公开(公告)号：US20140339690A1

公开(公告)日：2014-11-20

申请号：US13897620

申请日：2013-05-20

Applicant: Infineon Technologies AG

Inventor： Swee Guan Chan ,  Kong Yang Leong ,  Mei Yong Wang ,  Heinrich Koerner

IPC: H01L23/00

CPC classification number: H01L24/49 ,  H01L23/3107 ,  H01L23/3142 ,  H01L24/05 ,  H01L24/06 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/49 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10162 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/206

Abstract: An integrated-circuit module includes an integrated-circuit device having a first surface and a plurality of bond pads disposed on the first surface. The module further includes metallic bond wires or metallic ribbons, which are attached between respective ones of a first subset of the bond pads and a package substrate or leadframe, such that a second subset of the bond pads are not attached to either a package substrate or leadframe. A metallic stud bump is affixed to each of one or more of the second subset of the bond pads. The integrated-circuit module further comprises a molding compound that contacts at least the first surface of the integrated-circuit device and substantially surrounds the bond wires or ribbon wires and the metallic stud bumps.

Abstract translation: 集成电路模块包括具有第一表面和设置在第一表面上的多个接合焊盘的集成电路器件。 模块还包括金属接合线或金属带，其附接在接合焊盘的第一子集中的相应的一个和封装衬底或引线框之间，使得接合焊盘的第二子集不附接到封装衬底或 引线框架 金属柱头凸块固定到接合垫的第二子集中的一个或多个中的每一个上。 集成电路模块还包括模制化合物，该模制化合物至少与集成电路器件的第一表面接触并且基本上围绕结合线或带状线以及金属柱状凸块。

公开(公告)号：US20140017876A1

公开(公告)日：2014-01-16

申请号：US14027051

申请日：2013-09-13

Applicant: Infineon Technologies AG

Inventor： Hans-Joachim Barth ,  Andre Hanke ,  Snezana Jenei ,  Oliver Nagy ,  Jiro Morinaga ,  Bernd Adler ,  Heinrich Koerner

IPC: H01L21/71

CPC classification number: H01L21/71 ,  H01L23/49822 ,  H01L23/552 ,  H01L23/585 ,  H01L23/66 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Structures of a system on a chip are disclosed. In one embodiment, the system on a chip (SoC) includes an RF component disposed on a first part of a substrate, a semiconductor component disposed on a second part of the substrate, the semiconductor component and the RF component sharing a common boundary, and a conductive cage disposed enclosing the RF component. The conductive cage shields the semiconductor component from electromagnetic radiation originating from the RF circuit.

Abstract translation: 公开了一种芯片上的系统的结构。 在一个实施例中，芯片上的系统（SoC）包括设置在基板的第一部分上的RF部件，设置在基板的第二部分上的半导体部件，共享公共边界的半导体部件和RF部件，以及 布置成围绕RF部件的导电笼。 导电笼罩半导体元件不受来自RF电路的电磁辐射。