-
公开(公告)号:US20170131140A1
公开(公告)日:2017-05-11
申请号:US15413745
申请日:2017-01-24
Applicant: Corning Optical Communications LLC
Inventor: Adam Joseph Fusco , Daniel Ohen Ricketts , James Scott Sutherland , Neil David Vance , Elvis Alberto Zambrano
CPC classification number: G01J1/30 , G01J1/0271 , G01J1/0425 , G01M11/30 , G01M11/33 , G02B6/3829 , G02B6/385 , G02B6/3874 , G02B6/4225 , H04B10/0795
Abstract: A non-contact method of measuring an insertion loss of a DUT connector is disclosed. The DUT connector has a first ferrule with a first optical fiber and a first end face. The method utilizes a reference connector having a second ferrule with a second optical fiber and a second end face. The method includes: axially aligning the first and second ferrules so that the first and second end faces are confronting and spaced apart to define a gap with an axial gap distance d; measuring values of the insertion loss between the first and second optical fibers for different gap distances d>0; and estimating a value for the insertion loss for a gap distance of d=0 based on the measured values of the insertion loss when d>0.
-
公开(公告)号:US11420293B2
公开(公告)日:2022-08-23
申请号:US16459041
申请日:2019-07-01
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor: Dana Craig Bookbinder , Boyang Lin , Garrett Andrew Piech , Steven Ross Sims , James Scott Sutherland , Michael Brian Webb , Elvis Alberto Zambrano
IPC: B23K26/384 , G02B6/38 , B23K26/362 , B23K26/00
Abstract: Methods of reshaping ferrules used in optical fiber cables assemblies are disclosed. The reshaping methods reduce a core-to-ferrule concentricity error (E), which improves coupling efficiency and optical transmission. The methods include measuring a true center of the ferrule, wherein the true center is based on an outer surface of the ferrule; and reshaping at least a portion of the ferrule to change the true center of the ferrule, wherein the reshaping includes enlarging a portion of the ferrule. A variety of reshaping techniques are also disclosed.
-
公开(公告)号:US10948658B2
公开(公告)日:2021-03-16
申请号:US15898967
申请日:2018-02-19
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor: Chenueh Abongwa Florian Lohse , James Scott Sutherland
Abstract: Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion.
-
公开(公告)号:US10684419B2
公开(公告)日:2020-06-16
申请号:US16253032
申请日:2019-01-21
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Abstract: Optical waveguide connector elements for optical coupling optical components of an optical assembly, such as the edge coupling of optical printed circuit boards. In one embodiment, a waveguide connector element includes a first end face and a second end face, a pre-existing optical waveguide within or on a surface of the waveguide connector element, and a laser written optical waveguide optically coupled to an end of the pre-existing optical waveguide and extending toward one of the first end face and the second end face.
-
25.
公开(公告)号:US20190384007A1
公开(公告)日:2019-12-19
申请号:US16555242
申请日:2019-08-29
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor: Andreas Matiss , James Scott Sutherland
Abstract: A photonic adaptor has a first face side to couple the photonic adaptor to an optical connector and a second face side to couple the photonic adaptor to an optoelectronic substrate. The photonic adaptor comprises a plurality of optical fibers being arranged between the first face side and the second face side of the photonic adaptor. The photonic adaptor comprises at least one alignment pin projecting out of at least the first face side of the photonic adaptor. The at least one alignment pin is configured to be inserted in the optical connector to align optical fibers of an optical cable to the optical fibers of the photonic adaptor.
-
公开(公告)号:US10336644B2
公开(公告)日:2019-07-02
申请号:US15602468
申请日:2017-05-23
Applicant: Corning Optical Communications LLC
Inventor: Dana Craig Bookbinder , Garrett Andrew Piech , James Scott Sutherland , Michael Brian Webb , Elvis Alberto Zambrano
Abstract: Methods of reshaping ferrules (20) used in optical fiber cables assemblies (170) are disclosed. The reshaping methods reduce a core-to-ferrule concentricity error (E), which improves coupling efficiency and optical transmission. The methods include measuring a distance (δ) and angular direction (θ) from a true center (30) of the ferrule to the core (46), wherein the true center (30) is based on an outer surface (26) of the ferrule. The methods also include reshaping at least a portion (26P) of the ferrule (20) to define a new true center (30′) of the ferrule (20) and reduce the distance (δ). A variety of reshaping techniques are also disclosed.
-
27.
公开(公告)号:US20190154931A1
公开(公告)日:2019-05-23
申请号:US16253024
申请日:2019-01-21
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor: Leonard Thomas Masters , Robert Adam Modavis , James Scott Sutherland
IPC: G02B6/42
Abstract: Optical assemblies, interconnection substrates and methods of forming optical links are disclosed. In one embodiment, an optical assembly includes a first waveguide substrate, a second waveguide substrate, and an interconnection substrate having a first end face, a second end face, and a laser written waveguide. The first waveguide substrate is coupled to the first end face of the interconnection substrate, and the first waveguide is optically coupled to the laser written waveguide. The laser written waveguide terminates at the second end face of the interconnection substrate. The second waveguide substrate is coupled to the second end face of the interconnection substrate such that the second waveguide is optically coupled to the laser written waveguide at the second end face.
-
公开(公告)号:US10162112B2
公开(公告)日:2018-12-25
申请号:US15168383
申请日:2016-05-31
Applicant: Corning Optical Communications LLC
Inventor: James Scott Sutherland
Abstract: An optical wire bond apparatus for optically connecting an optical-electrical integrated circuit (OE-IC) to an optical-electrical printed circuit board (OE-PCB) is formed by laser writing cores in a flexible glass support member to define an array of optical waveguides. The support member has a bend section and the waveguides reside close to either a top or bottom surface of the support member at the bend section. The cores have a front-end portion that can be laser written after the front end of the support member is coarse-aligned to optical waveguide structures in the OE-PCB to obtain fine alignment. The support members can be formed from flexible glass sheets or by drawing a glass preform. A photonic assembly that includes the OE-IC and the OE-PCB optically connected using the optical wire bond apparatus is also disclosed.
-
29.
公开(公告)号:US20180246279A1
公开(公告)日:2018-08-30
申请号:US15898967
申请日:2018-02-19
Applicant: CORNING OPTICAL COMMUNICATIONS LLC
Inventor: Chenueh Abongwa Florian Lohse , James Scott Sutherland
CPC classification number: G02B6/305 , G02B6/1228 , G02B6/13 , G02B6/3839 , G02B6/4204 , G02B6/4227 , G02B6/4249 , H05K1/0274 , H05K1/181 , H05K2201/10121
Abstract: Optical interconnection assemblies, glass interconnection substrates, and methods for making optical connections are disclosed. In one embodiment, an optical interconnection assembly includes a base substrate, a substrate optical waveguide coupled to the base substrate, the substrate optical waveguide having an end surface, an optical chip comprising an optical coupling surface, and a glass interconnection substrate. The glass interconnection substrate includes a first end optically coupled to the end surface of the substrate optical waveguide, a second end optically coupled to the optical coupling surface of the optical chip, and a curved portion disposed between the first end and the second end. The glass interconnection substrate further includes an optical waveguide at least partially positioned within the curved portion.
-
30.
公开(公告)号:US20170146751A1
公开(公告)日:2017-05-25
申请号:US15427074
申请日:2017-02-08
Applicant: Corning Optical Communications LLC
Inventor: James Scott Sutherland
CPC classification number: G02B6/4214 , C03B23/0006 , C03B23/023 , C03C23/0025 , G02B6/125 , G02B6/30 , G02B6/4204 , G02B6/4206 , G02B6/4249
Abstract: An optical interface device for optically connecting photonic devices to optical device along with methods of making. The method includes providing a glass support member that is either monolithic or laminated. A laser beam is used to write cores in the body of the support member. The support member includes a bend section and the cores generally follow the bend section and serve to define curved optical waveguides. The cores provide strong out-of-plane optical confinement, thereby allowing for strong bends and therefore a compact design for the optical interface device.
-
-
-
-
-
-
-
-
-