公开(公告)号：US20090272960A1

公开(公告)日：2009-11-05

申请号：US12114096

申请日：2008-05-02

申请人： Bhaskar Srinivasan ,  Gurtej Sandhu ,  John Smythe

发明人： Bhaskar Srinivasan ,  Gurtej Sandhu ,  John Smythe

IPC分类号： H01L45/00

CPC分类号： H01L45/04 ,  H01L27/2463 ,  H01L27/2472 ,  H01L45/1233 ,  H01L45/146 ,  H01L45/147 ,  H01L45/1675

摘要： A method of forming a non-volatile resistive oxide memory cell includes forming a first conductive electrode of the memory cell as part of a substrate. The first conductive electrode has an elevationally outermost surface and opposing laterally outermost edges at the elevationally outermost surface in one planar cross section. Multi-resistive state metal oxide-comprising material is formed over the first conductive electrode. Conductive material is deposited over the multi-resistive state metal oxide-comprising material. A second conductive electrode of the memory cell which comprises the conductive material is received over the multi-resistive state metal oxide-comprising material. The forming thereof includes etching through the conductive material to form opposing laterally outermost conductive edges of said conductive material in the one planar cross section at the conclusion of said etching which are received laterally outward of the opposing laterally outermost edges of the first conductive electrode in the one planar cross section.

摘要翻译： 形成非易失性电阻氧化物存储单元的方法包括：形成存储单元的第一导电电极作为衬底的一部分。 第一导电电极在一个平面横截面中具有垂直最外表面和在最外表面处的相对的横向最外边缘。 在第一导电电极上形成包含多电阻态金属氧化物的材料。 导电材料沉积在多电阻状态的含金属氧化物的材料上。 包含导电材料的存储单元的第二导电电极被接收在多电阻状态的含金属氧化物的材料上。 其形成包括通过导电材料的蚀刻，以在所述蚀刻结束时在一个平面截面中形成所述导电材料的相对的横向最外面的导电边缘，其在第一导电电极的相对的横向最外边缘的横向外侧接收 一个平面截面。

公开(公告)号：US08476140B2

公开(公告)日：2013-07-02

申请号：US13352833

申请日：2012-01-18

申请人： Gurtej Sandhu ,  Bhaskar Srinivasan

发明人： Gurtej Sandhu ,  Bhaskar Srinivasan

IPC分类号： H01L21/8222 ,  H01L21/20

CPC分类号： H01L29/24 ,  H01L27/24 ,  H01L45/00

摘要： A diode and memory device including the diode, where the diode includes a conductive portion and another portion formed of a first material that has characteristics allowing a first decrease in a resistivity of the material upon application of a voltage to the material, thereby allowing current to flow there through, and has further characteristics allowing a second decrease in the resistivity of the first material in response to an increase in temperature of the first material.

摘要翻译： 包括二极管的二极管和存储器件，其中二极管包括导电部分和由第一材料形成的另一部分，该第一材料具有允许在向材料施加电压时第一次降低材料的电阻率的特性，从而允许电流 流过其中，并且具有允许第一材料的电阻率响应于第一材料的温度升高而第二次降低的特征。

公开(公告)号：US08343828B2

公开(公告)日：2013-01-01

申请号：US13305072

申请日：2011-11-28

申请人： Gurtej Sandhu ,  Bhaskar Srinivasan

发明人： Gurtej Sandhu ,  Bhaskar Srinivasan

IPC分类号： H01L21/8234

CPC分类号： H01L21/04 ,  H01L27/1021 ,  H01L27/2418 ,  H01L29/1606 ,  H01L45/00

摘要： Some embodiments include methods of forming diodes. A stack may be formed over a first conductive material. The stack may include, in ascending order, a sacrificial material, at least one dielectric material, and a second conductive material. Spacers may be formed along opposing sidewalls of the stack, and then an entirety of the sacrificial material may be removed to leave a gap between the first conductive material and the at least one dielectric material. In some embodiments of forming diodes, a layer may be formed over a first conductive material, with the layer containing supports interspersed in sacrificial material. At least one dielectric material may be formed over the layer, and a second conductive material may be formed over the at least one dielectric material. An entirety of the sacrificial material may then be removed.

公开(公告)号：US20120112185A1

公开(公告)日：2012-05-10

申请号：US13352833

申请日：2012-01-18

申请人： Gurtej Sandhu ,  Bhaskar Srinivasan

发明人： Gurtej Sandhu ,  Bhaskar Srinivasan

IPC分类号： H01L29/12 ,  H01L21/329

CPC分类号： H01L29/24 ,  H01L27/24 ,  H01L45/00

摘要： A diode and memory device including the diode, where the diode includes a conductive portion and another portion formed of a first material that has characteristics allowing a first decrease in a resistivity of the material upon application of a voltage to the material, thereby allowing current to flow there through, and has further characteristics allowing a second decrease in the resistivity of the first material in response to an increase in temperature of the first material.

摘要翻译： 包括二极管的二极管和存储器件，其中二极管包括导电部分和由第一材料形成的另一部分，该第一材料具有允许在向材料施加电压时第一次降低材料的电阻率的特性，从而允许电流 流过其中，并且具有允许第一材料的电阻率响应于第一材料的温度升高而第二次降低的特征。

公开(公告)号：US08120134B2

公开(公告)日：2012-02-21

申请号：US12580013

申请日：2009-10-15

申请人： Gurtej Sandhu ,  Bhaskar Srinivasan

发明人： Gurtej Sandhu ,  Bhaskar Srinivasan

IPC分类号： H01L31/058 ,  H01L29/06

CPC分类号： H01L29/24 ,  H01L27/24 ,  H01L45/00

摘要： A diode and memory device including the diode, where the diode includes a conductive portion and another portion formed of a first material that has characteristics allowing a first decrease in a resistivity of the material upon application of a voltage to the material, thereby allowing current to flow there through, and has further characteristics allowing a second decrease in the resistivity of the first material in response to an increase in temperature of the first material.

摘要翻译： 包括二极管的二极管和存储器件，其中二极管包括导电部分和由第一材料形成的另一部分，该第一材料具有允许在向材料施加电压时第一次降低材料的电阻率的特性，从而允许电流 流过其中，并且具有允许第一材料的电阻率响应于第一材料的温度升高而第二次降低的特征。

公开(公告)号：US20110089413A1

公开(公告)日：2011-04-21

申请号：US12580013

申请日：2009-10-15

申请人： Gurtej Sandhu ,  Bhaskar Srinivasan

发明人： Gurtej Sandhu ,  Bhaskar Srinivasan

IPC分类号： H01L29/12 ,  H01L21/329

CPC分类号： H01L29/24 ,  H01L27/24 ,  H01L45/00

摘要： A diode and memory device including the diode, where the diode includes a conductive portion and another portion formed of a first material that has characteristics allowing a first decrease in a resistivity of the material upon application of a voltage to the material, thereby allowing current to flow there through, and has further characteristics allowing a second decrease in the resistivity of the first material in response to an increase in temperature of the first material.

摘要翻译： 包括二极管的二极管和存储器件，其中二极管包括导电部分和由第一材料形成的另一部分，该第一材料具有允许在向材料施加电压时第一次降低材料的电阻率的特性，从而允许电流 流过其中，并且具有允许第一材料的电阻率响应于第一材料的温度升高而第二次降低的特征。

公开(公告)号：US20130005143A1

公开(公告)日：2013-01-03

申请号：US13616080

申请日：2012-09-14

申请人： Nishant Sinha ,  Gurtej Sandhu ,  Neil Greeley ,  John Smythe

发明人： Nishant Sinha ,  Gurtej Sandhu ,  Neil Greeley ,  John Smythe

IPC分类号： H01L21/28 ,  B82Y40/00

CPC分类号： H01L23/5222 ,  H01L21/7682 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device and a method of forming it are disclosed in which at least two adjacent conductors have an air-gap insulator between them which is covered by nanoparticles of insulating material being a size which prevent the nanoparticles from substantially entering into the air-gap.

摘要翻译： 公开了半导体器件及其形成方法，其中至少两个相邻的导体在它们之间具有空隙绝缘体，其被绝缘材料的纳米颗粒覆盖，其尺寸是防止纳米颗粒基本上进入气隙的尺寸。

公开(公告)号：US20110201211A1

公开(公告)日：2011-08-18

申请号：US13096052

申请日：2011-04-28

申请人： Nishant Sinha ,  Gurtej Sandhu ,  Neil Greeley ,  John Smythe

发明人： Nishant Sinha ,  Gurtej Sandhu ,  Neil Greeley ,  John Smythe

IPC分类号： H01L21/31 ,  B82Y40/00

CPC分类号： H01L23/5222 ,  H01L21/7682 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device and a method of forming it are disclosed in which at least two adjacent conductors have an air-gap insulator between them which is covered by nanoparticles of insulating material being a size which prevent the nanoparticles from substantially entering into the air-gap.

摘要翻译： 公开了半导体器件及其形成方法，其中至少两个相邻的导体在它们之间具有空隙绝缘体，其被绝缘材料的纳米颗粒覆盖，其尺寸是防止纳米颗粒基本上进入气隙的尺寸。

公开(公告)号：US08772166B2

公开(公告)日：2014-07-08

申请号：US13526792

申请日：2012-06-19

申请人： Gurtej Sandhu ,  Mark Kiehlbauch ,  Steve Kramer ,  John Smythe

发明人： Gurtej Sandhu ,  Mark Kiehlbauch ,  Steve Kramer ,  John Smythe

IPC分类号： H01L21/311

CPC分类号： H01L21/76816 ,  H01L21/0337 ,  H01L21/0338 ,  H01L23/528 ,  H01L2924/0002 ,  Y10S438/942 ,  H01L2924/00

摘要： Methods are disclosed, including for increasing the density of isolated features in an integrated circuit. Also disclosed are associated structures. In some embodiments, contacts are formed on pitch with other structures, such as conductive interconnects that may be formed by pitch multiplication. To form the contacts, in some embodiments, a pattern corresponding to some of the contacts is formed in a selectively definable material such as photoresist. Features in the selectively definable material are trimmed, and spacer material is blanket deposited over the features and the deposited material is then etched to leave spacers on sides of the features. The selectively definable material is removed, leaving a mask defined by the spacer material. The pattern defined by the spacer material may be transferred to a substrate, to form on pitch contacts. In some embodiments, the on pitch contacts may be used to electrically contact conductive interconnects in the substrate.

摘要翻译： 公开了包括用于增加集成电路中的隔离特征的密度的方法。 还公开了相关联的结构。 在一些实施例中，触点是与其他结构形成的，例如可以由间距倍增形成的导电互连。 为了形成触点，在一些实施例中，对应于一些触点的图案形成在诸如光致抗蚀剂的可选择定义的材料中。 在可选择定义的材料中的特征被修整，并且间隔物材料被毯子沉积在特征上，然后蚀刻沉积的材料以在特征的侧面留下间隔物。 去除可选择定义的材料，留下由间隔物材料限定的掩模。 由间隔物材料限定的图案可以转移到基底上，以形成间距接触。 在一些实施例中，上电触点可用于电接触衬底中的导电互连。

公开(公告)号：US08298964B2

公开(公告)日：2012-10-30

申请号：US13096052

申请日：2011-04-28

申请人： Nishant Sinha ,  Gurtej Sandhu ,  Neil Greeley ,  John Smythe

发明人： Nishant Sinha ,  Gurtej Sandhu ,  Neil Greeley ,  John Smythe

IPC分类号： H01L21/31

CPC分类号： H01L23/5222 ,  H01L21/7682 ,  H01L23/5329 ,  H01L23/53295 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor device and a method of forming it are disclosed in which at least two adjacent conductors have an air-gap insulator between them which is covered by nanoparticles of insulating material being a size which prevent the nanoparticles from substantially entering into the air-gap.

摘要翻译： 公开了半导体器件及其形成方法，其中至少两个相邻的导体在它们之间具有空隙绝缘体，其被绝缘材料的纳米颗粒覆盖，其尺寸是防止纳米颗粒基本上进入气隙的尺寸。