Methods and apparatuses for resetting the physical layers of two agents interconnected through a link-based interconnection
    21.
    发明申请
    Methods and apparatuses for resetting the physical layers of two agents interconnected through a link-based interconnection 有权
    用于重置通过基于链路的互连互联的两个代理的物理层的方法和装置

    公开(公告)号:US20050262336A1

    公开(公告)日:2005-11-24

    申请号:US10850783

    申请日:2004-05-21

    IPC分类号: G06F15/177 H04L29/08

    CPC分类号: H04L69/32

    摘要: A method for effecting an in-band reset of the physical layers of two agents interconnected through a link-based interconnection scheme. In accordance with one embodiment of the invention, a first of the two agents ceases its forwarded clock to initiate the in-band reset. Upon realization of the cessation, a second agent ceases its forwarded clock and proceeds to a reset state. The first agent then proceeds to a reset state. Subsequently, after waiting a specified period of time, both agents proceed with a re-initialization of the physical layer. In accordance with one embodiment of the invention, the re-initialization of the physical layer is effected without impacting other layers of the interconnection hierarchy.

    摘要翻译: 一种用于实现通过基于链路的互连方案互联的两个代理的物理层的带内复位的方法。 根据本发明的一个实施例,两个代理中的第一个停止其转发的时钟以启动带内复位。 在停止实现时,第二代理程序停止其转发的时钟并进入复位状态。 然后第一个代理进入复位状态。 随后,等待指定的时间段后,两个代理进行物理层的重新初始化。 根据本发明的一个实施例,实现物理层的重新初始化而不影响互连层次结构的其他层。

    Setting multiple chip parameters using one IC terminal
    22.
    发明授权
    Setting multiple chip parameters using one IC terminal 失效
    使用一个IC端子设置多个芯片参数

    公开(公告)号:US06922071B2

    公开(公告)日:2005-07-26

    申请号:US10330598

    申请日:2002-12-27

    IPC分类号: H03K19/173 H03K17/16

    CPC分类号: H03K19/1732

    摘要: A method for setting multiple chip parameters using one IC terminal is described. The chip comprises a first circuit coupled to the pin for setting a first parameter. A second circuit coupled to the pin sets a second parameter. In addition, a third circuit coupled to the pin sets a third parameter of the chip.

    摘要翻译: 描述使用一个IC终端设置多个芯片参数的方法。 芯片包括耦合到引脚的第一电路以设置第一参数。 耦合到引脚的第二电路设置第二参数。 此外,耦合到引脚的第三电路设置芯片的第三参数。

    Low cost and high speed 3 load printed wiring board bus topology

    公开(公告)号:US06561410B2

    公开(公告)日:2003-05-13

    申请号:US10116503

    申请日:2002-04-03

    IPC分类号: B23K3102

    摘要: A multi layer printed circuit board with a 3-load topology is disclosed. First, second, and third integrated circuit (IC) printed wiring board packages having first, second, and third sets of terminals respectively are mounted on opposite sides of the board so that the second set of terminals are directly opposite the third set of terminals. Each package contains an IC die coupled to the respective set of terminals. The IC die in the first package is substantially identical to the one contained in the second package, and different than the one contained in the third package. For improved fanout of the metal lines that interconnect the first package to the second and third packages, each of the first, second, and third sets of terminals in the packages is arranged in substantially a U-shape. Each set of terminals has the same set of signal assignments of a parallel bus implemented by metal lines in the board. The 3-load topology is particularly useful for personal computer motherboard units having twin processors and a bridge chip set, yielding a motherboard having significantly lower number of metal layers, a faster bus and significantly improved noise margin, all with high density IC packages on a wide parallel bus.