APPARATUS TO DETECT CABLE SEATING OR DISTURBANCE

    公开(公告)号:US20180336377A1

    公开(公告)日:2018-11-22

    申请号:US15599652

    申请日:2017-05-19

    Abstract: A displacement sensor that includes a stationary printed circuit board which includes a first capacitor pad, an indicator, and a battery electrically communicating with the first capacitor pad and the indicator and a sliding card which includes a second capacitor pad, the first capacitor pad and the second capacitor pad being orientated to face each other and in an overlapping relation to each other. An overlap being defined by the first capacitor pad and the second capacitor pad, wherein the overlap of the first capacitor pad and the second capacitor pad generates a capacitance, the generated capacitance changes as the sliding card moves as a result of a change in the overlap of the first capacitor pad and the second capacitor pad. The indicator is activated when the generated capacitance change reaches a threshold value.

    Cable cassette apparatus
    22.
    发明授权

    公开(公告)号:US10095278B2

    公开(公告)日:2018-10-09

    申请号:US15071440

    申请日:2016-03-16

    Abstract: An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.

    CABLE CASSETTE APPARATUS
    23.
    发明申请

    公开(公告)号:US20180224906A1

    公开(公告)日:2018-08-09

    申请号:US15945857

    申请日:2018-04-05

    CPC classification number: G06F1/183

    Abstract: An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.

    Distribution of power vias in a multi-layer circuit board
    24.
    发明授权
    Distribution of power vias in a multi-layer circuit board 有权
    在多层电路板中分配电源通孔

    公开(公告)号:US09594865B2

    公开(公告)日:2017-03-14

    申请号:US14717026

    申请日:2015-05-20

    Abstract: One aspect is a method that includes identifying, by a power via placement tool executing on a processor of a circuit design system, a source and a sink of a voltage domain of a multi-layer circuit board based on a design file defining a layout of the multi-layer circuit board. A number of power vias to support a maximum current demand from the source to the sink is determined. Positions of a plurality of the power vias are determined at locations of the multi-layer circuit board forming paths through the power vias between the source and the sink and having a substantially equal total path length through each total path defined between the source and the sink through at least one of the power vias. The design file is modified to include the power vias at the positions.

    Abstract translation: 一个方面是一种方法,其包括通过在电路设计系统的处理器上执行的电力通过放置工具来识别基于设计文件的多层电路板的电压域的源极和接收器,该设计文件定义了 多层电路板。 确定支持从源到汇的最大电流需求的多个电源通孔。 在多层电路板的位置处确定多个电源通孔的位置,该位置通过源极和漏极之间的电力通孔形成通路,并具有基本上相等的总路径长度,通过在源极和漏极之间限定的每个总路径 通过至少一个电源通孔。 设计文件被修改为在位置包括电源通孔。

    PAD-TO-PAD EMBEDDED CAPACITANCE IN LIEU OF SIGNAL VIA TRANSITIONS IN PRINTED CIRCUIT BOARDS
    25.
    发明申请
    PAD-TO-PAD EMBEDDED CAPACITANCE IN LIEU OF SIGNAL VIA TRANSITIONS IN PRINTED CIRCUIT BOARDS 审中-公开
    PAD-TO-PAD嵌入式电容通过印刷电路板中的转换取代信号

    公开(公告)号:US20170004923A1

    公开(公告)日:2017-01-05

    申请号:US14755551

    申请日:2015-06-30

    Abstract: In one embodiment, a method includes positioning a first signal pad in a first layer of a printed circuit board and positioning a second signal pad in a second layer of the printed circuit board. The second signal pad is positioned to form an embedded capacitance between the first signal pad and the second signal pad. The embedded capacitance between the first signal pad and the second signal pad is configured to carry a signal between the first layer and the second layer absent a signal via.

    Abstract translation: 在一个实施例中,一种方法包括将第一信号焊盘定位在印刷电路板的第一层中,并将第二信号焊盘定位在印刷电路板的第二层中。 定位第二信号垫以在第一信号焊盘和第二信号焊盘之间形成嵌入的电容。 第一信号焊盘和第二信号焊盘之间的嵌入电容被配置为在没有信号通孔的情况下在第一层和第二层之间传送信号。

    DIMM connector region vias and routing
    26.
    发明授权
    DIMM connector region vias and routing 有权
    DIMM连接器区域通孔和路由

    公开(公告)号:US09444162B1

    公开(公告)日:2016-09-13

    申请号:US15086716

    申请日:2016-03-31

    Abstract: A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.

    Abstract translation: 提供双列直插式内存模块(DIMM)连接器系统。 DIMM连接器系统包括主板,DIMM卡和DIMM卡与主板耦合的连接器。 主板包括由中间损耗介电常数材料形成的印刷电路板(PCB),比接地焊盘更薄的信号焊盘,靠近信号焊盘设置的接地焊盘,连接到信号焊盘的远端边缘的信号通孔和共享的反焊盘。 DIMM卡包括由中间损耗介电常数材料形成的印刷电路板(PCB),比接地焊盘薄的信号焊盘,连接到信号焊盘的远端边缘的信号通孔和用于相应的信号通道对的共用反接头。

    ELECTROCHROMIC OPTICAL SWITCH
    28.
    发明申请

    公开(公告)号:US20230024042A1

    公开(公告)日:2023-01-26

    申请号:US17380698

    申请日:2021-07-20

    Abstract: A device, a method, and an article of manufacture are disclosed. The device includes a first optical fiber, a second optical fiber, an electrochromic component positioned between tips of the optical fibers, and a voltage source connected to the electrochromic component. The method includes providing an electrochromic component, providing optical fibers and a voltage source, and assembling an optical switch that includes the electrochromic component, the optical fibers, and the voltage source. The voltage source is connected to the electrochromic component. The article of manufacture includes an optical switch with a voltage source connected to an electrochromic component positioned between optical fiber tips.

    Buried via in a circuit board
    29.
    发明授权

    公开(公告)号:US11310921B2

    公开(公告)日:2022-04-19

    申请号:US16660861

    申请日:2019-10-23

    Abstract: A method may include forming a plurality of multilayer cores wherein each multilayer core comprises a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material, patterning each layer of metal in the plurality of multilayer cores to form wiring traces in each layer of metal, embedding a solder element in at least one sheet of a plurality of sheets of uncured dielectric material, wherein the solder element having a melting point temperature within a temperature range of a curing temperature of the uncured dielectric material, forming a printed circuit board by alternately stacking the plurality of multilayer cores with the plurality of sheets of uncured dielectric material between each multilayer core, laminating the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material and melting of the solder element.

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