公开(公告)号：US10529696B2

公开(公告)日：2020-01-07

申请号：US15399729

申请日：2017-01-05

申请人： Cree, Inc.

发明人： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC分类号： H01L25/075 ,  H01L27/15 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/46 ,  H01L25/00 ,  H01L33/00 ,  H01L33/38 ,  H01L33/44

摘要： At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US20190355701A1

公开(公告)日：2019-11-21

申请号：US16525100

申请日：2019-07-29

申请人： Cree, Inc.

发明人： Troy Gould ,  Colin Kelly Blakely ,  Jesse Colin Reiherzer ,  Joseph G. Clark

IPC分类号： H01L25/075 ,  H01L33/58 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/60

摘要： Light emitting diode (LED) devices and methods. An example apparatus can include a substrate, one or more LEDs, light-transmissive encapsulation material, and a reflective material covering a portion of the encapsulation material to form a defined opening. The opening allows light emitted from an LED to pass through in a prescribed manner. In some embodiments, the apparatus can be subsequently treated to modify the surface having the opening. In other embodiments, the reflective material can be disposed on a lateral surface of the encapsulation material to reflect light in a desired direction.

公开(公告)号：US20190273070A1

公开(公告)日：2019-09-05

申请号：US16414162

申请日：2019-05-16

申请人： Cree, Inc.

发明人： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC分类号： H01L25/075 ,  H01L33/50 ,  H01L27/15 ,  H01L33/46 ,  H01L25/00 ,  H01L33/62 ,  H01L33/60 ,  H01L33/58

摘要： At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US20130322070A1

公开(公告)日：2013-12-05

申请号：US13713410

申请日：2012-12-13

申请人： CREE, INC.

发明人： Joseph G. Clark ,  Amber C. Abare ,  David T. Emerson ,  Jeremy S. Nevins ,  Raymond Rosado

IPC分类号： H01L33/58 ,  H01L33/50 ,  F21V7/00 ,  F21V21/00

CPC分类号： H01L33/58 ,  F21K9/233 ,  F21V7/00 ,  F21V21/00 ,  F21Y2105/18 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/50 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A first light emitter chip can mounted over at least a portion of the cathode, and a second light emitter chip can be wirebonded to at least a portion of the anode. Multiple light emitter chips can be disposed between the first and second light emitter chips.

摘要翻译： 公开了具有改进性能的光发射器封装，系统和方法。 在一个方面，光发射器封装可以包括可以包括阳极和阴极的底座。 第一光发射器芯片可以安装在阴极的至少一部分上，并且第二发光芯片可以被引线接合到阳极的至少一部分。 多个光发射器芯片可以设置在第一和第二发光器芯片之间。