公开(公告)号：US11090893B2

公开(公告)日：2021-08-17

申请号：US16123637

申请日：2018-09-06

Applicant: Applied Materials, Inc.

Inventor： Shagun P. Maheshwari ,  Yao-Hung Yang ,  Tom K. Cho ,  Yu-Chi Yeh ,  Andrew Yu ,  Aniruddha Pal ,  Siamak Salimian

IPC: F16J15/328 ,  B29D99/00 ,  F16J15/3284 ,  B29L31/26 ,  B29K27/18

Abstract: A method of reclaiming a used seal includes boiling the used seal in a liquid, and after boiling the used seal in the liquid, baking the used seal. The boiling the used seal may include boiling for a predetermined boiling time in the liquid, and the baking the used seal may include baking the used seal for a predetermined bake time at a predetermined temperature.

公开(公告)号：US11074426B1

公开(公告)日：2021-07-27

申请号：US16887892

申请日：2020-05-29

Applicant: Applied Materials, Inc.

Inventor： Chien-Min Liao ,  Yao-Hung Yang ,  Hsiu Yang ,  Jeevan Shanbhag ,  Chun-Chung Chen ,  Tom K. Cho

IPC: G06K7/14 ,  G06Q10/08 ,  H04L9/06

Abstract: The present disclosure relates to systems and methods for semiconductor tool part tracking and kit verification. Data relating to part identification and performance are encoded to a unique code that is encoded into machine-readable form, such as a data matrix. A multi-dimensional array (MDA) of the data matrices of a group of parts is a ‘golden MDA’. When assembled into a kit, the parts are scanned and compared to the golden MDA. If there's a match, a kit unique code is used to generate a kit data matrix. The part data matrix codes are provided to a database to determine if a part combination will cause a coupling effect, based on part usage history.

公开(公告)号：US10446418B2

公开(公告)日：2019-10-15

申请号：US14677901

申请日：2015-04-02

Applicant: Applied Materials, Inc.

Inventor： Andrew Nguyen ,  Yogananda Sarode Vishwanath ,  Tom K. Cho

IPC: C23C16/44 ,  H01L21/67 ,  H01J37/32

Abstract: The present disclosure generally relates to process chambers having modular design to provide variable process volume and improved flow conductance and uniformity. The modular design according to the present disclosure achieves improved process uniformity and symmetry with simplified chamber structure. The modular design further affords flexibility of performing various processes or processing substrates of various sizes by replacing one or more modules in a modular process chamber according to the present disclosure.

公开(公告)号：US09725799B2

公开(公告)日：2017-08-08

申请号：US14562339

申请日：2014-12-05

Applicant: Applied Materials, Inc.

Inventor： Jennifer Y. Sun ,  Vahid Firouzdor ,  Biraja Prasad Kanungo ,  Tom K. Cho ,  Vedapuram S. Achutharaman ,  Ying Zhang

IPC: C23C14/34 ,  C23C14/08 ,  C04B41/50 ,  C23C14/46 ,  C23C14/58 ,  H01J37/32 ,  C04B41/87 ,  C04B41/89 ,  C04B41/00 ,  C04B41/52 ,  C04B35/505 ,  C04B35/622

CPC classification number: C23C14/088 ,  C04B35/00 ,  C04B35/505 ,  C04B35/62222 ,  C04B41/009 ,  C04B41/4529 ,  C04B41/5045 ,  C04B41/52 ,  C04B41/87 ,  C04B41/89 ,  C04B2235/3217 ,  C04B2235/3222 ,  C04B2235/3225 ,  C04B2235/3246 ,  C04B2235/3418 ,  C04B2235/3826 ,  C04B2235/3873 ,  C04B2235/428 ,  C04B2235/445 ,  C23C14/08 ,  C23C14/083 ,  C23C14/46 ,  C23C14/5806 ,  H01J37/32477 ,  Y10T428/26 ,  Y10T428/265 ,  C04B35/10 ,  C04B35/50 ,  C04B35/14 ,  C04B35/584 ,  C04B35/565 ,  C04B41/5032 ,  C04B41/5042 ,  C04B41/5035 ,  C04B2103/54

Abstract: A method of manufacturing an article includes providing a component for an etch reactor. Ion beam sputtering with ion assisted deposition (IBS-IAD) is then performed to deposit a protective layer on at least one surface of the component, wherein the protective layer is a plasma resistant film having a thickness of less than 1000 μm.

公开(公告)号：US20240351055A1

公开(公告)日：2024-10-24

申请号：US18206852

申请日：2023-06-07

Applicant: Applied Materials, Inc.

Inventor： Yogananda Sarode Vishwanath ,  Andrew Nguyen ,  Tom K. Cho

IPC: B05B7/26 ,  B05B1/00 ,  B05B1/14 ,  B05B13/02 ,  B33Y80/00

CPC classification number: B05B7/26 ,  B05B1/005 ,  B05B1/14 ,  B05B13/0278 ,  B33Y80/00

Abstract: Example structures, methods, and systems for additive manufacturing of a gas hub and delivery nozzle are disclosed. One example structure includes a unitary gas hub and distribution nozzle that includes a gas hub portion and a gas delivery nozzle portion. The gas hub portion includes multiple gas inlet paths and one or more plenum chambers. The multiple gas inlet paths and the one or more plenum chambers form fully recursive gas paths. Each of the one or more plenum chambers has one or more output holes. The gas delivery nozzle portion includes multiple gas flow paths, where each gas flow path is coupled to one of the one or more output holes in each of the one or more plenum chambers, and each gas flow path has a respective output at an outer surface of the gas delivery nozzle portion.

公开(公告)号：US20240339302A1

公开(公告)日：2024-10-10

申请号：US18206456

申请日：2023-06-06

Applicant: Applied Materials, Inc.

Inventor： Yogananda Sarode Vishwanath ,  Andrew Nguyen ,  Tom K. Cho

IPC: H01J37/32 ,  B33Y80/00

CPC classification number: H01J37/32449 ,  B33Y80/00 ,  H01J2237/334

Abstract: Systems, methods, and apparatus including designs embodied in machine-readable media for a gas break used in semiconductor processing systems. The apparatus includes a gas break structure comprising an insulating material and having one or more gas flow paths formed within a body of the gas break structure, the gas break structure configured to provide a specified impedance when coupled between a grounded gas distribution manifold and an electrically charged gas delivery nozzle, the gas break structure further comprising an internal structure having a specified geometry comprising a repeating structure and one or more empty gaps between elements of the repeating structure. The gas break can be formed using additive manufacturing.

公开(公告)号：US11856706B2

公开(公告)日：2023-12-26

申请号：US16702031

申请日：2019-12-03

Applicant: Applied Materials, Inc.

Inventor： Hsui Yang ,  Yao-Hung Yang ,  Jeevan Shanbhag ,  Chien-Min Liao ,  Earl Hunter ,  David Ganon ,  Mariana Luigi ,  Siamak Salimian ,  Tom K. Cho ,  Chun-Chung Chen

IPC: H05K13/08 ,  H01L21/67

CPC classification number: H05K13/087 ,  H01L21/67276 ,  H01L21/67294

Abstract: The present disclosure is directed to a system and method to identify and track parts of a semiconductor processing chamber, as well as the status of the parts, and store status information in a centralized location as status changes over time.

公开(公告)号：US11566318B2

公开(公告)日：2023-01-31

申请号：US15712094

申请日：2017-09-21

Applicant: Applied Materials, Inc.

Inventor： Jennifer Y. Sun ,  Vahid Firouzdor ,  Biraja Prasad Kanungo ,  Tom K. Cho ,  Vedapuram S. Achutharaman ,  Ying Zhang

IPC: C04B41/89 ,  C04B41/00 ,  C04B41/52 ,  C04B35/505 ,  C04B35/622 ,  C04B41/45 ,  C04B35/00 ,  C23C14/08 ,  C04B41/50 ,  C23C14/46 ,  C23C14/58 ,  H01J37/32 ,  C04B41/87

Abstract: An article comprises a body and a conformal protective layer on at least one surface of the body. The conformal protective layer is a plasma resistant rare earth oxide film having a thickness of less than 1000 μm, wherein the plasma resistant rare earth oxide film is selected from a group consisting of an Er—Y composition, an Er—Al—Y composition, an Er—Y—Zr composition, and an Er—Al composition.

公开(公告)号：US10347522B2

公开(公告)日：2019-07-09

申请号：US15458666

申请日：2017-03-14

Applicant: Applied Materials, Inc.

Inventor： Wendell Glen Boyd, Jr. ,  Tom K. Cho ,  Robert T. Hirahara

IPC: H01L21/683 ,  H01L21/687 ,  H01J37/32

Abstract: A method and apparatus for discharging a residual charge from a substrate support. In one example, a substrate support is provided that includes a body, an electrode disposed in the body, a radiation emitter and a diffuser. The body has one or more holes formed in a workpiece support surface, the workpiece support surface configured to accept a substrate thereon. The electrode is configured to electrostatically hold a substrate to the workpiece support surface. The radiation emitter is disposed in a first hole of the one or more holes formed in the workpiece support surface. The radiation emitter is configured to emit electromagnetic energy out of the first hole. The diffuser is disposed in first hole over the radiation emitter.

公开(公告)号：US10211033B2

公开(公告)日：2019-02-19

申请号：US14612263

申请日：2015-02-02

Applicant: Applied Materials, Inc.

Inventor： Andrew Nguyen ,  Yogananda Sarode Vishwanath ,  Tom K. Cho

IPC: C23C16/50 ,  H01J37/32 ,  C23C16/458

Abstract: The present disclosure generally relates to apparatus and methods for symmetry in electrical field, gas flow and thermal distribution in a processing chamber to achieve process uniformity. Embodiment of the present disclosure includes a plasma processing chamber having a plasma source, a substrate support assembly and a vacuum pump aligned along the same central axis to create substantially symmetrical flow paths, electrical field, and thermal distribution in the plasma processing chamber resulting in improved process uniformity and reduced skew.