Abstract:
The present invention provides a polymer compound represented by the following Formula (1) and a method for production thereof, a pigment dispersant, a pigment dispersion composition, and a photocurable composition respectively using the polymer compound, and a color filter and a method for production thereof [R1: an organic linking group having a valency of (m+n); R2: a single bond or a divalent organic linking group; A1: a monovalent organic group containing at least one moiety selected from an organic dye structure, a heterocyclic structure, an acidic group, a group having a basic nitrogen atom, a urea group, a urethane group, a group having a coordinating oxygen atom, a hydrocarbon group having 4 or more carbon atoms, an alkoxysilyl group, an epoxy group, an isocyanate group, and a hydroxyl group; m=1 to 8, n=2 to 9 (m+n=3 to 10); and P1: polymer skeleton]. (A1-R2nR1P1)m Formula (1)
Abstract translation:本发明提供由下述通式(1)表示的高分子化合物及其制造方法,颜料分散剂,颜料分散组合物和使用该高分子化合物的光固化性组合物,以及滤色器及其制造方法 [R1:具有(m + n)价的有机连接基团; R2:单键或二价有机连接基团; A1:含有选自有机染料结构,杂环结构,酸性基团,具有碱性氮原子的基团,脲基,氨基甲酸酯基,具有配位氧原子的基团的至少一个部分的一价有机基团, 具有4个以上碳原子的烃基,烷氧基甲硅烷基,环氧基,异氰酸酯基和羟基; m = 1〜8,n = 2〜9(m + n = 3〜10)。 和P1:聚合物骨架]。 (A1-R2nnR1P1)m式(1)
Abstract:
There is provided a pattern forming method comprising: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.
Abstract:
An object of the present invention is to provide a near-infrared-absorbing composition capable of forming a cured film having excellent heat resistance while maintaining strong near-infrared shielding properties when a cured film is produced. The near-infrared-absorbing composition of the present invention includes a copper complex obtained by reacting two or more kinds of sulfonic acids represented by General Formula (I) described below or salts thereof with a copper component and a solvent.
Abstract:
The pattern forming method of the present invention includes (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition which contains a resin (A) which has a repeating unit including a group capable of generating a polar group by being decomposed due to an action of an acid and a repeating unit including a carboxyl group, a compound (B) which generates an acid according to irradiation with actinic rays or radiation, and a solvent (C); (ii) exposing the film using a KrF excimer laser, extreme ultraviolet rays, or an electron beam; and (iii) forming a negative tonetone pattern by developing the exposed film using a developer which includes an organic solvent.
Abstract:
There is provided a pattern forming method comprising (i) a step of forming a film by an actinic ray-sensitive or radiation-sensitive resin composition; (ii) a step of exposing the film; and (iii) a step of performing development by using a developer containing an organic solvent to form a negative pattern, wherein the actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin capable of increasing the polarity by an action of an acid to decrease the solubility in a developer containing an organic solvent, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (C) a solvent, and (D) a resin having a repeating unit having a fluorine atom and not having a CF3 partial structure.
Abstract:
A pattern forming method, includes: (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition containing (P) a resin having (a1) a repeating unit represented by the following formula (I) or (II) as defined in the specification in an amount of 20 mol % or more based on all repeating units in the resin (P) and (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (ii) a step of exposing the film, so as to form an exposed film; and (iii) a step of developing the exposed film by using a developer containing an organic solvent to form a negative pattern.
Abstract:
A composition includes a metal particle and a resin and has a wavelength band A having a wavelength band width of 1 μm or more in a wavelength range of 1 to 14 μm and a wavelength band B having a lower absorbance than the wavelength band A and having a wavelength band width of 1 μm or more, and a ratio Amin/Bmax between a minimum value Amin of an absorbance of the wavelength band A and a maximum value Bmax of an absorbance of the wavelength band B is 3 or more.
Abstract:
A composition includes at least one of particles having an average primary particle diameter of 50 to 150 nm or particles having an average major axis length of 50 to 150 nm, and a resin, in which the composition has an L* in an L*a*b* color space of CIE 1976 of 35 to 75 in a case of forming a film with a thickness of 3 μm using the composition. A film; a cured film; an optical sensor; and a method for producing a film each use the composition.
Abstract:
There is provided an actinic ray-sensitive or radiation-sensitive resin composition, having: (A) a resin having a repeating unit represented by formula (I); (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) a resin having at least one repeating unit (x) out of a repeating unit represented by formula (II) and a repeating unit represented by formula (III) and containing substantially neither fluorine atom nor silicon atom, wherein the content of the repeating unit (x) is 90% or more by mole based on all repeating units in the resin (C).
Abstract:
A pattern forming method contains: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.