公开(公告)号：US10910352B2

公开(公告)日：2021-02-02

申请号：US16414162

申请日：2019-05-16

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/46 ,  H01L25/00 ,  H01L33/38 ,  H01L33/44 ,  H01L33/00

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US20170294417A1

公开(公告)日：2017-10-12

申请号：US15399729

申请日：2017-01-05

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L25/00 ,  H01L27/15 ,  H01L33/50

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US09634197B2

公开(公告)日：2017-04-25

申请号：US13801743

申请日：2013-03-13

Applicant: Cree, Inc.

Inventor： Michael John Bergmann ,  Kevin Haberern ,  Alan Wellford Dillon

IPC: H01L29/18 ,  H01L33/50 ,  H01L33/60 ,  H01L23/00 ,  H01L33/22 ,  H01L33/00 ,  H01L33/40 ,  H01L33/62 ,  H01L33/64

Abstract: An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide multiple LED dies that are joined to a single carrier die. The multiple LED dies on the single carrier die are connected in series and/or in parallel by interconnection in the LED dies and/or in the single carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area. Related devices and fabrication methods are described.

公开(公告)号：US09496458B2

公开(公告)日：2016-11-15

申请号：US13790369

申请日：2013-03-08

Applicant: Cree, Inc.

Inventor： Matthew Donofrio ,  Michael Bergmann ,  Kevin Haberern ,  Kevin Schneider

IPC: H01L33/12 ,  H01L33/60 ,  H01L33/44 ,  H01L33/62

CPC classification number: H01L33/12 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0025 ,  H01L2933/0066 ,  H01L2924/00

Abstract: A light emitting device includes an epitaxial region, an insulating layer on the epitaxial region, a bond pad on the insulating layer, and a crack reducing feature in the insulating layer. The crack reducing feature is configured to reduce the propagation of cracks in the insulating layer to an outside surface of the insulating layer. Related methods are also disclosed.

Abstract translation: 发光器件包括外延区域，外延区域上的绝缘层，绝缘层上的接合焊盘以及绝缘层中的裂纹减少特征。 裂纹减少特征被配置为减小绝缘层中的裂纹到绝缘层的外表面的传播。 还公开了相关方法。

公开(公告)号：US08704240B2

公开(公告)日：2014-04-22

申请号：US13856928

申请日：2013-04-04

Applicant: Cree, Inc.

Inventor： David Todd Emerson ,  Kevin Haberern ,  Michael John Bergmann ,  David B. Slater, Jr. ,  Matthew Donofrio ,  John Edmond

IPC: H01L33/00

CPC classification number: H01L33/145 ,  H01L24/05 ,  H01L33/14 ,  H01L33/38 ,  H01L2224/49107 ,  H01L2933/0016

Abstract: A light emitting device includes a p-type semiconductor layer, an n-type semiconductor layer and an active region between the p-type semiconductor layer and the n-type semiconductor layer. A bond pad is provided on one of the p-type semiconductor layer or the n-type semiconductor layer, opposite the active region, the bond pad being electrically connected to the one of the p-type semiconductor layer or the n-type semiconductor layer. A conductive finger extends from and is electrically connected to the bond pad. A reduced conductivity region is provided in the light emitting device that is aligned with the conductive finger. A reflector may also be provided between the bond pad and the reduced conductivity region. A reduced conductivity region may also be provided in the light emitting device that is not aligned with the bond pad.

Abstract translation: 发光器件包括p型半导体层，n型半导体层和p型半导体层和n型半导体层之间的有源区。 在与有源区相对的p型半导体层或n型半导体层之一上设置接合焊盘，所述接合焊盘与p型半导体层或n型半导体层中的一者电连接 。 导电指状物从接合焊盘延伸并与其电连接。 在与导电指状物对准的发光器件中设置降低的导电性区域。 还可以在接合焊盘和减小的导电区域之间设置反射器。 还可以在不与接合焊盘对准的发光器件中提供降低的导电性区域。

公开(公告)号：US11387221B2

公开(公告)日：2022-07-12

申请号：US16950142

申请日：2020-11-17

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L25/00 ,  H01L27/15 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/38 ,  H01L33/44 ,  H01L33/00

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US11342313B2

公开(公告)日：2022-05-24

申请号：US16950142

申请日：2020-11-17

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L25/00 ,  H01L27/15 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/38 ,  H01L33/44 ,  H01L33/00

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US10529696B2

公开(公告)日：2020-01-07

申请号：US15399729

申请日：2017-01-05

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L27/15 ,  H01L33/50 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/46 ,  H01L25/00 ,  H01L33/00 ,  H01L33/38 ,  H01L33/44

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US20190273070A1

公开(公告)日：2019-09-05

申请号：US16414162

申请日：2019-05-16

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L33/50 ,  H01L27/15 ,  H01L33/46 ,  H01L25/00 ,  H01L33/62 ,  H01L33/60 ,  H01L33/58

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.

公开(公告)号：US20210074687A1

公开(公告)日：2021-03-11

申请号：US16950142

申请日：2020-11-17

Applicant: Cree, Inc.

Inventor： John Edmond ,  Matthew Donofrio ,  Jesse Reiherzer ,  Peter Scott Andrews ,  Joseph G. Clark ,  Kevin Haberern

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/50 ,  H01L27/15 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L25/00

Abstract: At least one array of LEDs (e.g., in a flip chip configuration) is supported by a substrate having a light extraction surface overlaid with at least one lumiphoric material. Light segregation elements registered with gaps between LEDs are configured to reduce interaction between emissions of different LEDs and/or lumiphoric material regions to reduce scattering and/or optical crosstalk, thereby preserving pixel-like resolution of the resulting emissions. Light segregation elements may be formed by mechanical sawing or etching to define grooves or recesses in a substrate, and filling the grooves or recesses with light-reflective or light-absorptive material. Light segregation elements external to a substrate may be defined by photolithographic patterning and etching of a sacrificial material, and/or by 3D printing.