RESIST FORTIFICATION FOR MAGNETIC MEDIA PATTERNING
    6.
    发明申请
    RESIST FORTIFICATION FOR MAGNETIC MEDIA PATTERNING 有权
    用于磁介质图形的电阻强化

    公开(公告)号:US20140147700A1

    公开(公告)日:2014-05-29

    申请号:US14170009

    申请日:2014-01-31

    CPC classification number: G11B5/85 G11B5/743 G11B5/855

    Abstract: A method and apparatus for forming magnetic media substrates is provided. A patterned resist layer is formed on a substrate having a magnetically susceptible layer. A conformal protective layer is formed over the patterned resist layer to prevent degradation of the pattern during subsequent processing. The substrate is subjected to an energy treatment wherein energetic species penetrate portions of the patterned resist and conformal protective layer according to the pattern formed in the patterned resist, impacting the magnetically susceptible layer and modifying a magnetic property thereof. The patterned resist and conformal protective layers are then removed, leaving a magnetic substrate having a pattern of magnetic properties with a topography that is substantially unchanged.

    Abstract translation: 提供了一种形成磁性介质基板的方法和装置。 在具有磁敏感层的基板上形成图案化的抗蚀剂层。 在图案化的抗蚀剂层上形成保形层,以防止后续处理期间图案的劣化。 对衬底进行能量处理,其中能量物质根据形成在图案化抗蚀剂中的图案穿透图案化抗蚀剂和保形层的部分,撞击磁敏感层并改变其磁性。 然后去除图案化的抗蚀剂和共形保护层,留下具有基本上不变的形貌的磁性质图案的磁性基底。

    CONVERSION PROCESS UTILIZED FOR MANUFACTURING ADVANCED 3D FEATURES FOR SEMICONDUCTOR DEVICE APPLICATIONS
    9.
    发明申请
    CONVERSION PROCESS UTILIZED FOR MANUFACTURING ADVANCED 3D FEATURES FOR SEMICONDUCTOR DEVICE APPLICATIONS 有权
    用于制造半导体器件应用的高级3D特性的转换过程

    公开(公告)号:US20150279974A1

    公开(公告)日:2015-10-01

    申请号:US14622647

    申请日:2015-02-13

    Abstract: Embodiments of the present invention provide methods for forming fin structure with desired materials using a conversion process for three dimensional (3D) stacking of fin field effect transistor (FinFET) for semiconductor chips. In one embodiment, a method of forming a fin structure on a substrate includes performing an directional plasma process on a fin structure formed from a substrate comprising a first type of atoms, the directional plasma process dopes a second type of atoms on sidewalls of the fin structure, performing a surface modification process to form a surface modified layer on the sidewalls of the fin structure reacting with the first type of atoms, replacing the first type of the atoms with the second type of the atoms in the fin structure during the surface modification process, and forming the fin structure including the second type of the atoms on the substrate.

    Abstract translation: 本发明的实施例提供了使用用于半导体芯片的鳍式场效应晶体管(FinFET)的三维(3D)堆叠的转换工艺来形成具有所需材料的鳍结构的方法。 在一个实施例中,在衬底上形成翅片结构的方法包括对由包括第一类型的原子的衬底形成的鳍结构执行定向等离子体处理,所述定向等离子体工艺在鳍的侧壁上掺杂第二类型的原子 结构,进行表面改性处理以在与第一类型的原子反应的翅片结构的侧壁上形成表面改性层,在表面改性期间用翅片结构中的第二类型的原子代替第一类型的原子 处理,并且形成包括基板上的第二类型的原子的翅片结构。

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