Abstract:
Provided are a curable composition which can be used to produce a cured film that does not easily allow a near infrared-absorbing pigment to be eluted even when the cured film is immersed in a solvent, a cured film, a near infrared cut filter, a camera module, and a method for manufacturing a camera module.The curable composition including: a near infrared-absorbing pigment (A) and a curable compound (B) having one or more atoms or groups selected from a fluorine atom, a silicon atom, a linear alkyl group having 8 or more carbon atoms, and a branched alkyl group having 3 or more carbon atoms.
Abstract:
A near-infrared-absorbing composition includes a copper compound and a compound having a partial structure represented by Formula (1) described below and the content of the copper compound is in a range of 3×10−3 mol to 1 mol in relation to 1 g of the compound having the partial structure represented by Formula (1) described below, in Formula (1), R1 represents a hydrogen atom or an organic group.
Abstract:
According to an exemplary embodiment of the present invention, there is provided an actinic ray-sensitive or radiation-sensitive resin composition includes an aromatic group and a resin (A) that may include (i) a repeating unit having a group capable of decomposing by the action of an acid to generate a polar group and (ii) a repeating unit having a polar group other than a phenolic hydroxyl group, wherein the total content of the repeating units (i) and (ii) is 51 mol % or more based on the entire repeating units in the resin (A).
Abstract:
A pattern forming method contains: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.
Abstract:
A pattern forming method including: (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) having a repeating unit having a group generating a polar group upon being decomposed by the action of an acid, and a repeating unit having an aromatic group, a compound (B) generating an acid upon irradiation with actinic rays or radiation, and a solvent (C); (ii) exposing the film; and (iii) developing the exposed film using a developer including an organic solvent to form a negative tone pattern, wherein the resin (A) is a resin having a repeating unit having a naphthyl group, and the like, and/or the actinic ray-sensitive or radiation-sensitive resin composition contains a compound (D) having a naphthalene ring, and the like.
Abstract:
A pattern forming method including: (i) a process of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a Resin (P) including a non-acid-decomposable Repeating Unit (b1) represented by a following General Formula (b1) and a repeating unit including a group capable of being decomposed by acid and generating a polar group, and a Compound (B) capable of generating an acid through irradiation of actinic rays or irradiation; (ii) a process of exposing the film using actinic rays or radiation with a wavelength of equal to or less than 200 nm; and (iii) a process of developing the exposed film using a developer including an organic solvent containing a hetero atom and carbon atoms having 7 or more carbon atoms to forming a negative tone pattern.
Abstract:
A pattern forming method including: a process of forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin including a Repeating Unit (a1) having a group capable of being decomposed by acid and generating a carboxyl group, and a compound capable of generating acid through irradiation of actinic rays or radiation; a process of exposing the film; and a process of developing the exposed film using a developer including an organic solvent to form a negative tone pattern, wherein the value X obtained by substituting the number of each atom included in the Repeating Unit (a1) after being decomposed by acid and generating a carboxyl group in the following formula is 0
Abstract:
A colorant-containing particle that comprises a colorant and a polymer represented by (A1-R2)n—R1—(R3—P1)m wherein R1 is organic linking group; R2 is single bond or divalent linking group; A1 is monovalent organic group containing organic dye residue etc., m is 1 to 8, n is 2 to 9, m+n is 3 to 10; R3 is single bond or divalent linking group; P1 is polymer backbone containing Si, has excellent dispersibility and dispersion stability.
Abstract:
A pattern forming method comprises (i) a step of forming a film by using an actinic ray-sensitive or radiation-sensitive resin composition containing: (A) a resin containing a repeating unit having a group capable of decomposing by the action of an acid to produce a polar group, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, and (C) a solvent, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer to form a negative pattern, wherein the content of a repeating unit represented by the following formula (I) is less than 20 mol % based on all repeating units in the resin (A) and the resin (A) contains a repeating unit having a non-phenolic aromatic group other than the repeating unit represented by the specific formula.
Abstract:
A photosensitive resin composition including an ethylenically unsaturated compound, a resin having a polarity that increases by the action of an acid, and metal atoms, in which a total content of the metal atoms is from 1 ppt to 30 ppb with respect to a total mass of the photosensitive resin composition, and a content of the ethylenically unsaturated compound is from 0.0001% by mass to 1% by mass with respect to the total mass of the photosensitive resin composition, and a method for producing the same; and a resist film, a pattern forming method, and a method for manufacturing an electronic device, each of which uses the photosensitive resin composition.