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    Robot blade for handling of semiconductor substrate
    21.
    发明授权
    Robot blade for handling of semiconductor substrate 失效
    用于处理半导体衬底的机器人刀片

    公开(公告)号：US6024393A

    公开(公告)日：2000-02-15

    申请号：US740886

    申请日：1996-11-04

    申请人： Behzad Shamlou ,  Wen Chiang Tu ,  Xuyen Pham ,  Yu Chang ,  Daniel O. Clark ,  Shun Wu

    发明人： Behzad Shamlou ,  Wen Chiang Tu ,  Xuyen Pham ,  Yu Chang ,  Daniel O. Clark ,  Shun Wu

    IPC分类号： B25J15/06 ,  B65G49/07 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

    CPC分类号： H01L21/6838 ,  H01L21/68707 ,  Y10S294/907 ,  Y10S414/141

    摘要： The amount of particulate contamination produced due to rubbing between a semiconductor substrate and the robotic substrate handling blade has been greatly reduced by the use of specialized materials either as the principal material of construction for the semiconductor substrate handling blade, or as a coating upon the surface of the wafer handling blade. In particular, the specialized material must exhibit the desired stiffness at temperatures in excess of about 450.degree. C.; the specialized material must also have an abrasion resistant surface which does not produce particulates when rubbed against the semiconductor substrate. The abrasion resistant surface needs to be very smooth, having a surface finish of less than 1.0 micro inch, and preferably less than 0.2 micro inch. In addition, the surface must be essentially void-free. In the most preferred embodiments, the upper, top surface of the substrate handling blade is constructed from a dielectric material being smooth, non-porous, and wear-resistant. A preferred material for construction of the substrate handling blade is single crystal sapphire. Other single crystal materials, such as single crystal silicon and single crystal silicon carbide should also perform well. In a particularly preferred embodiment of the substrate handling blade, a capacitance sensor is used to indicate the presence of a semiconductor substrate on the surface of the handling blade and a structure through which vacuum is applied may be used to hold (chuck) the semiconductor substrate to the surface of the handling blade.

    摘要翻译： 通过使用作为半导体基板处理叶片的构造的主要材料的特殊材料或作为表面上的涂层，由于半导体基板和机器人基板处理刮板之间的摩擦而产生的颗粒污染物的量已经大大降低 的晶片处理叶片。 特别地，专门的材料必须在超过约450℃的温度下显示所需的刚度。 专用材料也必须具有在摩擦半导体衬底时不会产生微粒的耐磨表面。 耐磨表面需要非常光滑，表面光洁度小于1.0微英寸，优选小于0.2微英寸。 此外，表面必须基本上无空隙。 在最优选的实施例中，衬底处理刀片的上顶表面由平滑，无孔和耐磨的电介质材料构成。 用于构造基板处理叶片的优选材料是单晶蓝宝石。 其他单晶材料，如单晶硅和单晶碳化硅也应表现良好。 在基板处理叶片的特别优选的实施例中，使用电容传感器来表示在处理叶片的表面上存在半导体基板，并且可以使用施加真空的结构来保持（卡盘）半导体基板 到处理叶片的表面。

    Process for preparing POWADIR membranes from tetrahalobisphenol A polycarbonates
    23.
    发明授权
    Process for preparing POWADIR membranes from tetrahalobisphenol A polycarbonates 失效
    从四卤双酚A聚碳酸酯制备POWADIR膜的方法

    公开(公告)号：US4772392A

    公开(公告)日：1988-09-20

    申请号：US118119

    申请日：1987-11-06

    申请人： Edgar S. Sanders, Jr. ,  Daniel O. Clark ,  John A. Jensvold ,  Henry N. Beck ,  G. Glenn Lipscomb, II ,  Frederick L. Coan

    发明人： Edgar S. Sanders, Jr. ,  Daniel O. Clark ,  John A. Jensvold ,  Henry N. Beck ,  G. Glenn Lipscomb, II ,  Frederick L. Coan

    IPC分类号： B01D67/00 ,  B01D69/02 ,  B01D69/08 ,  B01D71/50 ,  C01B3/50 ,  C01B13/02 ,  C08G64/10 ,  B01D13/01

    CPC分类号： B01D67/0009 ,  B01D69/02 ,  B01D69/08 ,  B01D69/087 ,  B01D71/50 ,  C01B13/0255 ,  C01B3/503 ,  C08G64/10 ,  B01D2323/08 ,  B01D2323/12 ,  B01D2325/022 ,  C01B2203/0405 ,  C01B2203/048 ,  C01B2210/0046 ,  Y10S264/48

    摘要： The invention is a process for the preparation of a POWADIR membrane comprising bisphenol-based polycarbonates wherein at least 25 percent by weight of the bisphenol moieties are tetrahalogenated wherein the halogen is Cl or Br, and the membrane prepared by such process. The process generally comprises: forming a mixture comprising (i) a bisphenol-based polycarbonate wherein at least 25 percent by weight of the bisphenol moieties are tetrahalogenated, wherein the halogen is Cl or Br, (ii) a solvent for such polycarbonate, and (iii) a non-solvent for such polycarbonate, wherein the mixture has a sufficient viscosity to allow extrusion at temperatures at which the mixture is homogeneous; heating the mixture to a temperature at which the mixture is a homogeneous fluid and extrudable; extruding the heated mixture into a shape suitable for membrane use; passing the formed membrane through a quench zone wherein the mixture undergoes phase separation, and the major portion of the solvent and non-solvent are removed from the formed membrane; wherein the membrane formed is a POWADIR membrane with a discriminating region capable of separating oxygen from nitrogen.

    摘要翻译： 本发明是一种制备包含双酚基聚碳酸酯的POWADIR膜的方法，其中至少25重量％的双酚部分是四卤化的，其中卤素是Cl或Br，以及通过这种方法制备的膜。 该方法通常包括：形成混合物，其包含（i）双酚基聚碳酸酯，其中至少25重量％的双酚部分是四卤代的，其中卤素是Cl或Br，（ii）这种聚碳酸酯的溶剂和（ iii）用于这种聚碳酸酯的非溶剂，其中混合物具有足够的粘度以允许在混合物均匀的温度下挤出; 将混合物加热到混合物是均匀流体并可挤出的温度; 将加热的混合物挤出成适于膜使用的形状; 将形成的膜通过骤冷区，其中混合物经历相分离，并且从形成的膜中除去主要部分的溶剂和非溶剂; 其中所形成的膜是具有能够将氮与氮分离的鉴别区的POWADIR膜。

    Methods and apparatus for treating exhaust gas in a processing system
    24.
    发明授权
    Methods and apparatus for treating exhaust gas in a processing system 有权
    在处理系统中处理废气的方法和装置

    公开(公告)号：US08747762B2

    公开(公告)日：2014-06-10

    申请号：US12957539

    申请日：2010-12-01

    申请人： Colin John Dickinson ,  Mehran Moalem ,  Daniel O. Clark

    发明人： Colin John Dickinson ,  Mehran Moalem ,  Daniel O. Clark

    IPC分类号： B01J19/08

    CPC分类号： B01D53/32 ,  B01D53/92 ,  B01D2258/0216 ,  B01D2259/122 ,  B01D2259/80 ,  B01D2259/818 ,  C23C16/4412

    摘要： Methods and apparatus for treating an exhaust gas in a foreline of a substrate processing system are provided herein. In some embodiments, an apparatus for treating an exhaust gas in a foreline of a substrate processing system includes a plasma source coupled to a foreline of a process chamber, a reagent source coupled to the foreline upstream of the plasma source, and a foreline gas injection kit coupled to the foreline to controllably deliver a gas to the foreline, wherein the foreline injection kit includes a pressure regulator to set a foreline gas delivery pressure setpoint, and a first pressure gauge coupled to monitor a delivery pressure of the gas upstream of the foreline.

    摘要翻译： 本文提供了用于处理衬底处理系统的前级管线中的废气的方法和装置。 在一些实施例中，用于处理衬底处理系统的前级管线中的废气的装置包括耦合到处理室的前级管线的等离子体源，耦合到等离子体源上游的前级管线的试剂源和前级气体注入 前级管线注入套件包括用于设定前级气体输送压力设定点的压力调节器，以及耦合以监测前级管线上游气体的输送压力的第一压力表， 。

    SPUTTERING TARGET
    25.
    发明申请
    SPUTTERING TARGET 审中-公开
    飞溅目标

    公开(公告)号：US20100126854A1

    公开(公告)日：2010-05-27

    申请号：US12277197

    申请日：2008-11-24

    申请人： Daniel O. Clark

    发明人： Daniel O. Clark

    IPC分类号： C23C14/34 ,  C23C14/00

    CPC分类号： C23C14/3407 ,  H01J37/34 ,  H01J37/3426 ,  H01J37/3432 ,  H01J37/3435

    摘要： Embodiments of the present invention generally include a sputtering target capable of substantially reducing the amount of wasted material associated with conventional sputtering targets. In one embodiment, the sputtering target includes a fluidized bed of sputtering material that constantly maintains a planar sputtering surface throughout the sputtering process. In one embodiment, the fluidized bed of sputtering material is either periodically or constantly supplied with sputtering material to both maintain a planar sputtering surface and reduce downtime of the sputtering equipment.

    摘要翻译： 本发明的实施方案通常包括能够显着减少与常规溅射靶相关的浪费材料量的溅射靶。 在一个实施例中，溅射靶包括溅射材料的流化床，其在整个溅射过程中始终保持平面溅射表面。 在一个实施例中，溅射材料的流化床周期性地或恒定地提供溅射材料，以保持平面溅射表面并减少溅射设备的停机时间。

    SYSTEMS AND METHODS FOR TREATING FLAMMABLE EFFLUENT GASES FROM MANUFACTURING PROCESSES
    27.
    发明申请
    SYSTEMS AND METHODS FOR TREATING FLAMMABLE EFFLUENT GASES FROM MANUFACTURING PROCESSES 有权
    用于从制造过程中处理易燃气体的系统和方法

    公开(公告)号：US20090216061A1

    公开(公告)日：2009-08-27

    申请号：US12365886

    申请日：2009-02-04

    申请人： Daniel O. Clark ,  Mehran Moalem ,  Robbert M. Vermeulen ,  Phil Chandler

    发明人： Daniel O. Clark ,  Mehran Moalem ,  Robbert M. Vermeulen ,  Phil Chandler

    IPC分类号： A62D3/30 ,  B01J19/00

    CPC分类号： B01D53/005 ,  B01D53/40 ,  B01D2257/108 ,  B01D2258/0216

    摘要： A system for treating flammable effluent gas is provided. The system includes an exhaust conduit to carry the flammable effluent gas to an abatement unit, a control system coupled to the abatement unit to determine an operating parameter of the abatement unit, a bypass valve coupled to the exhaust conduit which is an operative responsive to the monitoring system, and a source of second gas to be mixed with the effluent gas diverted from the abatement unit when the bypass valve is operating in a bypass mode to provide a mixed gas having a flammability lower than the effluent gas. Methods of the invention as well as numerous other aspects are provided.

    摘要翻译： 提供了一种处理易燃废气的系统。 该系统包括用于将可燃性流出气体运送到减排单元的排气管道，耦合到减排单元以确定减排单元的操作参数的控制系统;联接到排气管道的旁通阀，该旁通阀是响应于 监测系统，以及当旁通阀以旁通模式操作时与从减排单元转移的废气混合的第二气体源，以提供具有低于废气的可燃性的混合气体。 提供了本发明的方法以及许多其它方面。

    METHODS AND APPARATUS FOR ASSEMBLING AND OPERATING ELECTRONIC DEVICE MANUFACTURING SYSTEMS
    28.
    发明申请
    METHODS AND APPARATUS FOR ASSEMBLING AND OPERATING ELECTRONIC DEVICE MANUFACTURING SYSTEMS 失效
    组装和操作电子设备制造系统的方法和装置

    公开(公告)号：US20080289167A1

    公开(公告)日：2008-11-27

    申请号：US12126922

    申请日：2008-05-25

    申请人： Phil Chandler ,  Daniel O. Clark ,  Robbert M. Vermeulen ,  Jay J. Jung ,  Roger M. Johnson ,  Youssef A. Loldj ,  James L. Smith

    发明人： Phil Chandler ,  Daniel O. Clark ,  Robbert M. Vermeulen ,  Jay J. Jung ,  Roger M. Johnson ,  Youssef A. Loldj ,  James L. Smith

    IPC分类号： B23P11/00

    CPC分类号： G05B19/4184 ,  G05B2219/31386 ,  G05B2219/45026 ,  Y02P90/04 ,  Y02P90/14 ,  Y10T29/49826 ,  Y10T29/53048

    摘要： A method for operating one or more electronic device manufacturing systems is provided, including the steps 1) performing a series of electronic device manufacturing process steps with a process tool, wherein the process tool produces effluent as a byproduct of performing the series of process steps; 2) abating the effluent with an abatement tool; 3) supplying an abatement resource to the abatement tool from a first abatement resource supply; 4) changing an abatement resource supply from the first abatement resource supply to a second abatement resource supply, wherein changing the abatement resource supply comprises: i) interrupting a flow of the abatement resource from the first abatement resource supply; and ii) beginning a flow of the abatement resource from the second abatement resource supply; and 5) continuing to perform the series of process steps with the process tool, while changing, and after changing, the abatement resource supply.

    摘要翻译： 提供了一种用于操作一个或多个电子设备制造系统的方法，包括以下步骤：1）使用工艺工具执行一系列电子设备制造工艺步骤，其中所述工艺工具产生流出物作为执行所述一系列工艺步骤的副产品; 2）用减排工具减轻废水; 3）从第一减排资源提供给减排工具的减排资源; 4）将减排资源供应从第一减排资源供应改为第二减排资源供应，其中改变减排资源供应包括：i）中断来自第一减排资源供应的减排资源的流动; 和ii）从第二减排资源供应开始减排资源的流动; 5）在改变和改变减排资源供应的同时，继续与流程工具一起执行一系列流程步骤。

    Method for carbon monoxide reduction during thermal/wet abatement of organic compounds
    29.
    发明授权
    Method for carbon monoxide reduction during thermal/wet abatement of organic compounds 失效
    在有机化合物的热/湿减轻过程中一氧化碳还原的方法

    公开(公告)号：US06551381B2

    公开(公告)日：2003-04-22

    申请号：US09911315

    申请日：2001-07-23

    申请人： Belynda G. Flippo ,  Robbert Vermuellen ,  Daniel O. Clark

    发明人： Belynda G. Flippo ,  Robbert Vermuellen ,  Daniel O. Clark

    IPC分类号： B01D5000

    CPC分类号： B01D53/0431 ,  B01D53/0438 ,  B01D53/0446 ,  B01D53/047 ,  B01D53/229 ,  B01D53/68 ,  B01D2253/202 ,  B01D2256/12 ,  B01D2257/502 ,  B01D2258/0216

    摘要： A method and system for retrofitting an integrated scrubber to provide maximum oxygen content in a controlled decomposition oxidation (CDO) abatement process. The system includes a thermal/wet integrated scrubber, and a compressed air supply for supplying air to an oxygen separation device that separates the air into a nitrogen-enriched component and an oxygen-enriched component. The oxygen separation device utilizes a ceramic oxide or polymeric material to separate from the supplied air an oxygen-enriched component for introduction into the integrated scrubber. The integrated scrubber is equipped with a mechanical scraping device for continuous or intermittent removal of combustion deposits formed during the controlled decomposition oxidation process.

    摘要翻译： 用于改进综合洗涤器以在受控分解氧化（CDO）消除过程中提供最大氧含量的方法和系统。 该系统包括热/湿综合洗涤器和用于将空气供给到将空气分离成富氮组分和富氧组分的氧分离装置的压缩空气供应。 氧气分离装置利用陶瓷氧化物或聚合物材料与供应的空气分离出用于引入综合洗涤器的富氧组分。 集成洗涤器配备有用于连续或间歇地去除在受控分解氧化过程中形成的燃烧沉积物的机械刮擦装置。