公开(公告)号：US20080254621A1

公开(公告)日：2008-10-16

申请号：US11735984

申请日：2007-04-16

申请人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie

发明人： William Thie ,  John M. Boyd ,  Fritz C. Redeker ,  Yezdi Dordi ,  John Parks ,  Tiruchirapalli Arunagiri ,  Aleksander Owczarz ,  Todd Balisky ,  Clint Thomas ,  Jacob Wylie

IPC分类号： H01L21/44 ,  B05C11/11 ,  B05C13/00

CPC分类号： H01L21/288 ,  C23C18/1619 ,  C23C18/1632 ,  H01L21/76873

摘要： A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).

摘要翻译： 公开了一种用于晶片无电镀的干/干输出系统。 该系统包括用于晶片入口/出口和干燥操作的上部区域。 靠近头部设置在上部区域以执行干燥操作。 该系统还包括用于无电镀操作的下部区域。 下部区域包括通过流体上升流法实现晶片浸没的化学镀设备。 系统的上部和下部区域由双壁室围住，其中内壁是化学惰性塑料，外壁是结构金属。 系统与流体处理系统接口，为系统提供必要的化学物质供应和控制。 系统是环境控制的。 此外，系统与环境受控的托管传输模块（MTM）接口。

公开(公告)号：US07084621B2

公开(公告)日：2006-08-01

申请号：US10256055

申请日：2002-09-25

申请人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

发明人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

IPC分类号： G01B7/06

CPC分类号： G01B7/105 ,  G01N27/023

摘要： A method and an apparatus for enhancement of the for measuring resistance-based features of a substrate is provided. The apparatus includes a sensor configured to detect a signal produced by a eddy current generated electromagnetic field. The magnetic field enhancing source is positioned to the alternative side of the object under measurement relative to the sensor to enable the sensitivity enhancing action. The sensitivity enhancing source increases the intensity of the eddy current generated in the object under measurement, and as a result the sensitivity of the sensor. A system enabled to determine a thickness of a layer and a method for determining a resistance-based feature characteristic are also provided.

摘要翻译： 提供了用于增强基板的基于电阻的特征的方法和装置。 该装置包括被配置为检测由涡流产生的电磁场产生的信号的传感器。 磁场增强源相对于传感器定位在测量对象的替代侧，以实现灵敏度增强作用。 灵敏度增强源增加了测量对象中产生的涡流的强度，从而提高了传感器的灵敏度。 还提供了能够确定层的厚度的系统和用于确定基于电阻的特征特征的方法。

公开(公告)号：US06951624B2

公开(公告)日：2005-10-04

申请号：US10881094

申请日：2004-06-29

申请人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

发明人： Yehiel Gotkis ,  Rodney Kistler ,  Aleksander Owczarz ,  David Hemker ,  Nicolas J. Bright

IPC分类号： C23F1/00 ,  G01B7/06 ,  G01R27/00 ,  H01L21/302

CPC分类号： G01B7/105 ,  G01B7/107 ,  G01B2210/44

摘要： A system for processing a wafer is provided. The system includes a chemical mechanical planarization (CMP) tool. The CMP tool includes a wafer carrier defined within a housing. A carrier film is affixed to the bottom surface and supports a wafer. A sensor embedded in the wafer carrier. The sensor is configured to induce an eddy current in the wafer to determine a proximity and a thickness of the wafer. A sensor array external to the CMP tool is included. The sensor array is in communication with the sensor embedded in the wafer carrier and substantially eliminates a distance sensitivity. The sensor array provides an initial thickness of the wafer to allow for a calibration to be performed on the sensor embedded in the wafer carrier. The calibration offsets variables causing inaccuracies in the determination of the thickness of the wafer during CMP operation. A method and an apparatus are also provided.

摘要翻译： 提供了一种用于处理晶片的系统。 该系统包括化学机械平面化（CMP）工具。 CMP工具包括限定在壳体内的晶片载体。 载体膜固定到底表面并支撑晶片。 嵌入晶片载体的传感器。 传感器被配置为在晶片中感应涡流以确定晶片的接近度和厚度。 包括CMP工具外部的传感器阵列。 传感器阵列与嵌入在晶片载体中的传感器连通，并且基本上消除了距离灵敏度。 传感器阵列提供晶片的初始厚度，以允许对嵌入在晶片载体中的传感器进行校准。 校准偏移了在CMP操作期间确定晶片厚度的不准确性的变量。 还提供了一种方法和装置。

公开(公告)号：US06925348B2

公开(公告)日：2005-08-02

申请号：US10966744

申请日：2004-10-14

申请人： Rodney Kistler ,  David J. Hemker ,  Yehiel Gotkis ,  Aleksander Owczarz ,  Bruno Morel ,  Damon V. Williams

发明人： Rodney Kistler ,  David J. Hemker ,  Yehiel Gotkis ,  Aleksander Owczarz ,  Bruno Morel ,  Damon V. Williams

IPC分类号： B24B37/005 ,  B24B49/02 ,  B24B49/10 ,  B24B49/14 ,  H01L21/304 ,  H01L21/66 ,  G06F19/00

CPC分类号： B24B37/005 ,  B24B49/10 ,  B24B49/14

摘要： In chemical mechanical polishing, a wafer carrier plate is provided with a cavity for reception of a sensor positioned very close to a wafer to be polished. Energy resulting from contact between a polishing pad and an exposed surface of the wafer is transmitted only a very short distance to the sensor and is sensed by the sensor, providing data as to the nature of properties of the exposed surface of the wafer, and of transitions of those properties. Correlation methods provide graphs relating sensed energy to the surface properties, and to the transitions. The correlation graphs provide process status data for process control.

摘要翻译： 在化学机械抛光中，晶片承载板设置有用于接收位于非常接近待抛光晶片的传感器的空腔。 由抛光垫与晶片的暴露表面之间的接触所产生的能量仅传播到传感器非常短的距离，并由传感器感测，提供关于晶片的暴露表面的性质的数据以及 这些属性的转换。 相关方法提供了将感测能量与表面性质和转变相关联的图。 相关图提供过程控制的过程状态数据。

公开(公告)号：US06808442B1

公开(公告)日：2004-10-26

申请号：US10027947

申请日：2001-12-20

申请人： David Wei ,  Yehiel Gotkis ,  Aleksander Owczarz ,  John M. Boyd ,  Rod Kistler

发明人： David Wei ,  Yehiel Gotkis ,  Aleksander Owczarz ,  John M. Boyd ,  Rod Kistler

IPC分类号： B24B100

CPC分类号： B24B37/20 ,  B24B21/20

摘要： An invention is provided for removal rate profile manipulation during a CMP process. An apparatus of the embodiments of the present invention includes an actuator capable of vertical movement perpendicular to a polishing surface of a polishing pad. The actuator is further capable of flexing the polishing pad independently of a pad support device. Also included in the apparatus is an actuator control mechanism that is in communication with the actuator. The actuator control mechanism is capable of controlling an amount of vertical movement of the actuator, allowing the actuator to provide local flexing of the polishing pad to achieve a particular removal rate profile. The actuator can also be capable of horizontal movement parallel to the polishing surface of the polishing pad.

摘要翻译： 提供了一种用于在CMP处理期间的去除速率轮廓操作的发明。 本发明的实施例的装置包括能够垂直于抛光垫的抛光表面垂直运动的致动器。 致动器还能够独立于衬垫支撑装置使抛光垫挠曲。 该装置中还包括与致动器连通的致动器控制机构。 致动器控制机构能够控制致动器的垂直运动量，从而允许致动器提供抛光垫的局部弯曲以实现特定的去除速率曲线。 致动器还能够平行于抛光垫的抛光表面的水平移动。

公开(公告)号：US06579407B1

公开(公告)日：2003-06-17

申请号：US09608286

申请日：2000-06-30

申请人： John M. Boyd ,  Aleksander Owczarz ,  Miguel Saldana

发明人： John M. Boyd ,  Aleksander Owczarz ,  Miguel Saldana

IPC分类号： H01L21306

CPC分类号： B24B41/044 ,  B24B37/04 ,  B24B47/22 ,  H01L21/30625

摘要： A method and apparatus is disclosed for polishing a semiconductor wafer. A polishing pad including a first surface and a semiconductor wafer including a second surface are aligned to each other. To allow alignment of an axis of rotation of the surfaces, at least one of the first and second surfaces includes an adjustable axis of rotation. After the axis of rotation of the first and second surfaces is aligned, the adjustable axis of rotation is set, preferably with a magneto-rheological fluid or similarly acting material, to maintain a fixed position. Thereafter, the polishing pad is utilized to polish the semiconductor wafer.

公开(公告)号：US6105592A

公开(公告)日：2000-08-22

申请号：US897913

申请日：1997-07-21

申请人： Raymon F. Thompson ,  Aleksander Owczarz ,  Daniel P. Bexten

发明人： Raymon F. Thompson ,  Aleksander Owczarz ,  Daniel P. Bexten

IPC分类号： H01L21/00 ,  B08B15/02

CPC分类号： H01L21/67034 ,  Y10S134/902

摘要： An apparatus for processing a semiconductor wafer is set forth. The apparatus comprises a processing bowl that defines a processing chamber. The bowl has an opening through which wafers may be placed in the apparatus. A wafer support structure adapted to support at least one wafer is mounted for rotation within the processing chamber. A motor drive assembly is connected to rotate the wafer support structure. At least one fluid nozzle accepts processing fluid and sprays the processing fluid on the one or more wafers carried by the wafer support structure. A door is used to seal the opening of the processing bowl. The door has an opening that is open to ambient atmosphere to facilitate passage of ambient gas into the processing chamber. An ambient gas intake assembly is disposed in the door. The ambient gas intake assembly comprises a high efficiency filter, preferably, and ULPA filter, disposed to filter ambient gas passing from the opening of the door to the processing chamber and a heater disposed to heat the filtered gas prior to entering the processing chamber.

摘要翻译： 阐述了一种用于处理半导体晶片的设备。 该装置包括限定处理室的处理碗。 碗具有开口，晶片可以通过该开口放置在装置中。 适于支撑至少一个晶片的晶片支撑结构被安装用于在处理室内旋转。 电动机驱动组件被连接以旋转晶片支撑结构。 至少一个流体喷嘴接受处理流体并将处理流体喷射在由晶片支撑结构承载的一个或多个晶片上。 门用于密封加工碗的开口。 门具有通向大气环境的开口，以便于环境气体进入处理室。 环境气体进入组件设置在门中。 环境气体进入组件包括优选的高效过滤器和ULPA过滤器，其设置成过滤从门的开口到处理室的环境气体，以及设置成在进入处理室之前加热经过滤的气体的加热器。

公开(公告)号：US5738128A

公开(公告)日：1998-04-14

申请号：US727271

申请日：1996-10-08

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B08B3/02 ,  H01L21/00 ,  H01L21/304

CPC分类号： H01L21/67017 ,  B08B3/02 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

摘要： Apparatus (20) for cleaning carriers used to hold semiconductor wafers, substrates, data disks, flat panel displays and similar containers used in applications highly sensitive to contamination. The apparatus has a processing bowl (21) with entrance and exit ports (34, 36) through which carriers are installed and removed from processing chamber (21). Rotor (70) rotates within the processing chamber. Rotor (70) includes a rotor cage (71) which mounts detachable wafer carrier supports (214). Filtered, heated air is passed through the process chamber for drying. Cleaning liquid and additional drying gas can be supplied through manifolds (120, 110) positioned inside and outside rotor cage (71).

摘要翻译： 用于清洁用于保存半导体晶片，基板，数据盘，平板显示器和用于对污染高度敏感的应用中的类似容器的载体的装置（20）。 该装置具有一个具有入口和出口（34,36）的处理碗（21），载物从该处理室中被安装并从处理室（21）中移出。 转子（70）在处理室内旋转。 转子（70）包括安装可拆卸晶片载体支撑件（214）的转子笼（71）。 过滤的加热空气通过处理室进行干燥。 可以通过位于转子笼（71）内部和外部的歧管（120,110）供应清洁液体和附加的干燥气体。

公开(公告)号：US5573023A

公开(公告)日：1996-11-12

申请号：US489142

申请日：1995-06-08

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： G11B7/26 ,  H01L21/00 ,  H01L21/687 ,  B08B3/10

CPC分类号： H01L21/68728 ,  H01L21/6708 ,  H01L21/67086 ,  H01L21/68707 ,  H01L21/68785 ,  G11B7/26 ,  Y10S134/902

摘要： A single wafer processing apparatus includes a portable processing head that can be a portable module or a movable unit mounted to a supporting machine frame. The processing head has movable fingers adapted to grip a wafer. The fingers protrude from a protective wafer plate. Indexing and rotation monitoring assemblies are provided for automation of the wafer processing steps. A complementary processing base includes an upwardly-open bowl that receives a wafer held by the portable processing head. It has a full-diameter movable bottom wall for rapid draining purposes. Liquid and/or gas jets and nozzles supply fluids required within the bowl for processing of wafers.

摘要翻译： 单个晶片处理装置包括便携式处理头，其可以是安装到支撑机架的便携式模块或可移动单元。 处理头具有适于夹紧晶片的活动指状物。 指状物从保护性晶片板突出。 提供分度和旋转监测组件用于晶片处理步骤的自动化。 补充处理基座包括接收由便携式处理头保持的晶片的向上开口的碗。 它具有用于快速排水的全直径可移动底壁。 液体和/或气体喷嘴和喷嘴提供碗内所需的流体用于处理晶片。

公开(公告)号：US5562113A

公开(公告)日：1996-10-08

申请号：US360724

申请日：1995-02-21

申请人： Raymon F. Thompson ,  Aleksander Owczarz

发明人： Raymon F. Thompson ,  Aleksander Owczarz

IPC分类号： B08B3/02 ,  H01L21/00 ,  H01L21/304

CPC分类号： H01L21/67017 ,  B08B3/02 ,  H01L21/67028 ,  H01L21/67034 ,  Y10S134/902

摘要： Apparatus (20) for cleaning carriers used to hold semiconductor wafers, substrates, data disks, flat panel displays and similar containers used in applications highly sensitive to contamination. The apparatus has a processing bowl (21) with entrance and exit ports (34, 36) through which carriers are installed and removed from processing chamber (21). Rotor (70) rotates within the processing chamber. Rotor (70) includes a rotor cage (71) which mounts detachable wafer carrier supports (214). Filtered, heated air is passed through the process chamber for drying. Cleaning liquid and additional drying gas can be supplied through manifolds (120, 110) positioned inside and outside rotor cage (71).

摘要翻译： PCT No.PCT / US93 / 05329 Sec。 371日期1995年2月21日 102（e）1995年2月21日PCT PCT 1993年6月3日PCT公布。 出版物WO93 / 26035 日期1993年12月23日用于清洁用于保存半导体晶片，基板，数据盘，平板显示器和用于对污染敏感的应用中使用的类似容器的载体的装置（20）。 该装置具有一个具有入口和出口（34,36）的处理碗（21），载物从该处理室中被安装并从处理室（21）中移出。 转子（70）在处理室内旋转。 转子（70）包括安装可拆卸晶片载体支撑件（214）的转子笼（71）。 过滤的加热空气通过处理室进行干燥。 可以通过位于转子笼（71）内部和外部的歧管（120,110）供应清洁液体和附加的干燥气体。