29C59/02 ,  B29C45/37

Abstract: An imprint lithography stamp includes a stamp body having a patterned surface and formed from a fluorinated ethylene propylene copolymer. The imprint lithography stamp further includes a backing plate with a plurality of through-holes with portions of the stamp body extending into the through-holes to adhere the stamp body to the backing plate. The patterned surface of the stamp body has a plurality of protrusions extending from the stamp body, which are used to form high aspect ratio features at high processing temperatures. A mold design for forming the imprint lithography stamp and an injection molding process for forming the imprint lithography stamp are also provided.

公开(公告)号：US20220171281A1

公开(公告)日：2022-06-02

申请号：US17673951

申请日：2022-02-17

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Giback PARK ,  Kyuil CHO ,  Han-Wen CHEN ,  Chintan BUCH ,  Steven VERHAVERBEKE ,  Vincent DICAPRIO

IPC: G03F7/00 ,  H01L21/768 ,  G03F7/20

Abstract: A method and apparatus for forming a plurality of vias in panels for advanced packaging applications is disclosed, according to one embodiment. A redistribution layer is deposited on a substrate layer. The redistribution layer may be deposited using a spin coating process, a spray coating process, a drop coating process, or lamination. The redistribution layer is then micro-imprinted using a stamp inside a chamber. The redistribution layer and the stamp are then baked inside the chamber. The stamp is removed from the redistribution layer to form a plurality of vias in the redistribution layer. Excess residue built-up on the redistribution layer may be removed using a descumming process. A residual thickness layer disposed between the bottom of each of the plurality of vias and the top of the substrate layer may have thickness of less than about 1 μm.

公开(公告)号：US20210159160A1

公开(公告)日：2021-05-27

申请号：US16886704

申请日：2020-05-28

Applicant: Applied Materials, Inc.

Inventor： Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Giback PARK ,  Kyuil CHO ,  Kurtis LESCHKIES ,  Roman GOUK ,  Chintan BUCH ,  Vincent DICAPRIO ,  Bernhard STONAS ,  Jean DELMAS

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/14

Abstract: The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.

公开(公告)号：US20200159113A1

公开(公告)日：2020-05-21

申请号：US16192546

申请日：2018-11-15

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Giback PARK ,  Kyuil CHO ,  Han-Wen CHEN ,  Chintan BUCH ,  Steven VERHAVERBEKE ,  Vincent DICAPRIO

IPC: G03F7/00 ,  G03F7/20 ,  H01L21/768

Abstract: A method and apparatus for forming a plurality of vias in panels for advanced packaging applications is disclosed, according to one embodiment. A redistribution layer is deposited on a substrate layer. The redistribution layer may be deposited using a spin coating process, a spray coating process, a drop coating process, or lamination. The redistribution layer is then micro-imprinted using a stamp inside a chamber. The redistribution layer and the stamp are then baked inside the chamber. The stamp is removed from the redistribution layer to form a plurality of vias in the redistribution layer. Excess residue built-up on the redistribution layer may be removed using a descumming process. A residual thickness layer disposed between the bottom of each of the plurality of vias and the top of the substrate layer may have thickness of less than about 1 μm.

公开(公告)号：US20190273002A1

公开(公告)日：2019-09-05

申请号：US16417124

申请日：2019-05-20

Applicant: Applied Materials, Inc.

Inventor： Roman GOUK ,  Han-Wen CHEN ,  Steven VERHAVERBEKE ,  Jean DELMAS

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677 ,  B08B7/00 ,  H01L21/687 ,  F26B21/14 ,  C11D11/00

Abstract: Embodiments described herein generally relate to a processing chamber incorporating a small thermal mass which enable efficient temperature cycling for supercritical drying processes. The chamber generally includes a body, a liner, and an insulation element which enables the liner to exhibit a small thermal mass relative to the body. The chamber is also configured with suitable apparatus for generating and/or maintaining supercritical fluid within a processing volume of the chamber.

公开(公告)号：US20190139788A1

公开(公告)日：2019-05-09

申请号：US16171000

申请日：2018-10-25

Applicant: Applied Materials, Inc.

Inventor： Boyi FU ,  Han-Wen CHEN ,  Kyuil CHO ,  Sivapackia GANAPATHIAPPAN ,  Roman GOUK ,  Steven VERHAVERBEKE ,  Nag B. PATIBANDLA ,  Yan ZHAO ,  Hou T. NG ,  Ankit VORA ,  Daihua ZHANG

IPC: H01L21/56 ,  H01L21/67

Abstract: Aspects of the disclosure generally relate to methods of immobilizing die on a substrate. In one method one or more immobilization features are formed in a selected pattern on a substrate. A die is positioned in contact with the one or more immobilization features and the substrate. The one or more immobilization features are cured, and a mold layer is formed on top of the cured one or more immobilization features and the die so as to encapsulate the die.