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    Thermal inkjet printhead stack with amorphous thin metal protective layer
    22.
    发明授权
    Thermal inkjet printhead stack with amorphous thin metal protective layer 有权
    热喷墨打印头堆叠与非晶薄金属保护层

    公开(公告)号：US09511585B2

    公开(公告)日：2016-12-06

    申请号：US14787711

    申请日：2013-07-12

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： James Elmer Abbott, Jr. ,  Arun K. Agarwal ,  Roberto A. Pugliese ,  Greg Scott Long ,  Stephen Horvath ,  Douglas A. Keszler ,  John Wager ,  Kristopher Olsen ,  John McGlone

    IPC: B41J2/14 ,  B41J2/16

    CPC classification number: B41J2/14112 ,  B41J2/14016 ,  B41J2/14088 ,  B41J2/14129 ,  B41J2/164 ,  B41J2/1646 ,  B41J2/1648 ,  B41J2202/03 ,  B41J2202/11

    Abstract: The present disclosure is drawn to a thermal inkjet printhead stack with an amorphous thin metal protective layer, comprising an insulated substrate, a resistor applied to the insulated substrate, a resistor passivation layer applied to the resistor, and an amorphous thin metal protective layer applied to the resistor passivation layer. The amorphous thin metal protective layer can comprise from 5 atomic % to 90 atomic % of a metalloid of carbon, silicon, or boron. The film can also include a first and second metal, each comprising from 5 atomic % to 90 atomic % of titanium, vanadium, chromium, cobalt, nickel, zirconium, niobium, molybdenum, rhodium, palladium, hafnium, tantalum, tungsten, iridium, or platinum. The second metal is different than the first metal, and the metalloid, the first metal, and the second metal account for at least 70 atomic % of the amorphous thin metal protective layer.

    Abstract translation: 本公开涉及具有非晶金属保护层的热喷墨打印头堆叠，其包括绝缘基板，施加到绝缘基板的电阻器，施加到电阻器的电阻器钝化层以及施加到电阻器的非晶薄金属保护层 电阻钝化层。 非晶态金属保护层可以包含5原子％至90原子％的碳，硅或硼准金属。 该膜还可以包括第一和第二金属，每个包含5原子％至90原子％的钛，钒，铬，钴，镍，锆，铌，钼，铑，钯，铪，钽，钨，铱， 或铂金。 第二金属与第一金属不同，并且准金属，第一金属和第二金属占非晶金属保护层的至少70原子％。

    Material sets
    29.
    发明授权
    Material sets 有权

    公开(公告)号：US10857727B2

    公开(公告)日：2020-12-08

    申请号：US16169443

    申请日：2018-10-24

    Applicant: Hewlett-Packard Development Company, L.P.

    Inventor： James Elmer Abbott, Jr. ,  Vladek Kasperchik ,  David A. Champion ,  James P. Shields

    IPC: B29C64/165 ,  B22F1/00 ,  B29C64/40 ,  B33Y70/00 ,  B33Y10/00 ,  B29C64/393

    Abstract: The present disclosure is drawn to material sets, methods and printed articles and container supports. In one example, a material set can include a particulate fusible build material having an average particle size ranging from about 0.01 μm to about 200 μm, wherein the particulate fusible build material is a polymer powder, a metal composite powder, or a combination thereof. A fusing ink includes a fusing agent in a first liquid vehicle, wherein the fusing agent fuses the particulate fusible build material when exposed to electromagnetic energy or thermal energy. A binding ink includes a binding agent in a second liquid vehicle, wherein the binding agent temporarily binds the fusible build material when exposed to moderate temperatures ranging from ambient to 150° C.

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