摘要:
Embodiments of this invention relate to a method for manufacturing isolation structures with different depths in a monolithically integrated semiconductor electronic device. An inventive method according to an embodiment of the invention comprises a first step of defining active areas on a semiconductor material substrate, a second step of forming isolation structures by realising trenches in said substrate and then filling them with field oxide, a third step of defining lithographically at least a first device area, and a fourth step of realising a digging in the substrate and in the field oxide of said first device area.
摘要:
A method is described for manufacturing non-volatile memory cells on a semiconductive substrate having active areas bounded by portions of an insulating layer. A thin layer of tunnel oxide is formed and a first layer of conductive material is then deposited. A plurality of floating gate regions are defined by forming stripes of shielding material only above pairs of alternated active areas. Spacers of a selective material are defined with respect to the shielding material and of small width at will in the shelter of the side walls of the stripes thus defined. A shielding material is also deposited on the active areas which lacked it. The formation of the floating gate is completed by leaving the definition of the distance between the floating gate regions to the spacers.
摘要:
A method of manufacturing an integrated semiconductor device having at least one non-volatile floating gate memory cell and at least one logic transistor. The method includes growing a first gate oxide layer over a silicon substrate, depositing a first polysilicon layer over the first gate oxide layer, selectively etching and removing the first polysilicon layer in order to define the floating gate of the memory cell, introducing dopant in order to obtain source and drain regions of the memory cell, depositing a dielectric layer, selectively etching and removing the dielectric layer and the first polysilicon layer in a region wherein the logic transistor will be formed, depositing a second polysilicon layer, selectively etching and removing the second polysilicon layer in order to define the gate of the logic transistor and the control gate of the memory cell. Between selectively etching the dielectric and depositing a second polysilicon layer, a first sub-step of removing the first gate oxide layer in the region for the logic transistor, and a second sub-step of growing a second oxide gate layer over the region, the second gate oxide layer having a different thickness than the first gate oxide layer.
摘要:
A currency note includes an identification and/or authentication element including an integrated circuit. The integrated circuit can store, securely in electronic form and accessible from outside, such information as: the value, serial number, issuer, and date of issuance.
摘要:
A method of forming high-stability metallic contacts in an integrated circuit with one or more metallized layers wherein, after a preliminary step of providing contact holes in a layer of dielectric material: a prebarrier layer of Ti or TiN is formed overall; a layer of tungsten is formed by chemical vapor deposition so as to coat the bases and the walls of the contact holes uniformly; aluminum or an alloy thereof is sputter-deposited, under high-temperature low-flux conditions, to fill the contact holes; and patterning the aluminum and tungsten layers to form metallic interconnections of predetermined geometry.
摘要:
The present invention concerns an electrically programmable and erasable non-volatile memory cell having a traditional structure but being inverted in the conductivity type of the component elements and lacking the second source diffusion.
摘要:
The microtips of charge emitting material, which define the cathode of the flat FED screen and face the grid of the screen, are tubular and have portions with a small radius of curvature. The microtips are obtained by forming openings in the dielectric layer separating the cathode connection layer from the grid layer, depositing a conducting material layer to cover the walls of the openings, and anisotropically etching the layer of conducting material to form inwardly-inclined surfaces with emitting tips. Subsequently, the portions of the dielectric layer surrounding the microtips are removed.
摘要:
A pixel emission current limiting resistance is realized by forming a stack of alternately doped amorphous or polycrystalline silicon layers over the cathodic conductors of a FED driving matrix. The stack of amorphous or polycrystalline silicon layers doped alternately n and p provides at least a reversely biased n/p junction having a leakage current that matches the required level of pixel emission current. The reversely biased junction constitutes a nonlinear series resistance that is quite effective in limiting the emission current through any one of the microtips that form an individually excitable pixel and which are formed on the uppermost layer of the stack.
摘要:
A programming voltage is supplied to a control gate of a non-volatile memory cell via a control gate line. A supply voltage is coupled to a first plate of a capacitor and a reference voltage is coupled to a second plate of the capacitor. The supply voltage is then uncoupled from the first plate and the reference voltage is uncoupled from the second plate. Next, the reference voltage is coupled to the first plate to generate the programming voltage on the second plate.
摘要:
A process including the steps of forming a gate oxide layer on a semiconductor substrate; masking the gate oxide layer with a nitride mask forming openings in the gate oxide layer using the nitride mask; and forming, at the openings, tunnel oxide regions of a thickness smaller than the thickness of the gate oxide layer. The nitride mask presents a thickness smaller than the width of the openings to improve etching of the gate oxide layer and subsequent washing. The mask also protects the covered layers when etching the gate oxide and growing the tunnel oxide regions, and is removed easily without damaging the exposed layers.