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    Underwater wafer storage and wafer picking for chemical mechanical polishing
    21.
    发明授权
    Underwater wafer storage and wafer picking for chemical mechanical polishing 失效
    水下晶圆储存和晶圆采摘化学机械抛光

    公开(公告)号：US6080046A

    公开(公告)日：2000-06-27

    申请号：US58945

    申请日：1998-04-10

    Applicant: Norm Shendon ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee ,  Robert D. Tolles ,  Sasson Somekh

    Inventor： Norm Shendon ,  Ilya Perlov ,  Eugene Gantvarg ,  Harry Q. Lee ,  Robert D. Tolles ,  Sasson Somekh

    IPC: B24B27/00 ,  B24B37/30 ,  B24B37/34 ,  B24B41/00 ,  B24B53/007 ,  B24B53/017 ,  B24B53/12 ,  B24B57/02 ,  H01L21/00 ,  H01L21/304 ,  H01L21/306 ,  B24B1/00

    CPC classification number: H01L21/67057 ,  B08B1/007 ,  B24B27/0023 ,  B24B37/30 ,  B24B37/345 ,  B24B41/005 ,  B24B53/017 ,  B24B53/12 ,  B24B57/02 ,  H01L21/67051 ,  H01L21/30625

    Abstract: A wafer storage and wafer transfer system adjunct to a multi-station chemical mechanical polishing system. Multiple wafers are brought to the system stored in a cassette. A claw member attached to an overhead arm picks up the cassette and deposits it in a water-filled tub next to the polishing system, thereby submerging the wafers in the water with a generally vertical orientation. A blade member attached to the same arm has a recess formed in its surface connected to a vacuum generator powered by positive fluid pressure to thereby selectively apply a vacuum to the recess to vacuum chuck a wafer. The blade member vacuum chucks a wafer under the water, picks it out of the water, and deposits it on a pedestal in polishing system. One of several wafer heads on a rotating carousel picks up the wafer from the pedestal and carries it to one or more of the polishing stations for polishing. After completion of polishing, the wafer head redeposits the wafer on the pedestal. The blade member vacuum chucks the wafer and moves it from the pedestal back to the same cassette or another cassette in the water-filled tub.

    Abstract translation: 晶圆储存和晶片转移系统，附加于多工位化学机械抛光系统。 多个晶片被带到存储在盒中的系统。 附接到顶架的爪构件拾取盒并将其沉积在靠近抛光系统的充满水的桶中，从而以大致垂直的方向将晶片浸没在水中。 附接到同一个臂上的叶片构件在其表面上形成有一个与由正的流体压力驱动的真空发生器连接的表面，从而选择性地向凹槽施加真空以真空吸附晶片。 叶片构件真空吸附水下的晶片，将其从水中取出，并将其沉积在抛光系统的基座上。 旋转圆盘传送带上的几个晶片头中的一个从基座拾取晶片并将其运送到一个或多个抛光站用于抛光。 抛光完成后，晶片头将晶片重新沉积在基座上。 刀片构件真空吸盘并将其从基座移回到充满水的桶中的同一盒或另一盒。

    Method of making electrostatic chuck with conformal insulator film
    22.
    发明授权
    Method of making electrostatic chuck with conformal insulator film 失效
    用保形绝缘膜制作静电卡盘的方法

    公开(公告)号：US5753132A

    公开(公告)日：1998-05-19

    申请号：US725482

    申请日：1996-10-04

    Applicant: Shamouil Shamouilian ,  Sasson Somekh ,  Hyman J. Levinstein ,  Manoocher Birang ,  Semyon Sherstinsky ,  John F. Cameron

    Inventor： Shamouil Shamouilian ,  Sasson Somekh ,  Hyman J. Levinstein ,  Manoocher Birang ,  Semyon Sherstinsky ,  John F. Cameron

    IPC: B23Q3/15 ,  H01L21/683 ,  H02N13/00 ,  B44C1/22

    CPC classification number: H01L21/6831 ,  H01L21/6833 ,  H02N13/00

    Abstract: A process for fabricating an electrostatic chuck (20) comprising the steps of (c) forming a base (80) having an upper surface with cooling grooves (85) therein, the grooves sized and distributed for holding a coolant therein for cooling the base; and (d) pressure conforming an electrical insulator layer (45) to the grooves on the base by the steps of (i) placing the base into a pressure forming apparatus (25) and applying an electrical insulator layer over the grooves in the base; and (ii) applying a sufficiently high pressure onto the insulator layer to pressure conform the insulator layer to the grooves to form a substantially continuous layer of electrical insulator conformal to the grooves on the base.

    Abstract translation: 一种用于制造静电卡盘（20）的方法，包括以下步骤：（c）形成具有上表面的基部（80），其中具有冷却槽（85），所述凹槽的尺寸和分布用于将冷却剂保持在其中用于冷却基座; 和（d）通过以下步骤将电绝缘体层（45）施加到基底上的凹槽上：（i）将基底放置在压力成形设备（25）中并将电绝缘体层施加在基底中的凹槽上; 和（ii）将足够高的压力施加到绝缘体层上以使绝缘体层压到沟槽上，以形成与基底上的凹槽保形的基本上连续的电绝缘层。

    Apparatus for cleaning a shield in a physical vapor deposition chamber
    23.
    发明授权
    Apparatus for cleaning a shield in a physical vapor deposition chamber 失效
    用于清洁物理气相沉积室中的屏蔽的装置

    公开(公告)号：US5294320A

    公开(公告)日：1994-03-15

    申请号：US878938

    申请日：1992-05-05

    Applicant: Sasson Somekh ,  Dan Maydan

    Inventor： Sasson Somekh ,  Dan Maydan

    IPC: C23C14/22 ,  C23C14/56 ,  C23C14/34

    CPC classification number: H01J37/32862 ,  C23C14/22 ,  C23C14/564

    Abstract: In a method for in situ cleaning a shield bearing of excess target material deposited in a physical vapor deposition chamber, during a cleaning cycle, a vacuum is created in the physical vapor deposition chamber. A gas mixture which includes a reactive gas is introduced into the physical vapor deposition chamber. The reactive gas is activated by plasma discharge. During the cleaning, the gas mixture is continuously removed from the vapor deposition chamber along with reaction products.

    Abstract translation: 在用于原位清洁沉积在物理气相沉积室中的过量目标材料的屏蔽轴承的方法中，在清洁循环期间，在物理气相沉积室中产生真空。 将包括反应气体的气体混合物引入物理气相沉积室。 反应气体通过等离子体放电激活。 在清洁过程中，气体混合物与反应产物一起从气相沉积室中连续除去。

    Variable thickness self-aligned photoresist process
    24.
    发明授权
    Variable thickness self-aligned photoresist process 失效
    可变厚度自对准光刻胶工艺

    公开(公告)号：US4231811A

    公开(公告)日：1980-11-04

    申请号：US75095

    申请日：1979-09-13

    Applicant: Sasson Somekh ,  C. Norman Ahlquist

    Inventor： Sasson Somekh ,  C. Norman Ahlquist

    IPC: H01L21/027 ,  H01L21/266 ,  H01L21/336 ,  H01L21/26

    CPC classification number: H01L29/66575 ,  H01L21/0274 ,  H01L21/0277 ,  H01L21/266 ,  Y10S148/10 ,  Y10S148/137 ,  Y10S148/141 ,  Y10S438/948

    Abstract: A process for forming with a single masking step regions of different thicknesses in a photo-sensitive layer is disclosed. A masking member or reticle includes opaque and transparent areas and areas with a grating. The pitch of the periodic grating is of a lesser dimension than can be resolved by the masking projection apparatus. The photo-sensitive region illuminated by the grating receives uniform illumination at an intermediate intensity, thereby providing, after developing, a layer with regions of intermediate thickness.

    Abstract translation: 公开了一种在光敏层中用不同厚度的单个掩模步骤形成区域的方法。 掩模构件或掩模版包括不透明区域和具有光栅的区域。 周期光栅的间距比由掩模投影装置可以解析的尺寸小。 由光栅照射的光敏区域以中等强度接收均匀的照明，从而在显影之后提供具有中等厚度的区域的层。

    Method of forming a damascene structure with integrated planar dielectric layers
    26.
    发明授权
    Method of forming a damascene structure with integrated planar dielectric layers 有权
    用集成平面介质层形成镶嵌结构的方法

    公开(公告)号：US07229907B2

    公开(公告)日：2007-06-12

    申请号：US10942302

    申请日：2004-09-15

    Applicant: Tom Wu ,  Sasson Somekh ,  Chien Chiang

    Inventor： Tom Wu ,  Sasson Somekh ,  Chien Chiang

    IPC: H01L21/4763

    CPC classification number: H01L21/7684 ,  C25D3/02 ,  C25D3/38 ,  C25D5/22 ,  C25D5/34 ,  C25D7/123 ,  C25D17/001 ,  H01L21/3212 ,  H01L21/32125

    Abstract: Methods are provided for forming a circuit component on a workpiece substrate. The methods comprise the steps of depositing a dielectric material over the substrate; etching a pattern through the dielectric material to expose a portion of the substrate; depositing a barrier metal over the dielectric material and the exposed portion of the substrate; depositing a conductive metal over the barrier metal, the deposited conductive metal having a thickness sufficient to fill the etched pattern; planarizing the conductive metal to form a planar metal layer; and polishing the metal layer and the barrier metal in a single polishing step using an abrasive-free polish until the dielectric material surrounding the pattern is exposed.

    Abstract translation: 提供了用于在工件基板上形成电路部件的方法。 该方法包括以下步骤：在衬底上沉积电介质材料; 蚀刻通过介电材料的图案以暴露基底的一部分; 在介电材料和基板的暴露部分上沉积阻挡金属; 在阻挡金属上沉积导电金属，沉积的导电金属具有足以填充蚀刻图案的厚度; 平面化导电金属以形成平坦的金属层; 并且在单次抛光步骤中使用无研磨抛光剂抛光金属层和阻挡金属，直到暴露图案周围的电介质材料。

    Method of forming a damascene structure with integrated planar dielectric layers
    27.
    发明申请
    Method of forming a damascene structure with integrated planar dielectric layers 有权
    用集成平面介质层形成镶嵌结构的方法

    公开(公告)号：US20060057829A1

    公开(公告)日：2006-03-16

    申请号：US10942302

    申请日：2004-09-15

    Applicant: Tom Wu ,  Sasson Somekh ,  Chien Chiang

    Inventor： Tom Wu ,  Sasson Somekh ,  Chien Chiang

    IPC: H01L21/44

    CPC classification number: H01L21/7684 ,  C25D3/02 ,  C25D3/38 ,  C25D5/22 ,  C25D5/34 ,  C25D7/123 ,  C25D17/001 ,  H01L21/3212 ,  H01L21/32125

    Abstract: Methods are provided for forming a circuit component on a workpiece substrate. The methods comprise the steps of depositing a dielectric material over the substrate; etching a pattern through the dielectric material to expose a portion of the substrate; depositing a barrier metal over the dielectric material and the exposed portion of the substrate; depositing a conductive metal over the barrier metal, the deposited conductive metal having a thickness sufficient to fill the etched pattern; planarizing the conductive metal to form a planar metal layer; and polishing the metal layer and the barrier metal in a single polishing step using an abrasive-free polish until the dielectric material surrounding the pattern is exposed.

    Abstract translation: 提供了用于在工件基板上形成电路部件的方法。 该方法包括以下步骤：在衬底上沉积电介质材料; 蚀刻通过介电材料的图案以暴露基底的一部分; 在介电材料和基板的暴露部分上沉积阻挡金属; 在阻挡金属上沉积导电金属，沉积的导电金属具有足以填充蚀刻图案的厚度; 平面化导电金属以形成平坦的金属层; 并且在单次抛光步骤中使用无研磨抛光剂抛光金属层和阻挡金属，直到暴露图案周围的电介质材料。

    Carrier head with a substrate detection mechanism for a chemical mechanical polishing system
    29.
    发明授权
    Carrier head with a substrate detection mechanism for a chemical mechanical polishing system 有权

    公开(公告)号：US06343973B1

    公开(公告)日：2002-02-05

    申请号：US09595500

    申请日：2000-06-16

    Applicant: Sasson Somekh

    Inventor： Sasson Somekh

    IPC: B24B4900

    CPC classification number: B24B37/30 ,  B24B37/0053

    Abstract: A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.

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