公开(公告)号：US20160246185A1

公开(公告)日：2016-08-25

申请号：US15025856

申请日：2014-09-05

Applicant: ASML Netherlands B.V.

Inventor： Alexander Ypma ,  Jasper Menger ,  David Deckers ,  David Han ,  Adrianus Cornelis Matheus Koopman ,  Irina Lyulina ,  Scott Anderson Middlebrooks ,  Richard Johannes Franciscus Van Haren ,  Jochem Sebastiaan Wildenberg

IPC: G03F7/20 ,  G06F17/30

CPC classification number: G03F7/70616 ,  G03F7/70508 ,  G03F7/70525 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70641 ,  G03F9/7092 ,  G06F17/30572

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

Abstract translation: 在光刻工艺中，诸如半导体晶片的产品单元经受光刻图案化操作和化学和物理处理操作。 在执行过程期间分阶段进行对准数据或其他测量，以获得表示在空间上分布在每个单元上的点处测量的位置偏差或其他参数的对象数据。 该对象数据用于通过执行多变量分析来获取诊断信息，以将表示所述多维空间中的单位的向量集合分解为一个或多个分量向量。 使用分量向量提取关于工业过程的诊断信息。 可以基于提取的诊断信息来控制后续产品单元的工业过程的性能。

公开(公告)号：US20240019788A1

公开(公告)日：2024-01-18

申请号：US18232570

申请日：2023-08-10

Applicant: ASML Netherlands B.V.

Inventor： Alexander Ypma ,  Jasper Menger ,  David Deckers ,  David Han ,  Adrianus Cornelis Matheus Koopman ,  Irina Lyulina ,  Scott Anderson Middlebrooks ,  Richard Johannes Franciscus Van Haren ,  Jochem Sebastiaan Wildenberg

IPC: G03F7/00

CPC classification number: G03F7/706837 ,  G03F7/70525 ,  G03F7/70616 ,  G06F16/26

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in the multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.

公开(公告)号：US11796920B2

公开(公告)日：2023-10-24

申请号：US17797506

申请日：2021-01-14

Applicant: ASML NETHERLANDS B.V.

Inventor： Jochem Sebastiaan Wildenberg ,  Hermanus Adrianus Dillen ,  Fan Feng ,  Ronald Van Ittersum ,  Willem Louis Van Mierlo ,  Koen Thuijs

IPC: G03F7/20 ,  G03F7/00

CPC classification number: G03F7/70525

Abstract: A method and associated apparatuses for controlling a process of manufacturing semiconductor devices on a substrate. The method includes obtaining process data relating to the process and determining a correction for the process based on the process data and a first control objective associated with the devices on the substrate. A first probability of the first control objective being achievable is determined and the correction adjusted based on the probability and at least a second control objective having a second probability of being achievable compared to the first control objective.

公开(公告)号：US11480884B2

公开(公告)日：2022-10-25

申请号：US16936867

申请日：2020-07-23

Applicant: ASML NETHERLANDS B.V.

Inventor： Everhardus Cornelis Mos ,  Jochem Sebastiaan Wildenberg ,  Erik Johannes Maria Wallerbos ,  Maurits Van Der Schaar ,  Frank Staals ,  Franciscus Hendricus Arnoldus Elich

IPC: G03F7/20

Abstract: A method for improving the yield of a lithographic process, the method including: determining a parameter fingerprint of a performance parameter across a substrate, the parameter fingerprint including information relating to uncertainty in the performance parameter; determining a process window fingerprint of the performance parameter across the substrate, the process window being associated with an allowable range of the performance parameter; and determining a probability metric associated with the probability of the performance parameter being outside an allowable range. Optionally a correction to the lithographic process is determined based on the probability metric.

公开(公告)号：US11378891B2

公开(公告)日：2022-07-05

申请号：US17023474

申请日：2020-09-17

Applicant: ASML NETHERLANDS B.V.

Inventor： Davit Harutyunyan ,  Fei Jia ,  Frank Staals ,  Fuming Wang ,  Hugo Thomas Looijestijn ,  Cornelis Johannes Rijnierse ,  Maxim Pisarenco ,  Roy Werkman ,  Thomas Theeuwes ,  Tom Van Hemert ,  Vahid Bastani ,  Jochem Sebastiaan Wildenberg ,  Everhardus Cornelis Mos ,  Erik Johannes Maria Wallerbos

IPC: G03F7/20 ,  G05B13/04 ,  H01L21/66

Abstract: A method, system and program for determining a fingerprint of a parameter. The method includes determining a contribution from a device out of a plurality of devices to a fingerprint of a parameter. The method includes obtaining parameter data and usage data, wherein the parameter data is based on measurements for multiple substrates having been processed by the plurality of devices, and the usage data indicates which of the devices out of the plurality of the devices were used in the processing of each substrate; and determining the contribution using the usage data and parameter data.

公开(公告)号：US10802408B2

公开(公告)日：2020-10-13

申请号：US16343168

申请日：2017-10-16

Applicant: ASML NETHERLANDS B.V.

Inventor： Everhardus Cornelis Mos ,  Jochem Sebastiaan Wildenberg ,  Erik Johannes Maria Wallerbos ,  Maurits Van Der Schaar ,  Frank Staals ,  Franciscus Hendricus Arnoldus Elich

IPC: G03F7/20

Abstract: A method for improving the yield of a lithographic process, the method including: determining a parameter fingerprint of a performance parameter across a substrate, the parameter fingerprint including information relating to uncertainty in the performance parameter; determining a process window fingerprint of the performance parameter across the substrate, the process window being associated with an allowable range of the performance parameter; and determining a probability metric associated with the probability of the performance parameter being outside an allowable range. Optionally a correction to the lithographic process is determined based on the probability metric.

公开(公告)号：US10725372B2

公开(公告)日：2020-07-28

申请号：US15546583

申请日：2016-01-20

Applicant: ASML Netherlands B.V.

Inventor： Wim Tjibbo Tel ,  Marinus Jochemsen ,  Frank Staals ,  Christopher Prentice ,  Laurent Michel Marcel Depre ,  Johannes Marcus Maria Beltman ,  Roy Werkman ,  Jochem Sebastiaan Wildenberg ,  Everhardus Cornelis Mos

IPC: G06F17/50 ,  G03F1/70 ,  G03F1/36 ,  G03F1/22 ,  G06T7/00 ,  G06F30/398 ,  G06F119/18 ,  G06F30/20 ,  G06F30/367

Abstract: A method includes determining topographic information of a substrate for use in a lithographic imaging system, determining or estimating, based on the topographic information, imaging error information for a plurality of points in an image field of the lithographic imaging system, adapting a design for a patterning device based on the imaging error information. In an embodiment, a plurality of locations for metrology targets is optimized based on imaging error information for a plurality of points in an image field of a lithographic imaging system, wherein the optimizing involves minimizing a cost function that describes the imaging error information. In an embodiment, locations are weighted based on differences in imaging requirements across the image field.

公开(公告)号：US20180307145A1

公开(公告)日：2018-10-25

申请号：US15951343

申请日：2018-04-12

Applicant: ASML NETHERLANDS B.V.

Inventor： Everhardus Cornelis MOS ,  Jochem Sebastiaan Wildenberg ,  Marcel Hendrikus Maria Beems ,  Erik Johannes Maria Wallerbos

IPC: G03F7/20

CPC classification number: G03F7/70625 ,  G03F7/705 ,  G03F7/70508 ,  G03F7/70516 ,  G03F7/70616 ,  G03F7/70891

Abstract: A method of monitoring a device manufacturing process, the method including; obtaining an estimated time variation of a process parameter; determining, on the basis of the estimated time variation, a sampling plan for measurements to be performed on a plurality of substrates to obtain information about the process parameter; measuring substrates in accordance with the sampling plan to obtain a plurality of measurements; and determining an actual time variation of the process parameter on the basis of the measurements.

公开(公告)号：US09946165B2

公开(公告)日：2018-04-17

申请号：US15025856

申请日：2014-09-05

Applicant: ASML Netherlands B.V.

Inventor： Alexander Ypma ,  Jasper Menger ,  David Deckers ,  David Han ,  Adrianus Cornelis Matheus Koopman ,  Irina Lyulina ,  Scott Anderson Middlebrooks ,  Richard Johannes Franciscus Van Haren ,  Jochem Sebastiaan Wildenberg

IPC: G03F7/20 ,  G03F9/00 ,  G06F17/30

CPC classification number: G03F7/70616 ,  G03F7/70508 ,  G03F7/70525 ,  G03F7/70625 ,  G03F7/70633 ,  G03F7/70641 ,  G03F9/7092 ,  G06F17/30572

Abstract: In a lithographic process, product units such as semiconductor wafers are subjected to lithographic patterning operations and chemical and physical processing operations. Alignment data or other measurements are made at stages during the performance of the process to obtain object data representing positional deviation or other parameters measured at points spatially distributed across each unit. This object data is used to obtain diagnostic information by performing a multivariate analysis to decompose a set of vectors representing the units in said multidimensional space into one or more component vectors. Diagnostic information about the industrial process is extracted using the component vectors. The performance of the industrial process for subsequent product units can be controlled based on the extracted diagnostic information.