摘要:
A method of forming a conformal dielectric film having Si—N bonds on a semiconductor substrate by plasma enhanced chemical vapor deposition (PECVD) includes: introducing a nitrogen- and hydrogen-containing reactive gas and an additive gas into a reaction space inside which a semiconductor substrate is placed; applying RF power to the reaction space; and introducing a hydrogen-containing silicon precursor in pulses into the reaction space wherein a plasma is excited, thereby forming a conformal dielectric film having Si—N bonds on the substrate.
摘要:
A film forming cycle based on pulse CVD or ALD is repeated multiple times to form a single layer of insulation film, while a reforming cycle is implemented in the aforementioned process, either once or multiple times per each film forming cycle, by treating the surface of formed film using a treating gas that has been activated by a plasma.
摘要:
The present invention provides a rotary electric machine, in which it is possible to reduce the dimension of a casing in a direction along a rotation center line. The rotary electric machine comprises a magnet rotor 2 rotating about a rotation center line 1 and one or more magnetic sensors 11 for detecting leakage flux leaking out of the magnet rotor 2. The magnet rotor 2 and a stator 3 are received in a casing 4. A sensor receiving portion 12 for receiving the one or more magnetic sensors 11 is disposed in an outer wall portion of a side wall of the casing 4 located in an extending direction of the rotation center line 1 of the magnet rotor 2. The one or more magnetic sensors 11 are received in the sensor receiving portion 12. The sensor receiving portion 12 is disposed in a position that allows the one or more sensors to detect leakage flux leaking out of the magnet rotor 2.
摘要:
In a protection circuit connected, via lines including an inductance component, to a circuit to be protected, a first transistor is arranged on a path to ground from a connection point of the protection circuit and the line. A second transistor is arranged on a path to ground from a connection point of the circuit to be protected and the line, and extracts, from a connection point, a current corresponding to a current flowing in the first transistor. The first and the second transistors are NPN bipolar transistors having a base and an emitter are commonly connected. A resistor is connected between the base and the emitter of the first transistor, and a diode is connected between the base and a collector.
摘要:
When operating a database management system that consists of a plurality of database servers and enables the database servers to transfer data between them by partitioning a data area into small areas and altering allocation of the small areas to the database servers, after altering the configuration, there occurs degradation in processing speed that accompanies re-creation of the index. If this problem is solved by using the conventional technique, noticeable degradation in processing speed will occur to a specific query at the time of a steady state operation. When operating the database management system that consists of the plurality of database servers and enables the database servers to transfer data between them by partitioning the database area into small areas and altering the allocation of the small areas to the database server, an index created for each of the small areas and an index to all the small areas allocated to the database server are used in combination.
摘要:
A read-start-timing set circuit is connected to a timing terminal (CT1) of a semiconductor device. By comparing an internal signal of this semiconductor device with an external signal on a bus line, the read timing immediately after power is turned on is modified. Since data transmission onto the bus line from another semiconductor device is inhibited, adjustment is effected to avoid data collision between the semiconductor devices. Therefore, automatic reading after power is turned on can be conducted while avoiding data collision between the semiconductor devices on the bus line to which a plurality of semiconductor devices are connected. Furthermore, a relevant semiconductor device can be readily attached onto the bus line.
摘要:
A single-wafer-processing type CVD apparatus for forming a thin film on an object to be processed includes a reaction chamber, a susceptor for placing the object thereon, a shower plate for emitting a jet of reaction gas to the object, which is set up in parallel and opposing to the susceptor, an orifice for bringing a liquid raw material and a carrier gas into the reaction chamber, which is formed through the ceiling of the reaction chamber, an evaporation plate means for vaporizing the liquid raw material, which is set up in a space between the ceiling of the reaction chamber and the shower plate, and a temperature controlling mechanism for controlling the shower plate and the evaporation plate means at respective given temperatures.
摘要:
A floating gate is formed on a semiconductor substrate via a gate insulating film. Diffused layers are formed as sources or drain regions on opposite sides of the floating gate in the semiconductor substrate. First and second control gates are formed opposite to both of the diffused layers on the opposite sides of the floating gate via an inter-gate insulating film to drive the floating gate.
摘要:
An apparatus for depositing thin film on a processing target includes: a reaction space; a susceptor movable up and down and rotatable around its center axis; and isolation walls that divide the reaction space into multiple compartments including source gas compartments and purge gas compartments, wherein when the susceptor is raised for film deposition, a small gap is created between the susceptor and the isolation walls, thereby establishing gaseous separation between the respective compartments, wherein each source gas compartment and each purge gas compartment are provided alternately in a susceptor-rotating direction of the susceptor.
摘要:
Space and time co-divided atomic layer deposition (ALD) apparatuses and methods are provided. Substrates are moved (e.g., rotated) among multiple reaction zones, each of which is exposed to only one ALD reactant. At the same time, reactants are pulsed in each reaction zone, with purging or other gas removal methods between pulses. Separate exhaust passages for each reactant and purging during wafer movement minimizes particle contamination. Additionally, preferred embodiments permit different pulsing times in each reaction space, thus permitting flexibility in pulsing.