MOTION DETECTION USING CAPACITOR HAVING DIFFERENT WORK FUNCTION MATERIALS
    21.
    发明申请
    MOTION DETECTION USING CAPACITOR HAVING DIFFERENT WORK FUNCTION MATERIALS 有权
    使用具有不同工作功能材料的电容器的运动检测

    公开(公告)号:US20110219876A1

    公开(公告)日:2011-09-15

    申请号:US12720813

    申请日:2010-03-10

    IPC分类号: G01P15/125

    摘要: An apparatus for detecting mechanical displacement in a micro-electromechanical system includes a capacitor having first and second plates spaced from one another, the first and second plates having different work functions and being electrically connected with each other. The capacitor plates are movable with respect to one another such that a spacing between the plates changes in response to a force. A current through the capacitor represents a rate of change in the spacing between the plates at a given time.

    摘要翻译: 一种用于检测微机电系统中的机械位移的装置包括具有彼此间隔开的第一和第二板的电容器,所述第一和第二板具有不同的功函数并且彼此电连接。 电容器板可以相对于彼此移动,使得板之间的间隔响应于力而变化。 通过电容器的电流表示给定时间间板间距的变化率。

    ELECTRICAL FUSE AND RELATED APPLICATIONS
    22.
    发明申请
    ELECTRICAL FUSE AND RELATED APPLICATIONS 有权
    电气保险丝及相关应用

    公开(公告)号:US20100244144A1

    公开(公告)日:2010-09-30

    申请号:US12731325

    申请日:2010-03-25

    IPC分类号: H01L23/62 H01L27/06

    摘要: In various embodiments, the fuse is formed from silicide and on top of a fin of a fin structure. Because the fuse is formed on top of a fin, its width takes the width of the fin, which is very thin. Depending on implementations, the fuse is also formed using planar technology and includes a thin width. Because the width of the fuse is relatively thin, a predetermined current can reliably cause the fuse to be opened. Further, the fuse can be used with a transistor to form a memory cell used in memory arrays, and the transistor utilizes FinFET technology.

    摘要翻译: 在各种实施例中,熔丝由硅化物形成,并且在翅片结构的翅片的顶部上形成。 因为熔丝形成在翅片的顶部,所以它的宽度取得了非常薄的翅片的宽度。 根据实施方案,保险丝也使用平面技术形成并且包括薄的宽度。 因为保险丝的宽度较薄,所以能够可靠地使保险丝断开。 此外,熔丝可以与晶体管一起使用以形成用于存储器阵列的存储单元,并且晶体管利用FinFET技术。

    3D-STACKED BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MAKING THE SAME
    23.
    发明申请
    3D-STACKED BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MAKING THE SAME 有权
    3D堆叠式背光照明图像传感器及其制作方法

    公开(公告)号:US20140077057A1

    公开(公告)日:2014-03-20

    申请号:US13616850

    申请日:2012-09-14

    IPC分类号: H01L27/146 H01L31/18

    摘要: A stacked image sensor and method for making the same are provided. The stacked image sensor includes an upper chip with a pixel array thereon. The second chip includes a plurality of column circuits and row circuits associated with the columns and rows of the pixel array and disposed in respective column circuit and row circuit regions that are arranged in multiple groups. Inter-chip bonding pads are formed on each of the chips. The inter-chip bonding pads on the second chip are arranged linearly and are contained within the column circuit regions and row circuit regions in one embodiment. In other embodiments, the inter-chip bonding pads are staggered with respect to each other. In some embodiments, the rows and columns of the pixel array include multiple signal lines and the corresponding column circuit regions and row circuit regions also include multiple inter-chip bonding pads.

    摘要翻译: 提供一种堆叠式图像传感器及其制造方法。 堆叠图像传感器包括其上具有像素阵列的上部芯片。 第二芯片包括与像素阵列的列和行相关联的多个列电路和行电路,并且被布置在多个组中的各个列电路和行电路区域中。 在每个芯片上形成芯片间接合焊盘。 在一个实施例中,第二芯片上的芯片间接合焊盘被线性布置并且被包含在列电路区域和行电路区域内。 在其他实施例中,芯片间接合焊盘相对于彼此交错。 在一些实施例中,像素阵列的行和列包括多个信号线,并且相应的列电路区域和行电路区域还包括多个芯片间接合焊盘。

    THROUGH CHIP COUPLING FOR SIGNAL TRANSPORT
    25.
    发明申请
    THROUGH CHIP COUPLING FOR SIGNAL TRANSPORT 有权
    通过芯片耦合进行信号传输

    公开(公告)号:US20120122395A1

    公开(公告)日:2012-05-17

    申请号:US12946072

    申请日:2010-11-15

    IPC分类号: H04B5/00

    CPC分类号: H04B5/0081

    摘要: Through-chip coupling is utilized for signal transport, where an interface is formed between a first coil on a first integrated circuit (IC) chip and a second coil on a second IC chip. The first coil is coupled to an antenna. The second coil is coupled to an amplifier circuit. The second coil is not in direct contact with the first coil. The first coil and the second coil communicatively transmit signals between the antenna and the first amplifier circuit.

    摘要翻译: 芯片耦合用于信号传输,其中在第一集成电路(IC)芯片上的第一线圈和第二IC芯片上的第二线圈之间形成接口。 第一线圈耦合到天线。 第二线圈耦合到放大器电路。 第二线圈不与第一线圈直接接触。 第一线圈和第二线圈在天线和第一放大器电路之间通信地传送信号。

    BALANCED TRANSFORMER STRUCTURE
    26.
    发明申请
    BALANCED TRANSFORMER STRUCTURE 审中-公开
    平衡变压器结构

    公开(公告)号:US20120092121A1

    公开(公告)日:2012-04-19

    申请号:US12974080

    申请日:2010-12-21

    IPC分类号: H01F27/28

    摘要: A multi-chip electronic device includes a first winding having a first port (P+) and a second port (P−). The first winding is formed in a metal layer of a first chip. The device further includes a second winding having a third (S+) and a fourth port (S−). The second winding is formed in a metal layer of a second chip. A center tap of the second winding is connected to a reference potential.

    摘要翻译: 多芯片电子设备包括具有第一端口(P +)和第二端口(P-)的第一绕组。 第一绕组形成在第一芯片的金属层中。 该装置还包括具有第三(S +)和第四端口(S)的第二绕组。 第二绕组形成在第二芯片的金属层中。 第二绕组的中心抽头连接到参考电位。

    JUNCTION VARACTOR FOR ESD PROTECTION OF RF CIRCUITS
    27.
    发明申请
    JUNCTION VARACTOR FOR ESD PROTECTION OF RF CIRCUITS 有权
    用于ESD保护射频电路的连接变压器

    公开(公告)号:US20110233678A1

    公开(公告)日:2011-09-29

    申请号:US12731562

    申请日:2010-03-25

    IPC分类号: H01L29/93 H01L27/06 H01L23/60

    摘要: An ESD protection device includes a first well of a first semiconductor type disposed in a substrate of a second semiconductor type forming a first diode. A second well of the second semiconductor type is formed in the substrate to form a second diode with the first well. A first plurality of doped regions of the first semiconductor type are formed in an upper surface of the first well. A second plurality of doped regions of the second semiconductor type are formed in the upper surface of the first well forming a third diode with the first well. A plurality of STI regions are formed in the upper surface of the first well. Each STI region is disposed between a doped region of the first and second semiconductor types. The third diode provides a current bypass when an ESD voltage spike is received at one of the first or second plurality of doped regions.

    摘要翻译: ESD保护装置包括设置在形成第一二极管的第二半导体类型的衬底中的第一半导体类型的第一阱。 第二半导体类型的第二阱形成在衬底中以与第一阱形成第二二极管。 第一半导体类型的第一多个掺杂区域形成在第一阱的上表面中。 第二半导体类型的第二多个掺杂区域形成在第一阱的上表面中,其与第一阱形成第三二极管。 多个STI区域形成在第一阱的上表面中。 每个STI区域设置在第一和第二半导体类型的掺杂区域之间。 当在第一或第二多个掺杂区域中的一个处接收ESD电压尖峰时,第三二极管提供电流旁路。

    ESD PROTECTION CIRCUIT FOR RFID TAG
    28.
    发明申请
    ESD PROTECTION CIRCUIT FOR RFID TAG 有权
    RFID标签的ESD保护电路

    公开(公告)号:US20110186909A1

    公开(公告)日:2011-08-04

    申请号:US12759743

    申请日:2010-04-14

    IPC分类号: H01L29/73

    CPC分类号: H01L29/73

    摘要: An electrostatic discharge (ESD) protection circuit structure includes a dual directional silicon controlled rectifier (SCR) formed in a substrate. The SCR includes first and second P-wells laterally interposed by an N-well. A deep N-well is disposed underneath the P-wells and the N-well. First and second N-type regions are disposed in the first and second P-wells, respectively, and are coupled to a pair of pads. First and second P-type regions are disposed in the first and second P-wells, respectively, are coupled to the pads, and are disposed closer to the N-well than the first and second N-type regions, respectively.

    摘要翻译: 静电放电(ESD)保护电路结构包括形成在衬底中的双向可控硅整流器(SCR)。 SCR包括由N阱横向插入的第一和第二P阱。 深井N井位于P井和N井的下面。 第一和第二N型区域分别设置在第一和第二P阱中,并且耦合到一对焊盘。 第一和第二P型区域分别设置在第一和第二P阱中,分别耦合到焊盘,并且分别设置成比第一和第二N型区域更靠近N阱。

    CAPACITOR COUPLED QUADRATURE VOLTAGE CONTROLLED OSCILLATOR
    30.
    发明申请
    CAPACITOR COUPLED QUADRATURE VOLTAGE CONTROLLED OSCILLATOR 有权
    电容耦合电压控制振荡器

    公开(公告)号:US20120092077A1

    公开(公告)日:2012-04-19

    申请号:US12907294

    申请日:2010-10-19

    IPC分类号: H03K3/353

    摘要: A quadrature oscillator includes a first oscillator having a first second-order harmonic node, a second oscillator having a second second-order harmonic node, and at least one capacitor coupling the first second-order harmonic node and the second second-order harmonic node. The first oscillator is configured to supply an in-phase signal and the second oscillator is configured to supply a quadrature signal.

    摘要翻译: 正交振荡器包括具有第一二次谐波节点的第一振荡器,具有第二二次谐波节点的第二振荡器和耦合第一二次谐波节点和第二二次谐波节点的至少一个电容器。 第一振荡器被配置为提供同相信号,并且第二振荡器被配置为提供正交信号。