公开(公告)号：US20210351106A1

公开(公告)日：2021-11-11

申请号：US16871424

申请日：2020-05-11

Applicant: Intel Corporation

Inventor： Prabhakar SUBRAHMANYAM ,  Tewodros WONDIMU ,  Ying-Feng PANG ,  Muhammad AHMAD ,  Paul DIGLIO ,  David SHIA ,  Pooya TADAYON

IPC: H01L23/427 ,  G01R31/26 ,  B05B1/14

Abstract: Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

公开(公告)号：US20210043537A1

公开(公告)日：2021-02-11

申请号：US16986122

申请日：2020-08-05

Applicant: Intel Corporation

Inventor： Barrett M. FANEUF ,  Phil GENG ,  Kenan ARIK ,  David SHIA ,  Casey WINKEL ,  Sandeep AHUJA ,  Eric D. MCAFEE ,  Jeffory L. SMALLEY ,  Minh T.D. LE ,  Ralph V. MIELE ,  Marc MILOBINSKI ,  Aaron P. ANDERSON ,  Brendan T. PAVELEK

IPC: H01L23/367 ,  G11C5/06 ,  H05K7/14 ,  H05K7/20

Abstract: An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

公开(公告)号：US20160263714A1

公开(公告)日：2016-09-15

申请号：US15162513

申请日：2016-05-23

Applicant: INTEL CORPORATION

Inventor： Jin YANG ,  David SHIA

IPC: B23P15/26

CPC classification number: B23P15/26 ,  B23P2700/09 ,  F28D15/02 ,  F28D15/0241 ,  F28F2013/005 ,  F28F2280/08 ,  H01L23/427 ,  H01L23/4338 ,  H01L24/72 ,  H01L2224/16225 ,  H01L2224/73251 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/16 ,  H01L2224/72

Abstract: Assemblies and methods are described. One assembly includes a first plate and a second plate. The assembly also includes an adjustable heat pipe positioned between the first plate and the second plate, the adjustable heat pipe being in thermal contact with the first plate and the second plate. In another aspect, a plurality of springs may be positioned between the first plate and the second plate. Other embodiments are described and claimed.

Abstract translation: 描述装配和方法。 一个组件包括第一板和第二板。 组件还包括位于第一板和第二板之间的可调热管，可调热管与第一板和第二板热接触。 在另一方面，多个弹簧可以位于第一板和第二板之间。 描述和要求保护其他实施例。