Abstract:
A pattern forming method includes: (i) forming a film from a chemical amplification resist composition that contains (A) a resin, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and (C) a tertiary alcohol; (ii) exposing the film; and (iii) performing development by using a developer containing an organic solvent.
Abstract:
Provided are a standard sample film or a standard sample for use in laser ablation inductively coupled plasma mass spectrometry, the standard sample film or the standard sample containing an organic substance and having a small variation in signal intensity of an ion of a metal element depending on a measurement position; a method for producing a standard sample film; a sample set; a quantitative analysis method; and a transfer film. The standard sample film of the present invention is a standard sample film for use in laser ablation inductively coupled plasma mass spectrometry, the standard sample film containing a polymer, a metal element, and an internal standard, and having a maximum height difference in film thickness of the standard sample film of 0.50 μm or less.
Abstract:
There is provided a pattern forming method comprising a step of forming a resist film from an actinic ray-sensitive or radiation-sensitive resin composition containing a resin capable of increasing the polarity by an action of an acid to decrease the solubility in an organic solvent-containing developer and a compound capable of decomposing upon irradiation with an actinic ray or radiation to generate an acid, a step of forming, on the resist film, a protective film from a protective film composition, a step of exposing the resist film having a protective film to an electron beam or an extreme-ultraviolet ray, and a step of developing the resist film by using the organic solvent-containing developer.
Abstract:
A pattern forming method contains: (i) a step of forming a first film on a substrate by using a first resin composition (I), (ii) a step of forming a second film on the first film by using a second resin composition (II) different from the resin composition (I), (iii) a step of exposing a multi-layered film having the first film and the second film, and (iv) a step of developing the first film and the second film in the exposed multi-layered film by using an organic solvent-containing developer to form a negative pattern.
Abstract:
A resin composition of the present invention includes a polymer compound (A) containing a repeating unit (Q) represented by the following general formula (1): wherein R1 represents a hydrogen atom, a methyl group, or a halogen atom; R2 and R3 represent a hydrogen atom, an alkyl group, or a cycloalkyl group; L represents a divalent linking group or a single bond; Y represents a substituent excluding a methylol group; Z represents a hydrogen atom or a substituent; m represents an integer of 0 to 4; n represents an integer of 1 to 5; and m+n is 5 or less.
Abstract:
Provided is a method of forming pattern including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing a first organic solvent, wherein in the developer, particles each having a diameter of 0.3 μm or greater amount to a density of 30 particles/ml or less.
Abstract:
Provided is a negative type pattern forming method that satisfies high sensitivity, high resolution, good roughness and good dry etching resistance at the same time, and further, has a good development time dependency, the method including (i) forming a film by a chemical amplification resist composition containing (A) a fullerene derivative having an acid-decomposable group, (B) a compound generating an acid upon irradiation with an actinic ray or radiation, and (C) a solvent, (ii) exposing the film, and (iii) developing the exposed film by using an organic solvent-containing developer.