公开(公告)号：US20220328336A1

公开(公告)日：2022-10-13

申请号：US17842681

申请日：2022-06-16

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: Printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.

公开(公告)号：US20220293888A1

公开(公告)日：2022-09-15

申请号：US17751454

申请日：2022-05-23

Applicant: Applied Materials, Inc.

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L27/32

Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.

公开(公告)号：US11329003B2

公开(公告)日：2022-05-10

申请号：US16839007

申请日：2020-04-02

Applicant: Applied Materials, Inc.

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L23/544 ,  H01L21/67 ,  H01L21/02

Abstract: A method of printing structures on a reconstructed wafer includes positioning a plurality of semiconductor dies on a support substrate, anchoring the plurality of semiconductor dies to the support substrate by printing a plurality of anchors that extend across edges of the semiconductor dies onto the support substrate and thus form a reconstructed wafer, and printing one or more device structures on the pluralities of semiconductor dies while anchored on the support substrate. The printing operations include ejecting droplets of a liquid precursor material and curing the liquid precursor material.

公开(公告)号：US11258045B2

公开(公告)日：2022-02-22

申请号：US16698835

申请日：2019-11-27

Applicant: Applied Materials, Inc

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L51/56 ,  H01L27/32

Abstract: A method of encapsulating an organic light-emitting diode display includes depositing a plurality of first polymer projections onto a light-emitting side of a display layer having a plurality of organic light-emitting diodes (OLEDs) such that the plurality of first polymer projections have spaces therebetween that expose an underlying surface, and conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.

公开(公告)号：US11257790B2

公开(公告)日：2022-02-22

申请号：US16814785

申请日：2020-03-10

Applicant: Applied Materials, Inc.

Inventor： Kurtis Leschkies ,  Han-Wen Chen ,  Steven Verhaverbeke ,  Giback Park ,  Kyuil Cho ,  Jeffrey L. Franklin ,  Wei-Sheng Lei

IPC: H01L25/065 ,  H01L23/522 ,  H05K1/14 ,  H01L23/495 ,  H01L25/00

Abstract: The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.

公开(公告)号：US10727083B1

公开(公告)日：2020-07-28

申请号：US16284595

申请日：2019-02-25

Applicant: Applied Materials, Inc.

Inventor： Roman Gouk ,  Chintan Buch ,  Kyuil Cho ,  Han-Wen Chen ,  Steven Verhaverbeke ,  Vincent Dicaprio

IPC: G03F7/00 ,  H01L21/48

Abstract: The present disclosure generally relates to methods of micro-imprinting panels or substrates for advanced packaging applications. A redistribution layer comprising an epoxy material is deposited on a substrate layer and imprinted with a stamp to form an epoxy substrate patterned with a plurality of vias. The stamp is removed from the epoxy substrate, and the epoxy substrate is optionally etched with a plasma comprising oxygen to prevent the redistribution layer from becoming flowable when cured. A capping layer may optionally be deposited on the surface of the epoxy substrate.

公开(公告)号：US11715700B2

公开(公告)日：2023-08-01

申请号：US17227983

申请日：2021-04-12

Applicant: Applied Materials, Inc.

Inventor： Han-Wen Chen ,  Steven Verhaverbeke ,  Guan Huei See ,  Giback Park ,  Giorgio Cellere ,  Diego Tonini ,  Vincent Dicaprio ,  Kyuil Cho

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/13 ,  H01L23/14 ,  H01L23/498 ,  H01L25/10 ,  H01L23/66 ,  H01Q1/22 ,  H01Q1/24 ,  H05K1/02 ,  H01L21/50 ,  H01L21/768 ,  H01L25/065 ,  H01L27/06 ,  H01L21/60

CPC classification number: H01L23/5389 ,  H01L21/486 ,  H01L21/4864 ,  H01L21/50 ,  H01L21/76802 ,  H01L23/13 ,  H01L23/147 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L23/49894 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/66 ,  H01L25/0657 ,  H01L25/105 ,  H01L27/0688 ,  H01Q1/2283 ,  H01Q1/243 ,  H05K1/0243 ,  H01L2021/60007 ,  H01L2225/107 ,  H01L2225/1035

Abstract: The present disclosure relates to thin-form-factor reconstituted substrates and methods for forming the same. The reconstituted substrates described herein may be utilized to fabricate homogeneous or heterogeneous high-density 3D integrated devices. In one embodiment, a silicon substrate is structured by direct laser patterning to include one or more cavities and one or more vias. One or more semiconductor dies of the same or different types may be placed within the cavities and thereafter embedded in the substrate upon formation of an insulating layer thereon. One or more conductive interconnections are formed in the vias and may have contact points redistributed to desired surfaces of the reconstituted substrate. The reconstituted substrate may thereafter be integrated into a stacked 3D device.

公开(公告)号：US20220246888A1

公开(公告)日：2022-08-04

申请号：US17676080

申请日：2022-02-18

Applicant: Applied Materials, Inc.

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L51/56

Abstract: A method of encapsulating an organic light-emitting diode display includes depositing a plurality of first polymer projections onto a light-emitting side of a display layer having a plurality of organic light-emitting diodes (OLEDs) such that the plurality of first polymer projections have spaces therebetween that expose an underlying surface, and conformally coating the first polymer projections and the spaces between the first polymer projections with a first dielectric layer such that the first dielectric layer has side walls along sides of the first polymer projections and defines wells in spaces between the side walls.

公开(公告)号：US11367643B2

公开(公告)日：2022-06-21

申请号：US16838981

申请日：2020-04-02

Applicant: Applied Materials, Inc

Inventor： Daihua Zhang ,  Hou T. Ng ,  Nag B. Patibandla ,  Sivapackia Ganapathiappan ,  Yingdong Luo ,  Kyuil Cho ,  Han-Wen Chen

IPC: H01L21/68 ,  H01L21/67 ,  H01L21/02

Abstract: A method for printing on a substrate includes printing a support structure by printing a liquid precursor material and curing the liquid precursor material, printing one or more alignment markers by printing the liquid precursor material outside the support structure and curing the liquid precursor material, positioning a substrate within the support structure, performing a registration of the substrate using the one or more alignment markers, and printing one or more device structures on the substrate while registered by printing and curing the liquid precursor material.

公开(公告)号：US11362307B2

公开(公告)日：2022-06-14

申请号：US16698824

申请日：2019-11-27

Applicant: Applied Materials, Inc.

Inventor： Kyuil Cho ,  Byung Sung Kwak ,  Robert Jan Visser

IPC: H01L51/52 ,  H01L27/32

Abstract: A display device includes a display layer having a plurality of organic light-emitting diodes (OLEDs) separated by gaps, and an encapsulation layer covering a light-emitting side of the display layer. The encapsulation layer includes a bilayer having a plurality of polymer projections on the display layer, the plurality of polymer projections having spaces therebetween, and a first dielectric layer conformally covering the plurality of polymer projections and an underlying surface in the spaces between the polymer projections, the dielectric layer forming side walls along sides of the polymer projections. The side walls are aligned with the gaps between the OLEDS, and/or the encapsulation layer has multiple bilayers.