公开(公告)号：US07863640B2

公开(公告)日：2011-01-04

申请号：US11710436

申请日：2007-02-26

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L23/34 ,  H05K1/14

CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。

公开(公告)号：US20100124071A1

公开(公告)日：2010-05-20

申请号：US12507356

申请日：2009-07-22

申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin ,  Shan Gao ,  Jong Woon Kim

发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin ,  Shan Gao ,  Jong Woon Kim

IPC分类号： F21V29/00 ,  F28F13/12

CPC分类号： F21V29/63 ,  B61D29/00 ,  F21S41/141 ,  F21S41/143 ,  F21S45/43 ,  F21V29/02 ,  F21W2102/00 ,  F21W2107/10 ,  F21Y2115/10 ,  F28F13/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling device for a light emitting device package of a vibration generating machine, includes: a heat releasing plate provided at one side of the light emitting device package; a vibrator disposed to face the heat releasing plate and vibrating to generate an air flow according to vibration of the vibration generating machine; and a vibration transfer unit configured to connect the vibrator and the heat releasing plate to allow the air flow generated from the vibrator to be transferred to the heat releasing plate so as to be cooled.

摘要翻译： 一种用于振动发生机的发光器件封装的冷却装置，包括：设置在发光器件封装的一侧的散热板; 振动器，其设置为面对所述散热板并振动以根据所述振动发生机的振动产生气流; 以及振动传递单元，其构造成将所述振动器和所述散热板连接以允许从所述振动器产生的气流被传递到所述散热板以被冷却。

公开(公告)号：US20090267505A1

公开(公告)日：2009-10-29

申请号：US12213241

申请日：2008-06-17

申请人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

IPC分类号： H01J1/62 ,  H01L31/00 ,  H01J9/02

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48227

摘要： The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

摘要翻译： 本发明涉及一种发光器件封装及其制造方法。 提供了一种包括金属芯的发光器件封装; 形成在金属芯上的绝缘层; 形成在所述绝缘层上的金属层; 通过去除金属层和绝缘层的部分以暴露金属芯的顶表面而形成的第一腔; 以及直接安装在第一腔中的金属芯的顶表面上的发光器件，并且还提供了制造发光器件封装的方法。

公开(公告)号：US20070246715A1

公开(公告)日：2007-10-25

申请号：US11783948

申请日：2007-04-13

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L33/00

CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

摘要翻译： 使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。 根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。

公开(公告)号：US20070201213A1

公开(公告)日：2007-08-30

申请号：US11710436

申请日：2007-02-26

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H05K1/14

CPC分类号： H01L33/486 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2924/01322 ,  H05K1/053 ,  H05K3/0052 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2924/00

摘要： A circuit board for a light emitting diode package improved in heat radiation efficiency and a manufacturing method thereof. In a simple manufacturing process, insulating layers are formed by anodizing on a portion of a thermally conductive board body and plated with a conductive material. In the light emitting diode package, a board body is made of a thermally conductive metal. Insulating oxidation layers are formed at a pair of opposing edges of the board body. First conductive patterns are formed on the insulating oxidation layers, respectively. Also, second conductive patterns are formed in contact with the board body at a predetermined distance from the first conductive patterns, respectively. The light emitting diode package ensures heat generated from the light emitting diode to radiate faster and more effectively. Additionally, the insulating layers are formed integral with the board body by anodizing, thus enhancing productivity and durance.

摘要翻译： 一种用于散热效率提高的发光二极管封装的电路板及其制造方法。 在简单的制造工艺中，通过在导热板本体的一部分上阳极氧化并且电镀导电材料来形成绝缘层。 在发光二极管封装中，板体由导热金属制成。 绝缘氧化层形成在板体的一对相对的边缘处。 分别在绝缘氧化层上形成第一导电图案。 此外，第二导电图案分别形成为与板体相距预定距离与第一导电图案接触。 发光二极管封装确保了发光二极管产生的热量更快更有效地辐射。 此外，绝缘层通过阳极氧化与板体形成一体，从而提高生产率和耐久性。

公开(公告)号：US09231167B2

公开(公告)日：2016-01-05

申请号：US14555186

申请日：2014-11-26

申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC分类号： H01L29/207 ,  H01L33/48 ,  H05K3/28 ,  H01L33/62 ,  H01L33/60

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device. A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

摘要翻译： 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

公开(公告)号：US08304279B2

公开(公告)日：2012-11-06

申请号：US13220258

申请日：2011-08-29

申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC分类号： H01L21/00

CPC分类号： H01L33/483 ,  H01L25/0753 ,  H01L33/58 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package having an anodized insulation layer which increases heat radiation effect to prolong the lifetime LEDs and maintains high luminance and high output, and a method therefor. The LED package includes an Al substrate having a reflecting region and a light source mounted on the substrate and connected to patterned electrodes. The package also includes an anodized insulation layer formed between the patterned electrodes and the substrate and a lens covering over the light source of the substrate. The Al substrate provides superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED.

摘要翻译： 一种具有阳极氧化绝缘层的LED封装，其方法为增加散热效果以延长寿命LED并保持高亮度和高输出。 LED封装包括具有反射区域的Al衬底和安装在衬底上并连接到图案化电极的光源。 封装还包括形成在图案化电极和衬底之间的阳极化绝缘层和覆盖在衬底的光源上的透镜。 Al衬底提供了LED的优异的散热效果，从而显着增加了LED的寿命和发光效率。

公开(公告)号：US08299692B2

公开(公告)日：2012-10-30

申请号：US12213241

申请日：2008-06-17

申请人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Hyung Jin Jeon ,  Sang Hyun Shin

IPC分类号： H01J1/62 ,  H01J9/02 ,  H01L31/00

CPC分类号： H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48227

摘要： The present invention relates to a light emitting device package and a method of manufacturing the same. There is provided a light emitting device package including a metal core; an insulating layer formed on the metal core; a metal layer formed on the insulating layer; a first cavity formed by removing parts of the metal layer and the insulating layer to expose a top surface of the metal core; and a light emitting device directly mounted on the top surface of the metal core in the first cavity and further there is provided a method of manufacturing the light emitting device package.

摘要翻译： 本发明涉及一种发光器件封装及其制造方法。 提供了一种包括金属芯的发光器件封装; 形成在金属芯上的绝缘层; 形成在所述绝缘层上的金属层; 通过去除金属层和绝缘层的部分以暴露金属芯的顶表面而形成的第一腔; 以及直接安装在第一腔中的金属芯的顶表面上的发光器件，并且还提供了制造发光器件封装的方法。

公开(公告)号：US20110260198A1

公开(公告)日：2011-10-27

申请号：US13177276

申请日：2011-07-06

申请人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

发明人： Young Ki Lee ,  Seog Moon Choi ,  Sang Hyun Shin

IPC分类号： H01L33/60

CPC分类号： H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H05K3/28 ,  H05K2203/0315 ,  H05K2203/0542

摘要： An insulation structure for high temperature conditions and a manufacturing method thereof. In the insulation structure, a substrate has a conductive pattern formed on at least one surface thereof for electrical connection of a device.A metal oxide layer pattern is formed on a predetermined portion of the conductive pattern by anodization, the metal oxide layer pattern made of one selected from a group consisting of Al, Ti and Mg.

摘要翻译： 一种用于高温条件的绝缘结构及其制造方法。 在绝缘结构中，衬底具有形成在其至少一个表面上的用于电连接器件的导电图案。 通过阳极氧化在导电图案的预定部分上形成金属氧化物层图案，金属氧化物层图案由选自Al，Ti和Mg的一种形成。

公开(公告)号：US07547923B2

公开(公告)日：2009-06-16

申请号：US11783948

申请日：2007-04-13

申请人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

发明人： Sang Hyun Shin ,  Seog Moon Choi ,  Young Ki Lee

IPC分类号： H01L29/207

CPC分类号： H01L33/483 ,  H01L33/60 ,  H01L33/641 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A high luminance and high output LED package using an LED as a light source and a fabrication method thereof. The LED package includes an Al substrate with a recessed multi-stepped reflecting surface formed therein and a light source composed of LEDs mounted on the reflecting surface and electrically connected to patterned electrodes. The LED package also includes anodized insulation layers formed between the patterned electrodes and the substrate, and an encapsulant covering over the light source of the substrate. The LED package further includes an Al heat radiator formed under the LEDs to enhance heat radiation capacity. According to the present invention, the substrate is made of Al material and anodized to form insulation layers thereon, allowing superior heat radiation effect of the LED, thereby significantly increasing the lifetime and light emission efficiency of the LED package.

摘要翻译： 使用LED作为光源的高亮度和高输出LED封装及其制造方法。 LED封装包括Al基板，其中形成有凹入的多阶反射表面，以及由安装在反射表面上并与图案化电极电连接的LED组成的光源。 LED封装还包括形成在图案化电极和衬底之间的阳极氧化绝缘层，以及覆盖在衬底的光源上的密封剂。 LED封装还包括形成在LED下面的Al散热器，以增强散热能力。 根据本发明，基板由Al材料制成并阳极氧化以在其上形成绝缘层，从而允许LED的良好的散热效果，从而显着提高LED封装的寿命和发光效率。