公开(公告)号：US20050258445A1

公开(公告)日：2005-11-24

申请号：US10847225

申请日：2004-05-18

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L33/48 ,  H01L33/62 ,  H01L33/00

CPC classification number: H01L33/486 ,  H01L24/73 ,  H01L33/62 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/12041 ,  H05K1/112 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

Abstract: A submount is used to mount a diode between two metal areas on the upper surface of a substrate. One of the areas is connected to a metal plate at the lower surface of the substrate through a via. The submount is clamped between two metal sheets. The top metal sheet has a through-hole for anchoring and self-aligning the diode. The electrodes of the diode are each coupled to one of the clamping metal sheets. Clamping metals provide pressure contact without soldering to the contact. But soldering can be alternatively used to enhance product reliability. Either the top metal sheet or the bottom metal sheet can be fully or selectively coating of solder for batch soldering at the contact point upon heating. The large metal plates and the large metal clamping sheets provide good heat sink and speedy soldering.

Abstract translation: 基座用于在基板的上表面上的两个金属区域之间安装二极管。 其中一个区域通过通孔连接到基板的下表面处的金属板。 底座夹在两块金属板之间。 顶部金属板具有用于锚定和自对准二极管的通孔。 二极管的电极各自联接到夹紧金属片之一。 夹紧金属提供压力接触而不焊接到触点。 但是可以替代地使用焊接来提高产品的可靠性。 顶部金属片或底部金属片可以在加热时在接触点处完全或选择性地涂覆焊料以进行批量焊接。 大金属板和大金属夹板提供良好的散热器和快速焊接。

公开(公告)号：US06767112B2

公开(公告)日：2004-07-27

申请号：US10156286

申请日：2002-05-29

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: F21V700

CPC classification number: F21V29/70 ,  F21V7/0025 ,  F21V7/16 ,  F21V11/14 ,  F21V13/04 ,  F21V14/04 ,  F21V29/004 ,  F21V29/74 ,  F21V29/83 ,  F21V29/89 ,  F21V2200/17 ,  F21Y2107/60 ,  F21Y2113/13 ,  F21Y2113/17 ,  F21Y2115/10 ,  G02B6/0006 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/648 ,  H01L2224/48091 ,  H01L2924/12041 ,  Y10S362/80 ,  H01L2924/00014

Abstract: One or more LED panel is used as a light source of a light projector. The LEDs are mounted on a panel and arranged as a matrix array. The light emitted from the LEDs are reflected by a reflecting cup. The LEDs are connected to two separate metal parts each connected the two electrodes of the LEDs. The spaces between the LEDs are utilized for light passage.

Abstract translation: 一个或多个LED面板用作光投影仪的光源。 LED安装在面板上并排列成矩阵阵列。 从LED发出的光被反射杯反射。 LED连接到两个分开的金属部件，每个金属部件连接着LED的两个电极。 LED之间的空间用于光通过。

公开(公告)号：US06465885B1

公开(公告)日：2002-10-15

申请号：US09690708

申请日：2000-10-18

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L2348

CPC classification number: H01L24/81 ,  H01L23/49586 ,  H01L23/49894 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/81801 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The soldering pads on metal contacts for connection to the electrodes of a semiconductor diode chip are surrounded with a coating of insulating material to prevent the spreading of the molten solder, which may cause misalignment of the chip with respect to the package.

Abstract translation: 用于连接到半导体二极管芯片的电极的金属触头上的焊盘被绝缘材料涂层围绕，以防止熔融焊料的扩散，这可能导致芯片相对于封装件的未对准。

公开(公告)号：US06291841B1

公开(公告)日：2001-09-18

申请号：US09480353

申请日：2000-01-10

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L3300

CPC classification number: H01L33/62 ,  H01L33/40 ,  H01L2224/48091 ,  H01S5/02 ,  H01S5/0425 ,  H01L2924/00014

Abstract: Flat metal strips are used to make connections to a laser diode so that the interconnections are parallel to the surface of the semiconductor device and the structure has a lower profile than a wire-bonded package. The contacts can be made with conducting glue or hard pressed by a lid before sealing with glue.

Abstract translation: 平板金属条用于连接激光二极管，使得互连平行于半导体器件的表面，并且该结构具有比引线键合封装更低的外形。 触点可以用导电胶制成，或者在用胶水密封之前用盖子硬压。

公开(公告)号：US08524541B2

公开(公告)日：2013-09-03

申请号：US13548067

申请日：2012-07-12

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L29/24

CPC classification number: H01L33/62 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.

Abstract translation: 具有扩展的顶部电极和延伸的底部电极的LED封装由单个金属片制成，一个制造工艺实施例包括：准备一片单一金属片，形成第一金属和共面第二金属，将LED安装在 将第一金属的内端，引线接合顶部电极连接到第二金属的内端，至少用保护胶封装LED和接合线，将第一金属的外端向上弯曲两次90度以形成 顶部平坦，作为包装的延伸顶部电极，并且将第二金属的外端向下弯曲两次90度，以形成作为包装的延伸底部电极的底部平面。

公开(公告)号：US20080037263A1

公开(公告)日：2008-02-14

申请号：US11893161

申请日：2007-08-16

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: F21V21/00

CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: A light emitting device with a top electrode and a bottom electrode is pushed by a plug to make contacts with either an upper metal plate or a lower metal plate each serving as one of the leads for an electrode of the light emitting devices. The plug is inserted through an opening larger than the light emitting device in the metal plate not in contact with the light emitting device but serving as another lead for the light emitting device. The plug is locked in place by means of threaded screw heads, snug-fit, snap-on buttons or an elastic sleeve. Thus, the light emitting device can be easily replaced without any wire bonding. A plurality of the light unit can be sandwiched between the upper metal plate and the lower metal plate.

Abstract translation: 具有顶部电极和底部电极的发光器件被插头推动以与用作发光器件的电极的引线之一的上金属板或下金属板接触。 插头插入大于不与发光器件接触的金属板中的发光器件的开口，但是用作发光器件的另一引线。 插头通过螺纹螺钉头，贴合，卡扣式按钮或弹性套筒锁定在适当的位置。 因此，可以容易地更换发光器件而没有任何引线接合。 多个光单元可夹在上金属板和下金属板之间。

公开(公告)号：US20070170456A1

公开(公告)日：2007-07-26

申请号：US11728610

申请日：2007-03-27

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: The leads of a light emitting diode are made coaxial. The inner lead protrudes lower than the outer lead. The package is inserted into a spongy display panel for power supply. The display panel has three layers: a lower conducting layer for contacting said inner lead and a top conducting layer for contacting said outer layer, and an insulating layer between the top and the bottom layer. For LED with a bottom electrode and a top electrode, the LED can be mounted on the planar tops of the inner lead and the top electrode wire bonded to the outer lead, or the LED can be mounted on the side surface of the inner lead and the top electrode wire bonded to the outer lead. For LED with two bottom electrode, the LED electrodes can straddle over the planar tops of the inner lead and the outer lead, or the LED electrodes can straddle over the telescopic side surfaces of the two leads.

公开(公告)号：US20060232966A1

公开(公告)日：2006-10-19

申请号：US11105745

申请日：2005-04-15

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: F21V11/00

CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: A light emitting device with a top electrode and a bottom electrode is pushed by a plug to make contacts with either an upper metal plate or a lower metal plate each serving as one of the leads for an electrode of the light emitting devices. The plug is inserted through an opening larger than the light emitting device in the metal plate not in contact with the light emitting device but serving as another lead for the light emitting device. The plug is locked in place by means of threaded screw heads, snug-fit, snap-on buttons or an elastic sleeve. Thus, the light emitting device can be easily replaced without any wire bonding. A plurality of the light unit can be sandwiched between the upper metal plate and the lower metal plate.

Abstract translation: 具有顶部电极和底部电极的发光器件被插头推动以与用作发光器件的电极的引线之一的上金属板或下金属板接触。 插头插入大于不与发光器件接触的金属板中的发光器件的开口，但是用作发光器件的另一引线。 插头通过螺纹螺钉头，贴合，卡扣式按钮或弹性套筒锁定在适当的位置。 因此，可以容易地更换发光器件而没有任何引线接合。 多个光单元可夹在上金属板和下金属板之间。

公开(公告)号：US20050269679A1

公开(公告)日：2005-12-08

申请号：US11199925

申请日：2005-08-10

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L23/495 ,  H01L33/48

CPC classification number: H01L23/49562 ,  H01L23/49503 ,  H01L23/4951 ,  H01L23/49555 ,  H01L33/486 ,  H01L2224/05568 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2224/05599

Abstract: A supporting frame is used to solidly bridge to the two metallic contacts of a surface mount diode chip. Any bending or twisting stress between the two contacts is borne by the supporting frame instead of the diode chip. Otherwise the stress may damage the diode chip wherein said supporting forms a cantilever over said first metallic contact and the overhanging end of the cantilever is glued to said second metallic contact.

Abstract translation: 支撑框架用于牢固地桥接到表面贴装二极管芯片的两个金属触点。 两个触点之间的任何弯曲或扭转应力都由支撑框架代替二极管芯片承担。 否则，应力可能损坏二极管芯片，其中所述支撑在所述第一金属触点上形成悬臂，并且悬臂的悬伸端粘合到所述第二金属触点。

公开(公告)号：US20050146028A1

公开(公告)日：2005-07-07

申请号：US11041535

申请日：2005-01-25

Applicant: Jiahn-Chang Wu

Inventor： Jiahn-Chang Wu

IPC: H01L33/62 ,  B23K31/00 ,  B23K31/02 ,  H01L23/34

CPC classification number: H01L33/62 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: The electrodes of a light emitting diode (LED) is coupled to the terminals of a package with solderless pressure contacts. Each package is housed in a module with a bed on which the bottom electrode of the LED rests, and a pressure plate which is coupled to the top electrode of the LED. The pressure plate slides along four vertical posts to exert pressure to an LED package against a bed to form solderless pressure contacts. A plurality of LED packages can be lined up in a row to form a light strip, with the top pressure plate extended to form the bed of an adjacent module. A plurality of LED packages can also be arranged a matrix array display panel, where a plurality of lower terminals rests on one row of common bed of a number of parallel horizontal common beds, and where a plurality of upper terminals are pressed under a column of parallel vertical common pressure plates, so that any individual LED at the cross-point of a common bed and a common pressure can be randomly accessed.