公开(公告)号：USD890823S1

公开(公告)日：2020-07-21

申请号：US29676937

申请日：2019-01-16

Applicant: EBARA CORPORATION

Designer： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina

公开(公告)号：US20200039025A1

公开(公告)日：2020-02-06

申请号：US16530175

申请日：2019-08-02

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina

IPC: B24B37/32

Abstract: Provided is a jig for assisting the dismounting and mounting of a top ring.One embodiment provides a jig for mounting/dismounting at least a part of the top ring for holding a substrate. The jig comprises a movable plate for supporting at least a part of the top ring, which is in a dismounted state, a plurality of posts for positioning the jig at a predetermined position relative to the top ring, the plurality of posts being configured to be engaged with the top ring, and a drive mechanism for moving the movable plate in a direction toward and away from the top ring.

公开(公告)号：US20200039024A1

公开(公告)日：2020-02-06

申请号：US16530129

申请日：2019-08-02

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina

IPC: B24B37/32

Abstract: According to one embodiment, there is provided a top ring for holding a substrate. The top ring comprises a substrate supporting surface, a retainer member disposed to surround an outer periphery of the substrate supporting surface, and a retainer guiding device configured to guide the retainer member so as to allow the retainer member to be displaced in a direction perpendicular to the substrate supporting surface, and support the retainer member so as to inhibit the retainer member from being displaced in a direction parallel to and away from the substrate supporting surface. The retainer guiding device is disposed in an inner side of the retainer member surrounding the substrate supporting surface.

公开(公告)号：US10458020B2

公开(公告)日：2019-10-29

申请号：US15095330

申请日：2016-04-11

Applicant: Ebara Corporation

Inventor： Yu Ishii ,  Fong-Jie Du ,  Makoto Kashiwagi

IPC: H01L21/68 ,  B24B9/06 ,  C23C16/458 ,  C23C16/52 ,  B24B21/00 ,  B24B37/30 ,  B24B37/005

Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate, such as a wafer, with a central axis of a substrate stage with high accuracy. The substrate processing apparatus includes: an eccentricity detector configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, when held on a centering stage, from a central axis of the centering stage; and an aligner configured to perform a centering operation of moving and rotating the centering stage until the center of the substrate on the centering stage is located on a central axis of a processing stage. The aligner is configured to calculate a distance by which the centering stage is to be moved and an angle through which the centering stage is to be rotated, based on an initial relative position of the central axis of the centering stage with respect to the central axis of the processing stage, the amount of eccentricity, and the eccentricity direction.

公开(公告)号：US11638980B2

公开(公告)日：2023-05-02

申请号：US16825799

申请日：2020-03-20

Applicant: EBARA CORPORATION

Inventor： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina

IPC: B24B37/32 ,  B24B37/005

Abstract: An elastic member that includes a plurality of pressure chambers is manufactured without using a mold having a complicated shape. According to one embodiment, a laminated membrane used in a substrate holder of a substrate processing apparatus is provided. Such a laminated membrane includes a first sheet material and a second sheet material disposed on the first sheet material. A part of the first sheet material is secured to a part of the second sheet material.

公开(公告)号：US11511386B2

公开(公告)日：2022-11-29

申请号：US16513251

申请日：2019-07-16

Applicant: EBARA CORPORATION

Inventor： Masaya Seki ,  Masayuki Nakanishi ,  Makoto Kashiwagi

IPC: B24B21/06 ,  B24B21/08 ,  B24B21/14 ,  B24B21/20 ,  B24B21/22 ,  B24B49/10 ,  B24B21/00 ,  B24B9/06 ,  B24B7/22 ,  B24B9/10 ,  B24C3/08

Abstract: A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

公开(公告)号：US20220005716A1

公开(公告)日：2022-01-06

申请号：US17258916

申请日：2019-07-09

Applicant: EBARA CORPORATION

Inventor： Akihiro Yazawa ,  Takashi Koba ,  Kenichi Kobayashi ,  Kenichi Akazawa ,  Fong-Jie Du ,  Makoto Kashiwagi ,  Asagi Matsugu ,  Takahiro Nanjo ,  Hideharu Aoyama ,  Takashi Mitsuya ,  Tetsuji Togawa

IPC: H01L21/677 ,  B24B37/14 ,  B24B37/26 ,  H01L21/304 ,  B24B37/30 ,  B65G13/02

Abstract: To provide an automated apparatus for conveying a rectangular substrate. According to one embodiment, there is provided a substrate conveying apparatus for conveying the rectangular substrate. The substrate conveying apparatus includes a plurality of conveyance rollers, a plurality of roller shafts, a motor, and a pusher. The plurality of conveyance rollers are configured to support a lower surface of the substrate. To the plurality of roller shafts, the plurality of conveyance rollers are mounted. The motor is configured to rotate the plurality of roller shafts. The pusher is for lifting the substrate on the plurality of conveyance rollers such that the substrate is separated away from the plurality of conveyance rollers. The pusher includes a stage configured to pass through a clearance between the plurality of roller shafts.

公开(公告)号：US20210170543A1

公开(公告)日：2021-06-10

申请号：US17099571

申请日：2020-11-16

Applicant: EBARA CORPORATION

Inventor： Yu Ishii ,  Hirotaka Satori ,  Makoto Kashiwagi ,  Manato Furusawa

IPC: B24B37/32 ,  H01L21/683

Abstract: Provided is a top ring that ensures uniformly pressing a substrate against a polishing pad. A top ring 302 for holding a substrate WF includes a base member 301 coupled to a top ring shaft 18, an elastic film 320 that is mounted to the base member 301 and forms a pressurization chamber 322 for pressurizing the substrate WF between the base member 301 and the elastic film 320, a substrate suction member 330 that includes a porous member 334 including a substrate suction surface 334a for suctioning the substrate WF and a pressure reducing portion 334b communicating with a pressure reducing unit 31. The substrate suction member 330 is held to the elastic film 320.

公开(公告)号：US20200246939A1

公开(公告)日：2020-08-06

申请号：US16748606

申请日：2020-01-21

Applicant: EBARA CORPORATION

Inventor： Makoto Kashiwagi ,  Manao Hoshina

IPC: B24B49/12 ,  B24B7/22 ,  B24B41/00 ,  B24B41/06

Abstract: There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

公开(公告)号：USD890824S1

公开(公告)日：2020-07-21

申请号：US29676941

申请日：2019-01-16

Applicant: EBARA CORPORATION

Designer： Kenichi Kobayashi ,  Asagi Matsugu ,  Makoto Kashiwagi ,  Manao Hoshina