摘要:
In a CSP type semiconductor device, the invention prevents a second wiring from forming a protruding portion toward a dicing line at the time of forming the second wiring that is connected to the back surface of a first wiring formed near a side surface portion of a semiconductor die on the front surface and extends onto the back surface of the semiconductor die over a step portion in a window that is formed from the back surface side of the semiconductor die so as to expose the back surface of the first wiring. A glass substrate is bonded on a semiconductor substrate on which a first wiring is formed on the front surface near a dicing line with a resin as an adhesive being interposed therebetween. The semiconductor substrate is then etched from the back surface to form a window having inclined sidewalls with the dicing line as a center. A second wiring is then formed so as to be connected to the back surface of the first wiring exposed in the window and extend over one of the sidewalls of the window, that extends perpendicular to the dicing line, onto the back surface of the semiconductor substrate.
摘要:
A suspension arm and cushion support structure for a vehicle. A knuckle support part of a rear suspension arm is formed of a plate member extended to the vehicle body inner side relative to a rim of a wheel element so as to cover the lower side of a boot covering a connected part between a drive shaft and a universal joint. The knuckle is supported by the rear suspension arm, and rotatably supports a wheel of the vehicle. A cushion is provided for absorbing shocks transmitted to the wheel, the lower end of the cushion being coaxially supported on the knuckle support part of a lower part of the rear suspension arm.
摘要:
The present invention provides methods for diagnosing mental disorders. The invention also provides methods of identifying modulators of mental disorders as well as methods of using these modulators to treat patients suffering from mental disorders.
摘要:
A saddle ride type all-terrain vehicle includes left and right front wheels supported independently of each other on a vehicle body such that driving power is transmitted to said front wheels by way of a pair of left and right drive shafts extending from a driving source side. The vehicle also includes universal couplings provided at opposite end portions of each of the drive shafts, covered by rubber boots. The vehicle further includes a protector for covering the rubber boots.
摘要:
A two-wheel and four-wheel driving change-over device for a vehicle is provided. A change-over unit intermittently performs power transmission for the power transmission mechanism. The change-over unit includes a driving shaft connected to a driving side, a driven shaft fitted to the driving shaft with an annular clearance therebetween. A plurality of engaging or disengaging members installed in a clearance between the driving shaft and driven shaft are engaged with or disengaged from the opposing surfaces for performing a connecting operation and a disconnecting operation between the driving shaft and driven shaft. A change-over mechanism is provided for selectively positioning the engaging or disengaging members between a position where the driving shaft and driven shaft are connected and a position where the driving shaft and driven shaft are disconnected.
摘要:
A drum brake includes a brake drum attached to an axle, and a brake panel. The brake drum includes a disc portion and a cylindrical portion extending from an outer peripheral end portion of the disc portion towards the brake panel. On an outer peripheral end portion of the cylindrical portion, there is mounted a seal member. The brake panel includes an annular flat surface portion, and a cylindrical projecting portion projecting from an outer peripheral end portion of the annular flat surface portion towards the brake drum so as to surround the seal member. The seal member has plural resilient axial sealing lips and at least one resilient radial sealing lip. The axial sealing lips are in sealing contact with the annular flat surface portion, and the radial lip is in sealing contact with an inner peripheral surface of the cylindrical projecting portion. Even if the brake drum is axially displaced away from the brake panel due to accidental bending of the axle, the radial sealing lip remains sealingly contact with the inner peripheral surface of the projecting portion.
摘要:
In a CSP type semiconductor device, the invention prevents a second wiring from forming a narrowed portion on a lower surface of a step portion at the time of forming the second wiring that is connected to the back surface of a first wiring formed near a side surface portion of a semiconductor die on the front surface and extends onto the back surface of the semiconductor die over the step portion of a window that is formed from the back surface side of the semiconductor die so as to expose the back surface of the first wiring. A glass substrate is bonded on a semiconductor substrate on which a first wiring is formed on the front surface near a dicing line with an adhesive resin being interposed therebetween. The semiconductor substrate is then etched from the back surface to form a window having step portions with inclined sidewalls around the dicing line as a center. A second wiring is then formed so as to be connected to the first wiring exposed in the window and extend onto the back surface of the semiconductor substrate over the step portions of the window except part of the step portions on the dicing line and near the dicing line, which extend perpendicular to the dicing line.
摘要:
A semiconductor device and its manufacturing method are offered to increase the number of semiconductor devices obtained from a semiconductor wafer while simplifying a manufacturing process. After forming a plurality of pad electrodes in a predetermined region on a top surface of a semiconductor substrate, a supporter is bonded to the top surface of the semiconductor substrate through an adhesive layer. Next, an opening is formed in the semiconductor substrate in a region overlapping the predetermined region. A wiring layer electrically connected with each of the pad electrodes is formed in the opening. After that, a stacked layer structure including the semiconductor substrate and the supporter is cut by dicing along a dicing line that is outside the opening.
摘要:
A vehicle includes a vehicle body frame, an internal combustion engine supported on the vehicle body frame, a propeller shaft assembly operatively connected to a crankshaft of the engine, a driveshaft, a final drive unit disposed between the front propeller shaft assembly and the driveshaft, a pair of occupant seats arranged side by side in a vehicle width direction, a pedal cluster, and a reduction gear located rearward of the pedal cluster and frontward of the occupant seats. The propeller shaft assembly includes a first propeller shaft disposed at a rear of the reduction gear, and a second propeller shaft disposed at a front of the reduction gear. The second propeller shaft is offset toward a second seat side in a vehicle width direction with respect to the first propeller shaft.
摘要:
The present invention provides methods for diagnosing mental disorders (e.g., psychotic disorders such as schizophrenia). The invention also provides methods of identifying modulators of such mental disorders as well as methods of using these modulators to treat patients suffering from such mental disorders.