公开(公告)号：US20190176470A1

公开(公告)日：2019-06-13

申请号：US16280499

申请日：2019-02-20

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lawrence H. White ,  Arun K. Agarwal ,  Ron Burns

IPC: B41J2/14 ,  B41J2/21 ,  B41J2/175 ,  B41J2/155

CPC classification number: B41J2/1433 ,  B41J2/1404 ,  B41J2/1412 ,  B41J2/155 ,  B41J2/175 ,  B41J2/2125 ,  B41J2/2146 ,  B41J3/543 ,  B41J2002/14475 ,  B41J2202/20

Abstract: Printheads and printers are described herein. In one example, a printhead includes a number of drop generators disposed in a first array and a second array. The drop generators in both the first array and the second array are spaced one dot pitch apart perpendicular to the motion of a print medium, and alternate between a high drop weight (HDW) drop generator and a low drop weight (LDW) drop generator. Each drop generator in the first array is in a line of the motion of the print medium with a corresponding drop generator in the second array, wherein each HDW drop generator in the first array is in line with an LDW drop generator in the second array, and each LDW drop generator in the first array is in line with an HDW drop generator in the second array.

公开(公告)号：US09776402B2

公开(公告)日：2017-10-03

申请号：US15111269

申请日：2014-01-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Lawrence H. White ,  Anthony M. Fuller ,  Huyen Pham

IPC: B41J2/14 ,  B41J2/335 ,  B41J2/16

CPC classification number: B41J2/14112 ,  B41J2/14129 ,  B41J2/1601 ,  B41J2/1626 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/3351 ,  B41J2/33515 ,  B41J2/3353 ,  B41J2/3354 ,  B41J2/3357

Abstract: The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer.

公开(公告)号：US09570384B2

公开(公告)日：2017-02-14

申请号：US14818922

申请日：2015-08-05

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Lawrence H. White ,  Robert Vina ,  Terry Mcmahon ,  James R. Przybyla

IPC: H01L23/48 ,  H01L23/552 ,  H01L23/52 ,  H01L29/40 ,  H01L23/498 ,  H01L21/768 ,  H01L23/00

CPC classification number: H01L23/49822 ,  H01L21/76838 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0235 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/05013 ,  H01L2224/05024 ,  H01L2224/05092 ,  H01L2224/05553 ,  H01L2224/45124 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01073 ,  H01L2924/01079 ,  H01L2924/04642 ,  H01L2924/05042 ,  H01L2924/0534 ,  H01L2924/05432 ,  H01L2924/05442 ,  H01L2924/059 ,  H01L2924/05994 ,  H01L2924/1461 ,  H01L2924/01029 ,  H01L2924/00 ,  H01L2224/48

Abstract: A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.

Abstract translation: 半导体器件可以包括基板和位于基板附近的迹线层，并且包括用于向半导体器件提供电连接的迹线。 导电层可以位于跟踪层附近并形成接合焊盘。 非导电薄膜层可以位于迹线层和导电层之间。 薄膜层可以包括通孔以使得能够从迹线到接合焊盘的电连接。 衬底和多个导电层之间的迹线的一部分可以具有斜边。

公开(公告)号：US20140104344A1

公开(公告)日：2014-04-17

申请号：US14118699

申请日：2011-07-19

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Peter Mardilovich ,  Lawrence H. White ,  Erik D. Torniainen

IPC: B41J2/14

CPC classification number: B41J2/14427 ,  B41J2/1412

Abstract: A heating element of a fluid ejection device, the heating element including a ring-type body, an inner edge of the body, and an outer edge of the body, wherein at least one of the inner edge and the outer edge defines an undulated surface contour.

Abstract translation: 流体喷射装置的加热元件，加热元件包括环型主体，主体的内边缘和主体的外边缘，其中内边缘和外边缘中的至少一个限定波浪表面 轮廓。