Abstract:
A displacement sensor that includes a stationary printed circuit board which includes a first capacitor pad, an indicator, and a battery electrically communicating with the first capacitor pad and the indicator and a sliding card which includes a second capacitor pad, the first capacitor pad and the second capacitor pad being orientated to face each other and in an overlapping relation to each other. An overlap being defined by the first capacitor pad and the second capacitor pad, wherein the overlap of the first capacitor pad and the second capacitor pad generates a capacitance, the generated capacitance changes as the sliding card moves as a result of a change in the overlap of the first capacitor pad and the second capacitor pad. The indicator is activated when the generated capacitance change reaches a threshold value.
Abstract:
An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.
Abstract:
An apparatus includes a cassette. The cassette includes a carriage. The carriage is retained internally to the cassette. The apparatus further includes a booklet assembly. The booklet assembly includes a cable connector. The cable connector is affixed internally to the booklet assembly. The cassette is configured for insertion into the booklet assembly. The apparatus further includes a cable assembly. The cable assembly is configured for insertion into the cable connector. The carriage is configured for retaining the cable assembly. In an aspect, a method of using the apparatus includes preloading the cable assembly into the carriage, inserting the cassette into the booklet assembly, and configuring the carriage such that the cable assembly is inserted into the cable connector and retained in an inserted position by the carriage.
Abstract:
One aspect is a method that includes identifying, by a power via placement tool executing on a processor of a circuit design system, a source and a sink of a voltage domain of a multi-layer circuit board based on a design file defining a layout of the multi-layer circuit board. A number of power vias to support a maximum current demand from the source to the sink is determined. Positions of a plurality of the power vias are determined at locations of the multi-layer circuit board forming paths through the power vias between the source and the sink and having a substantially equal total path length through each total path defined between the source and the sink through at least one of the power vias. The design file is modified to include the power vias at the positions.
Abstract:
In one embodiment, a method includes positioning a first signal pad in a first layer of a printed circuit board and positioning a second signal pad in a second layer of the printed circuit board. The second signal pad is positioned to form an embedded capacitance between the first signal pad and the second signal pad. The embedded capacitance between the first signal pad and the second signal pad is configured to carry a signal between the first layer and the second layer absent a signal via.
Abstract:
A dual in-line memory module (DIMM) connector system is provided. The DIMM connector system includes a motherboard, a DIMM card and a connector by which the DIMM card is coupled with the motherboard. The motherboard includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, ground pads disposed proximate to signal pads, signal vias connected to distal edges of signal pads and shared antipads. The DIMM card includes a printed circuit board (PCB) formed of a mid-loss dielectric constant material, signal pads that are thinner than ground pads, signal vias connected to distal edges of signal pads and shared antipads for respective pairs of signal vias.
Abstract:
A method, a device, and a composition are disclosed. The method includes providing a polyol blend that includes a polyol resin and an electromagnetic (EMA) additive, providing an isocyanate resin selected such that blending the isocyanate resin with the polyol blend results in an EMA spray foam. The device includes a first compartment containing an isocyanate resin and a second compartment containing a polyol blend, which includes a polyol resin and an EMA additive. The composition includes a polyurethane spray foam and an EMA additive blended into the polyurethane spray foam.
Abstract:
A device, a method, and an article of manufacture are disclosed. The device includes a first optical fiber, a second optical fiber, an electrochromic component positioned between tips of the optical fibers, and a voltage source connected to the electrochromic component. The method includes providing an electrochromic component, providing optical fibers and a voltage source, and assembling an optical switch that includes the electrochromic component, the optical fibers, and the voltage source. The voltage source is connected to the electrochromic component. The article of manufacture includes an optical switch with a voltage source connected to an electrochromic component positioned between optical fiber tips.
Abstract:
A method may include forming a plurality of multilayer cores wherein each multilayer core comprises a sheet of cured dielectric material having a layer of metal on each side of the sheet of cured dielectric material, patterning each layer of metal in the plurality of multilayer cores to form wiring traces in each layer of metal, embedding a solder element in at least one sheet of a plurality of sheets of uncured dielectric material, wherein the solder element having a melting point temperature within a temperature range of a curing temperature of the uncured dielectric material, forming a printed circuit board by alternately stacking the plurality of multilayer cores with the plurality of sheets of uncured dielectric material between each multilayer core, laminating the stack of multilayer cores and sheets of uncured dielectric material to cause curing of the sheets of uncured dielectric material and melting of the solder element.
Abstract:
Provided is a method for masking a sensitive signal by injecting noise into planes of a printed circuit board (PCB). The method comprises detecting, by a secondary integrated circuit (IC), a noise signal on a shared plane of a PCB that includes the secondary IC. The noise signal may be analyzed to determine the characteristics of the noise signal. A masking signal may be generated based on the characteristics. The masking signal may then be injected onto the shared plane.