Method for forming buried cavities within a semiconductor body, and semiconductor body thus made
    22.
    发明申请
    Method for forming buried cavities within a semiconductor body, and semiconductor body thus made 有权
    在半导体本体内形成掩埋空穴的方法以及由此制成的半导体本体

    公开(公告)号:US20070057355A1

    公开(公告)日:2007-03-15

    申请号:US11486387

    申请日:2006-07-12

    Abstract: A method for the formation of buried cavities within a semiconductor body envisages the steps of: providing a wafer having a bulk region made of semiconductor material; digging, in the bulk region, trenches delimiting between them walls of semiconductor material; forming a closing layer for closing the trenches in the presence of a deoxidizing atmosphere so as to englobe the deoxidizing atmosphere within the trenches; and carrying out a thermal treatment such as to cause migration of the semiconductor material of the walls and to form a buried cavity. Furthermore, before the thermal treatment is carried out, a barrier layer that is substantially impermeable to hydrogen is formed on the closing layer on top of the trenches.

    Abstract translation: 一种用于在半导体主体内形成掩埋空腔的方法,设想了以下步骤:提供具有由半导体材料制成的体区的晶片; 在本体区域中挖掘在它们的半导体材料壁之间划定的沟槽; 形成用于在脱氧气氛存在下关闭所述沟槽的闭合层,以便使所述沟槽内的脱氧气氛充满; 进行热处理,使壁的半导体材料迁移并形成掩埋腔。 此外,在进行热处理之前,在沟槽顶部的闭合层上形成基本上不透氢的阻挡层。

    Method for manufacturing a semiconductor pressure sensor
    24.
    发明申请
    Method for manufacturing a semiconductor pressure sensor 审中-公开
    半导体压力传感器的制造方法

    公开(公告)号:US20050208696A1

    公开(公告)日:2005-09-22

    申请号:US11082491

    申请日:2005-03-16

    CPC classification number: G01L9/0073 G01L9/0045

    Abstract: Method for manufacturing a semiconductor pressure sensor, wherein, in a silicon substrate, trenches are dug and delimit walls; a closing layer is epitaxially grown, that closes the trenches at the top and forms a suspended membrane; a heat treatment is performed so as to cause migration of the silicon of the walls and to form a closed cavity underneath the suspended membrane; and structures are formed for transducing the deflection of the suspended membrane into electrical signals.

    Abstract translation: 制造半导体压力传感器的方法,其中在硅衬底中,挖沟和界定壁; 闭合层外延生长,封闭顶部的沟槽并形成悬浮膜; 进行热处理以使壁的硅迁移并在悬浮膜下方形成封闭空腔; 并且形成用于将悬浮膜的偏转转换成电信号的结构。

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