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70 条记录 (耗时 0.024 秒)

    Imaging sensor having microlenses of different radii of curvature
    21.
    发明申请
    Imaging sensor having microlenses of different radii of curvature 审中-公开
    具有不同曲率半径的微透镜的成像传感器

    公开(公告)号：US20080011936A1

    公开(公告)日：2008-01-17

    申请号：US11485676

    申请日：2006-07-14

    申请人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

    发明人： Chin-Chen Kuo ,  Wu-Chieh Liu ,  Hsiao-Wen Lee ,  Bii-Cheng Chang

    IPC分类号： H01L27/00

    CPC分类号： H01L27/14627 ,  H01L27/14603 ,  H01L27/14685

    摘要： The present invention provides an image sensor which comprises improved microlenses to cope with different optical requirements for oblique incident light or different components of light. In one embodiment, the image sensor comprises at least two microlenses having different radii of curvature. In another embodiment, the image sensor comprises at least one asymmetrical microlens.

    摘要翻译： 本发明提供了一种图像传感器，其包括改进的微透镜以应对对于倾斜入射光或不同光分量的不同光学要求。 在一个实施例中，图像传感器包括具有不同曲率半径的至少两个微透镜。 在另一个实施例中，图像传感器包括至少一个非对称微透镜。

    Wafer level image module
    22.
    发明申请
    Wafer level image module 有权
    晶圆级图像模块

    公开(公告)号：US20070070511A1

    公开(公告)日：2007-03-29

    申请号：US11528461

    申请日：2006-09-28

    申请人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

    发明人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

    IPC分类号： G02B21/02

    CPC分类号： H04N5/2254 ,  H04N5/2257

    摘要： A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.

    摘要翻译： 晶片级图像模块包括用于在接收光时输出电信号的光传感器，用于将入射光聚焦到光传感器上的透镜组以及设置在光传感器和透镜组之间的调节构件，用于控制照片之间的距离 传感器和透镜设置以补偿光传感器的聚焦偏移，以使透镜组能够以聚焦方式精确地将入射光聚焦到光传感器上，从而提供高图像质量。

    MEMS differential actuated nano probe and method for fabrication
    24.
    发明授权
    MEMS differential actuated nano probe and method for fabrication 失效
    MEMS微分致动纳米探针和制造方法

    公开(公告)号：US06995368B2

    公开(公告)日：2006-02-07

    申请号：US10795407

    申请日：2004-03-09

    申请人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Ming-Hung Chen

    发明人： Shih-Yi Wen ,  Hsiao-Wen Lee ,  Jui-Ping Weng ,  Ming-Hung Chen

    IPC分类号： G21K7/00

    CPC分类号： G01Q10/045 ,  G01Q70/10 ,  Y10S977/872

    摘要： A MEMS differential actuated nano probe includes four suspension beams arranged in parallel, a connecting base connecting to the suspension beams, a nano probe. Two of the suspension beams elongate due to thermal expansion to allow the deflection of the probe. By heating the suspension beams at different positions, the MEMS differential actuated nano probe can move in two directions with two degrees of freedom. The deflection of the MEMS differential actuated nano probe can be also achieved in piezoelectric or electrostatic way.

    摘要翻译： MEMS差分致动纳米探针包括平行布置的四个悬架梁，连接到悬架梁的连接底座，纳米探针。 悬挂梁中的两个由于热膨胀而伸长以允许探针的偏转。 通过将悬架梁加热到不同位置，MEMS微分致动纳米探针可以在两个方向上以两个自由度移动。 MEMS差分致动纳米探针的偏转也可以以压电或静电方式实现。

    LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING
    29.
    发明申请
    LIGHT EMITTING DIODE LIGHT BAR MODULE WITH ELECTRICAL CONNECTORS FORMED BY INJECTION MOLDING 有权
    带注射成型电气连接器的发光二极管灯模块

    公开(公告)号：US20120088397A1

    公开(公告)日：2012-04-12

    申请号：US12899999

    申请日：2010-10-07

    申请人： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    发明人： Hsiao-Wen Lee ,  Chih-Hsuan Sun ,  Wei-Yu Yeh

    IPC分类号： H01R43/24 ,  H01R43/18 ,  B29C45/14 ,  H01R13/00

    CPC分类号： B29C45/0001 ,  B29C45/14262 ,  B29C45/14311 ,  B29C45/14639 ,  B29K2705/02 ,  F21S4/20 ,  F21V23/06 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01R43/24 ,  Y10T29/53

    摘要： The present disclosure relates to methods for fabricating electrical connectors of a waterproof connector-heat sink assembly of a LED light bar module using injection molding. The methods include matching the coefficient of thermal expansion (CTE) of injection molding materials for the connectors and heat sinks. A heat sink and conductor pins are inserted into an injection mold and the injection molding materials are injected into the injection mold. An integrated connector-heat sink assembly is formed when the injection molding materials of the connectors form a waterproof seal with the heat sink when the injection molding materials solidify. Placement of the heat sink and conductor pins inside the injection mold is controlled to ensure that adhesive bonding between the injection molding materials and the heat sink is stronger than a maximum shear force.

    摘要翻译： 本公开涉及使用注射成型制造LED灯条模块的防水连接器 - 散热器组件的电连接器的方法。 这些方法包括匹配用于连接器和散热器的注塑材料的热膨胀系数（CTE）。 将散热器和导体销插入注射模具中，并将注射成型材料注入注射模具中。 当注射成型材料固化时，当连接器的注射成型材料与散热器形成防水密封时，形成集成连接器 - 散热器组件。 控制注射模具内的散热器和导体销的放置，以确保注射成型材料和散热片之间的粘合剂粘合力比最大剪切力更强。

    Image sensing device and manufacture method thereof
    30.
    发明授权
    Image sensing device and manufacture method thereof 有权
    图像感测装置及其制造方法

    公开(公告)号：US08143084B2

    公开(公告)日：2012-03-27

    申请号：US12356347

    申请日：2009-01-20

    申请人： Hsiao-Wen Lee

    发明人： Hsiao-Wen Lee

    IPC分类号： H01L21/00

    CPC分类号： H01L27/14685 ,  H01L27/14603 ,  H01L27/14621 ,  H01L27/14625 ,  H01L27/14627

    摘要： An image sensing device for receiving an incident light having an incident angle and photo signals formed thereby is provided. The image sensing device includes a micro prism and a micro lens for adjusting the incident angle and converging the incident light, respectively, a photo sensor for converting the photo signals into electronic signals, and an IC stacking layer for processing the electronic signals.

    摘要翻译： 提供一种用于接收具有入射角的入射光和由此形成的光信号的图像感测装置。 图像感测装置包括微棱镜和微透镜，用于分别调节入射角度并会聚入射光，用于将光信号转换成电子信号的光传感器，以及用于处理电子信号的IC堆叠层。