公开(公告)号：US20190103690A1

公开(公告)日：2019-04-04

申请号：US15721546

申请日：2017-09-29

Applicant: INTEL CORPORATION

Inventor： Xiang LI ,  George VERGIS ,  Douglas HEYMANN

IPC: H01R12/73 ,  H01R12/72 ,  H01R12/83 ,  H05K1/02

Abstract: Embodiments include devices, systems, and methods relating to removing heat from a memory module in a connector. One embodiment relates to a memory module connector comprising a first arm, a second arm, and a body portion positioned between the first arm and the second arm, the body portion configured to accept a memory module therein. The memory module connector includes a structure coupled to the first arm and configured to be electrically coupled to a printed circuit board. The memory module connector also includes a heat spreader coupled to the first arm, the heat spreader configured to be brought into thermal contact with a memory module component. Other embodiments are described and claimed.

公开(公告)号：US20180358727A1

公开(公告)日：2018-12-13

申请号：US15622001

申请日：2017-06-13

Applicant: INTEL CORPORATION

Inventor： Xiang LI ,  George VERGIS

IPC: H01R12/72 ,  H01R12/73 ,  H01R43/20

CPC classification number: H01R12/721 ,  H01R12/727 ,  H01R12/737 ,  H01R43/205

Abstract: A surface mount connector includes a housing including inner surfaces surrounding a card edge region, and outer surfaces defining an exterior region. The connector also includes a recess in at least one of the outer surfaces, the recess sized to accept a removably engageable arm therein. The connector also defines a cross-sectional width that is smaller in the recess than at a position adjacent to the recess. Other embodiments are described and claimed.

公开(公告)号：US20240421516A1

公开(公告)日：2024-12-19

申请号：US18821088

申请日：2024-08-30

Applicant: Intel Corporation

Inventor： Xiang LI ,  George VERGIS

IPC: H01R12/70 ,  H01R13/20 ,  H05K1/11

Abstract: Examples include techniques for a module connector design to improve pin connection. The techniques include covering top and bottom cavities of a connector that includes connector pins arranged to be coupled with a printed circuit board via a reflow soldering process to prevent a film from forming on the connector pins during or after the reflow soldering process.

公开(公告)号：US20240397628A1

公开(公告)日：2024-11-28

申请号：US18797211

申请日：2024-08-07

Applicant: Intel Corporation

Inventor： Landon HANKS ,  Douglas HEYMANN ,  Xiang LI ,  Ariadna HERNANDEZ VAZQUEZ

IPC: H05K1/18 ,  H05K1/02 ,  H05K1/11

Abstract: Apparatus and methods for conductive memory module notch and connector-to-motherboard pins for power or ground. A memory module includes a conductive notch that is coupled to either one or more ground planes in respective layers in the memory module's PCB or to a power rail formed on one or more layers in the PCB. A memory module connector includes a notch pin that is configured to mate with the conductive notch when the memory module is installed in the connector. The connector is mounted to a motherboard or the like and the notch pin is coupled to either power (e.g., Vin) or ground in the motherboard. When coupled to power, Vin is supplied to the memory module via the notch pin/conductive notch. When coupled to ground on the motherboard, at least a portion of the ground planes in the PCB are coupled to ground via the notch pin/conductive notch.

公开(公告)号：US20240364037A1

公开(公告)日：2024-10-31

申请号：US18768742

申请日：2024-07-10

Applicant: Intel Corporation

Inventor： Landon HANKS ,  Douglas HEYMANN ,  John R. DREW ,  Xiang LI

IPC: H01R13/24

CPC classification number: H01R13/2478

Abstract: Compression Attached Memory Module (CAMM) connector pin with multi-spring (dual bend direction) levers and associated connectors. The connector pin comprises an upper cantilevered spring member coupled to an upper portion of a body and a lower cantilevered spring member coupled to a lower portion of the body. Each of the upper and lower cantilevered spring members include at least one forward bending lever and a backward bending lever. The upper cantilevered spring member may have a pair of arms merging to form an upper unified spring member having a nose and looping backwards over the arms and having an apex. A lower cantilevered spring may have a pair of legs merging to form a lower unified spring member having a nose and looping backwards under the legs and having a bottom. When compressed the forward and backward bending levers counteract one another in the horizontal plane, reducing horizontal displacement.

公开(公告)号：US20240080988A1

公开(公告)日：2024-03-07

申请号：US18506951

申请日：2023-11-10

Applicant: Intel Corporation

Inventor： Todd A. HINCK ,  Michael T. CROCKER ,  Xiang LI ,  Vijaya K. BODDU

IPC: H05K1/18 ,  H05K1/02 ,  H05K7/14

CPC classification number: H05K1/181 ,  H05K1/0209 ,  H05K7/1429 ,  H05K2201/10159 ,  H05K2201/10378

Abstract: A system includes a processor, such as a CPU, surrounded by high-density memory with lower profile than a standard DIMM. The low profile, high-density memory provides multiple memory channels for the processor. With the memory configuration, the system can maintain the memory configurability with increased density and increased memory channels for the processor.

公开(公告)号：US20230006374A1

公开(公告)日：2023-01-05

申请号：US17899379

申请日：2022-08-30

Applicant: Intel Corporation

Inventor： Min Suet LIM ,  Luis Carlos ALVAREZ MATA ,  Ankita TIWARI ,  Xiang LI ,  Jun LIAO

IPC: H01R12/71 ,  H01L23/00 ,  H01L23/32 ,  H01L23/40 ,  H01L25/065 ,  H01R13/24

Abstract: A system connects a board to a substrate through an interposer board having compressible connectors through the interposer board. The connectors through the interposer board are compression-based connector pins that extends above and below the interposer board to make electrical contact between the board and the substrate. The system can include a plate to secure the board to the substrate and compress the compression-based connectors of the interposer board.

公开(公告)号：US20230005882A1

公开(公告)日：2023-01-05

申请号：US17902740

申请日：2022-09-02

Applicant: Intel Corporation

Inventor： George VERGIS ,  Min Suet LIM ,  Luis Carlos ALVAREZ MATA ,  Ankita TIWARI ,  Xiang LI

IPC: H01L25/065 ,  H01L23/40 ,  H01L25/18 ,  H01R12/71 ,  H01R13/24 ,  H01L23/50

Abstract: Memory on Package (MOP) apparatus with reverse CAMM (Compression Attached Memory Module) and compression mount technology (CMT) connector(s). The MOP includes a first (MOP) substrate to which one or more CPUs, SoC, and XPUs that is operatively coupled to one or more CAMMs with a CMT connector(s) disposed between an array of CMT contact pads on the CAMM substrate and an array of CMT contact pad on the substrate. The one or more CAMMs are include multiple memory chips or packages such as LP DDR chips or DDR (S)DRAM chips/packages mounted to an underside of the CAMM substrate via signal coupling means such as a ball grid array (BGA), where the CAMM orientation is inverted such that the memory chips/packages are disposed downward, resulting in a reduced Z-height of the MOP. A MOP may include two CAMMs with a respective CMT connector disposed between the CAMM substrates and the MOP substrate.

公开(公告)号：US20220361328A1

公开(公告)日：2022-11-10

申请号：US17871686

申请日：2022-07-22

Applicant: Intel Corporation

Inventor： Xiang LI ,  Konika GANGULY ,  Tongyan ZHAI ,  George VERGIS ,  Anthony M. CONSTANTINE ,  Jun LIAO

IPC: H05K1/11 ,  H05K1/18 ,  G06F1/18

Abstract: Power conversion modules using compression mount technology (CMT) connectors and associated apparatus and methods. Assemblies include a CMT connector that includes an array of spring-loaded CMT pins or contacts that are configured to contact respective pads on a pair of printed circuit board (PCBs), such as for VR module card or power conversion module and a motherboard. The power conversion modules in combination with the CMT connectors provide several advantages, including, a common VR module/power conversion module/motherboard footprint across OEM platforms and test hardware, just in time VR module attachment for improved inventory management, removable power delivery solution makes the platform more conducive to debug, in field servicing, and platform upgradable for higher power CPU/GPU/XPU.

公开(公告)号：US20210183410A1

公开(公告)日：2021-06-17

申请号：US17132504

申请日：2020-12-23

Applicant: Intel Corporation

Inventor： Xiang LI ,  George VERGIS ,  Konika GANGULY

IPC: G11C5/04 ,  G11C5/06 ,  H01L23/00 ,  H01L23/538

Abstract: An apparatus is described. The apparatus includes a module to plug-into a printed circuit board. The module has a connector along a center axis of the module. The module further has a first semiconductor chip disposed in a first region of the module that resides between an edge of the module and a side of the connector. The module has a second semiconductor chip disposed in a second region of the module that resides between an opposite edge of the module and an opposite side of the connector.