UNIVERSAL PHOTONIC ADAPTOR FOR COUPLING AN OPTICAL CONNECTOR TO AN OPTOELECTRONIC SUBSTRATE

    公开(公告)号:US20190384007A1

    公开(公告)日:2019-12-19

    申请号:US16555242

    申请日:2019-08-29

    Abstract: A photonic adaptor has a first face side to couple the photonic adaptor to an optical connector and a second face side to couple the photonic adaptor to an optoelectronic substrate. The photonic adaptor comprises a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor. The photonic adaptor comprises at least one alignment pin projecting out of at least the first face side of the photonic adaptor. The at least one alignment pin is configured to be inserted in the optical connector to align optical fibers of an optical cable to the optical fibers of the photonic adaptor.

    OPTICAL ASSEMBLIES, INTERCONNECTION SUBSTRATES AND METHODS FOR FORMING OPTICAL LINKS IN INTERCONNECTION SUBSTRATES

    公开(公告)号:US20190154931A1

    公开(公告)日:2019-05-23

    申请号:US16253024

    申请日:2019-01-21

    Abstract: Optical assemblies, interconnection substrates and methods of forming optical links are disclosed. In one embodiment, an optical assembly includes a first waveguide substrate, a second waveguide substrate, and an interconnection substrate having a first end face, a second end face, and a laser written waveguide. The first waveguide substrate is coupled to the first end face of the interconnection substrate, and the first waveguide is optically coupled to the laser written waveguide. The laser written waveguide terminates at the second end face of the interconnection substrate. The second waveguide substrate is coupled to the second end face of the interconnection substrate such that the second waveguide is optically coupled to the laser written waveguide at the second end face.

    Optical wire bond apparatus and methods employing laser-written waveguides

    公开(公告)号:US10162112B2

    公开(公告)日:2018-12-25

    申请号:US15168383

    申请日:2016-05-31

    Abstract: An optical wire bond apparatus for optically connecting an optical-electrical integrated circuit (OE-IC) to an optical-electrical printed circuit board (OE-PCB) is formed by laser writing cores in a flexible glass support member to define an array of optical waveguides. The support member has a bend section and the waveguides reside close to either a top or bottom surface of the support member at the bend section. The cores have a front-end portion that can be laser written after the front end of the support member is coarse-aligned to optical waveguide structures in the OE-PCB to obtain fine alignment. The support members can be formed from flexible glass sheets or by drawing a glass preform. A photonic assembly that includes the OE-IC and the OE-PCB optically connected using the optical wire bond apparatus is also disclosed.

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