公开(公告)号：US20240121890A1

公开(公告)日：2024-04-11

申请号：US17963138

申请日：2022-10-10

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur J. Higby ,  DAVID CLIFFORD LONG ,  James Busby ,  William Santiago-Fernandez ,  John R. Dangler ,  Russell A. Budd ,  Philipp K Buchling Rego ,  Hannah Wendling ,  Lauren Boston

IPC: H05K1/02 ,  H05K5/02

CPC classification number: H05K1/0275 ,  H05K1/0292 ,  H05K5/0208 ,  H05K5/0217

Abstract: A structure of a circuitry substrate for securing an area from tampering is disclosed. The structure includes a circuitry substrate with at least one of a top tamper enclosure and a bottom tamper enclosure covering a component in a protected area of the circuitry substrate. The top and bottom tamper enclosures are adhesively bonded to a surface of the circuitry substrate, and a tear initiation site is added to a side of the perimeter of circuitry substrate bordering the protected area that includes at least one tamper enclosure, such that the tear initiation site is located and configured to enable propagation of a delamination of at least one internal layer of the circuitry substrate and a severing of a security circuit when a removal force is applied to the at least one of the top tamper enclosure and the bottom tamper enclosure.

公开(公告)号：US11822707B2

公开(公告)日：2023-11-21

申请号：US17335185

申请日：2021-06-01

Applicant: International Business Machines Corporation

Inventor： William Santiago-Fernandez ,  Russell A. Budd ,  James Busby ,  Arthur J Higby ,  Michael Fisher ,  Silvio Dragone ,  Stefano Sergio Oggioni ,  David Clifford Long

IPC: G06F21/87 ,  H05K1/02

CPC classification number: G06F21/87 ,  H05K1/0275 ,  H05K2201/10151

Abstract: A tamper detection system may include organic material and a tamper detection circuit embedded in the organic material. A portion of the organic material is ablated away to form an incision in the organic material. A portion of the tamper detection circuit obstructs a fragment of the ablation path. The tamper detection circuit remains intact. The incision enables a gas flow between a first side of the organic material and a second side of the organic material.

公开(公告)号：US11765816B2

公开(公告)日：2023-09-19

申请号：US17399302

申请日：2021-08-11

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur J. Higby ,  William L. Brodsky ,  Levi Campbell ,  David Clifford Long ,  James Busby ,  Philipp K. Buchling Rego

IPC: H05K1/02 ,  H05K5/03

CPC classification number: H05K1/0275 ,  H05K1/0213 ,  H05K5/03

Abstract: Tamper-respondent assemblies are provided which include an enclosure mounted to a circuit board and enclosing one or more components to be protected within a secure volume. A tamper-respondent sensor covers, at least in part, an inner surface of the enclosure, and includes at least one tamper-detect circuit. A monitor circuit is disposed within the secure volume to monitor the tamper-detect circuit(s) for a tamper event. A pressure connector assembly is also disposed within the secure volume, between the tamper-respondent sensor and the circuit board. The pressure connector assembly includes a conductive pressure connector electrically connecting, at least in part, the monitor circuit and the tamper-detect circuit(s) of the tamper-respondent assembly, and a spring-biasing mechanism to facilitate breaking electrical connection of the conductive pressure connector to the tamper-detect circuit(s) with a tamper event.

公开(公告)号：US20230228824A1

公开(公告)日：2023-07-20

申请号：US18188963

申请日：2023-03-23

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  James Busby ,  Edward N. Cohen ,  John R. Dangler ,  Gerald Bartley ,  Michael Fisher ,  Arthur Higby ,  David Clifford Long ,  Mark J. Jeanson ,  Darryl Becker

IPC: G01R31/52 ,  H05K1/02 ,  G06F30/30 ,  H05K7/20 ,  H05K3/00 ,  G01K15/00 ,  H02H7/20

CPC classification number: G01R31/52 ,  G01K15/007 ,  G06F30/30 ,  H02H7/20 ,  H05K1/0201 ,  H05K1/0277 ,  H05K3/0005 ,  H05K7/20209 ,  H05K2201/012

Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

公开(公告)号：US20220201839A1

公开(公告)日：2022-06-23

申请号：US17124621

申请日：2020-12-17

Applicant: International Business Machines Corporation

Inventor： John R. Dangler ,  Arthur J. Higby ,  Philipp K. Buchling Rego ,  DAVID CLIFFORD LONG ,  James Busby ,  MATTHEW DOYLE ,  Edward N. Cohen ,  MICHAEL FISHER ,  William Santiago-Fernandez

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/44 ,  H05K5/02

Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.

公开(公告)号：US20210165051A1

公开(公告)日：2021-06-03

申请号：US16702077

申请日：2019-12-03

Applicant: International Business Machines Corporation

Inventor： Matthew Doyle ,  James Busby ,  Edward N. Cohen ,  John R. Dangler ,  Gerald Bartley ,  Michael Fisher ,  Arthur Higby ,  David Clifford Long ,  Mark J. Jeanson ,  Darryl Becker

IPC: G01R31/52 ,  H05K1/02 ,  G06F30/30 ,  H02H7/20 ,  H05K7/20 ,  H05K3/00 ,  G01K15/00

Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.

公开(公告)号：US10932374B2

公开(公告)日：2021-02-23

申请号：US16792233

申请日：2020-02-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Arthur Higby ,  James Busby ,  David C. Long ,  Robert Weiss ,  Michael Fisher ,  Tristen Gaudette

IPC: H05K1/02 ,  H05K3/32 ,  H05K3/36 ,  H01L21/56 ,  H01L23/13 ,  H01L23/34 ,  H01L23/36 ,  B29C33/00 ,  B29C33/12 ,  B29C44/02 ,  B29C44/08 ,  B29C44/12 ,  B29C70/00 ,  B29C70/02 ,  B29C70/84 ,  H05K3/46 ,  G06F21/87 ,  H01L23/31

Abstract: A process for deforming a flex circuit using a fixture assembly including a base plate having a recess, a wrinkle reducer plate, a stiffening block and a punch. The process including heating the fixture assembly; applying a force to the punch deforming the flex circuit into the recess in the base plate; holding the punch in contact with the flex circuit while heating the fixture assembly; cooling the fixture assembly with the punch in contact with the flex circuit; subsequent to cooling the fixture assembly, removing the force of the punch; and removing the flex circuit from the fixture assembly. The flex circuit having a recessed portion resulting from deforming the flex circuit into the recess in the base plate and a flat portion surrounding the recessed portion.

公开(公告)号：US20190384942A1

公开(公告)日：2019-12-19

申请号：US16007408

申请日：2018-06-13

Applicant: International Business Machines Corporation

Inventor： Silvio Dragone ,  Michael Fisher ,  William Santiago Fernandez ,  Ryan Elsasser ,  James Busby ,  John R. Dangler ,  William L. Brodsky ,  David C. Long ,  Stefano S. Oggioni

IPC: G06F21/87 ,  H01L41/04 ,  H01L41/047 ,  H01L41/053 ,  H01L41/113 ,  H01L41/18 ,  H01L41/23 ,  H01L41/37

Abstract: The present invention relates to a method to fabricate a tamper respondent assembly. The tamper respondent assembly includes an electronic component and an enclosure fully enclosing the electronic component. The method includes printing, by a 3-dimensional printer, a printed circuit board that forms a bottom part of the enclosure and includes a first set of embedded detection lines for detecting tampering events and signal lines for transferring signals between the electronic component and an external device. The electronic component is assembled on the printed circuit board, and a cover part of the enclosure is printed on the printed circuit board. The cover part includes a second set of embedded detection lines. Sensing circuitry can be provided for sensing the conductance of the first set of embedded detection lines and the second set of embedded detection lines to detect tampering events.