公开(公告)号：US20090310076A1

公开(公告)日：2009-12-17

申请号：US12482589

申请日：2009-06-11

Applicant: Chih-Yung Hsieh ,  Chien-Hong Chen ,  Jian-Cheng Chen

Inventor： Chih-Yung Hsieh ,  Chien-Hong Chen ,  Jian-Cheng Chen

IPC: G02F1/1343 ,  H01L29/04 ,  H01L21/00

CPC classification number: G02F1/134309 ,  G02F1/133707 ,  G02F2001/133354 ,  G02F2001/134345

Abstract: In one embodiment of an invention concerning liquid crystal display devices, a first pixel electrode of a thin film transistor (TFT) array substrate may overlap a slit of a second pixel electrode of the TFT array substrate but not overlap another slit of the second pixel electrode. This may help induce a multi-domain electric field without having to precisely position a common electrode of a color filter substrate and the TFT array substrate. This may prevent position errors, enhance display quality, produce a wider viewing angle, and lower color shift sometimes associated with conventional liquid crystal display devices and methods.

Abstract translation: 在关于液晶显示装置的发明的一个实施例中，薄膜晶体管（TFT）阵列基板的第一像素电极可以与TFT阵列基板的第二像素电极的狭缝重叠，但不与第二像素电极的另一个狭缝重叠 。 这可能有助于诱导多畴电场，而不必精确地定位滤色器基板和TFT阵列基板的公共电极。 这可以防止位置误差，增强显示质量，产生更宽的视角，并且有时与常规液晶显示装置和方法相关联地降低颜色偏移。

公开(公告)号：US06700178B2

公开(公告)日：2004-03-02

申请号：US09838752

申请日：2001-04-19

Applicant: Jian-Cheng Chen ,  Wei-Min Hsiao

Inventor： Jian-Cheng Chen ,  Wei-Min Hsiao

IPC: H01L2348

CPC classification number: H01L23/49513 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0657 ,  H01L29/0657 ,  H01L2224/05599 ,  H01L2224/26145 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/078 ,  H01L2924/10157 ,  H01L2924/181 ,  H01L2924/0665 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A chip with beveled edges suitable for adhering onto a surface of a die pad by an adhesive material. The chip has an active surface and a corresponding back surface, wherein the active surface has beveled edges. The back surface of the chip is adhered onto the surface of the die pad by the adhesive material.

Abstract translation: 具有倾斜边缘的芯片，其适于通过粘合材料粘附到模具垫的表面上。 芯片具有活性表面和相应的后表面，其中活性表面具有斜边。 芯片的后表面通过粘合剂材料粘附到模片垫的表面上。

公开(公告)号：US08522171B1

公开(公告)日：2013-08-27

申请号：US13488147

申请日：2012-06-04

Applicant: Jui-Yun Chang ,  Jian-Cheng Chen ,  I-Jen Kao ,  Chih-Wei Hsu

Inventor： Jui-Yun Chang ,  Jian-Cheng Chen ,  I-Jen Kao ,  Chih-Wei Hsu

IPC: G06F17/50

CPC classification number: G06F17/5081

Abstract: The invention is directed to a method for checking a die seal ring on a layout. The method comprises steps of receiving a digital database of a layout corresponding to at least a device with a text information corresponding to the layout. Tape-out information corresponding to the layout is received. A checking process is performed according to the digital database of the layout and the tape-out information and, meanwhile, a mask design procedure for designing a mask pattern corresponding to the layout is performed by using the digital database of the layout, the text information and the tape-out information. A result of the checking process is recorded in an inspection table corresponding to the layout.

Abstract translation: 本发明涉及一种用于在布局上检查模具密封环的方法。 该方法包括以下步骤：接收与至少具有对应于布局的文本信息的设备对应的布局的数字数据库。 接收与布局相对应的磁带输出信息。 根据布局的数字数据库和输出信息进行检查处理，同时，通过使用布局的数字数据库，文本信息来执行用于设计与布局相对应的掩模图案的掩模设计过程 和输出信息。 检查处理的结果记录在与布局对应的检查表中。

公开(公告)号：US20100265422A1

公开(公告)日：2010-10-21

申请号：US12758989

申请日：2010-04-13

Applicant: Chien-Hong Chen ,  Jian-Cheng Chen ,  Rung-Nan Lu

Inventor： Chien-Hong Chen ,  Jian-Cheng Chen ,  Rung-Nan Lu

IPC: G02F1/1343 ,  G02F1/133

CPC classification number: G02F1/133707 ,  G02F1/133788 ,  G02F1/134309 ,  G02F2001/133715 ,  G02F2001/133742 ,  G02F2001/133746

Abstract: A liquid crystal (LC) display panel including a lower substrate with pixel structures, an upper substrate, and an LC layer is provided. Each of the pixel structures includes a transistor and a pixel electrode. The pixel electrode includes first and second pixel electrodes insulated from each other, respectively including a first pattern and a second pattern that different and complementary to each other. Each of the first pixel electrode and the second pixel electrode has at least a trunk with a width smaller than or equal to 10 microns and a plurality of branches. The LC layer is positioned between the upper and the lower substrates and includes a plurality of LC molecules and a plurality of polymers, which are formed on surfaces of at least one of the upper and the lower substrates to cause the plurality of LC molecules to have a pretilt angle.

Abstract translation: 提供了包括具有像素结构的下基板，上基板和LC层的液晶（LC）显示面板。 每个像素结构包括晶体管和像素电极。 像素电极包括彼此绝缘的第一和第二像素电极，分别包括彼此不同和互补的第一图案和第二图案。 第一像素电极和第二像素电极中的每一个至少具有宽度小于或等于10微米的躯干和多个分支。 LC层位于上基板和下基板之间，并且包括多个LC分子和多个聚合物，其形成在上基板和下基板中的至少一个的表面上，以使多个LC分子具有 预倾角。

公开(公告)号：US07446295B2

公开(公告)日：2008-11-04

申请号：US11532911

申请日：2006-09-19

Applicant: Jian-Cheng Chen ,  Ming-Hsiang Cheng ,  Chia-Jung Lee

Inventor： Jian-Cheng Chen ,  Ming-Hsiang Cheng ,  Chia-Jung Lee

IPC: H01L27/00

CPC classification number: H01L27/14618 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concavity is located on a surface of the substrate. The image signal processor is disposed in the concavity e, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concavity. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.

Abstract translation: 提供了包括基板，图像信号处理器，支撑板，图像传感器芯片和盖的图像传感器模块。 凹部位于基板的表面上。 图像信号处理器设置在凹部e中，并且电连接到基板。 支撑板设置在基板的表面上并覆盖凹部。 图像传感器芯片设置在支撑板上并电连接到基板。 盖子设置在基板上并覆盖图像传感器芯片。

公开(公告)号：US20080048097A1

公开(公告)日：2008-02-28

申请号：US11532911

申请日：2006-09-19

Applicant: Jian-Cheng Chen ,  Ming-Hsiang Cheng ,  Chia-Jung Lee

Inventor： Jian-Cheng Chen ,  Ming-Hsiang Cheng ,  Chia-Jung Lee

IPC: H01L27/00

CPC classification number: H01L27/14618 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/73265 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concave is located on a surface of the substrate. The image signal processor is disposed in the concave, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concave. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.

Abstract translation: 提供了包括基板，图像信号处理器，支撑板，图像传感器芯片和盖的图像传感器模块。 凹部位于基板的表面上。 图像信号处理器设置在凹部中，并且电连接到基板。 支撑板设置在基板的表面上并覆盖凹部。 图像传感器芯片设置在支撑板上并电连接到基板。 盖子设置在基板上并覆盖图像传感器芯片。

公开(公告)号：US07333263B2

公开(公告)日：2008-02-19

申请号：US11039822

申请日：2005-01-24

Applicant: Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Jian-Cheng Chen ,  Chiang-Yuan Chuang ,  Chien-Chih Lai ,  Yen-Sheng Lin ,  Ping-Hui Sophia Yeh

Inventor： Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Jian-Cheng Chen ,  Chiang-Yuan Chuang ,  Chien-Chih Lai ,  Yen-Sheng Lin ,  Ping-Hui Sophia Yeh

IPC: H01S3/00

CPC classification number: H01S3/06754 ,  C03C13/008 ,  C03C13/045 ,  H01S3/06716 ,  H01S3/1623 ,  H01S3/1643

Abstract: An optical amplifier includes an optical fiber having a core doped with transition metal ions, and at least one glass cladding enclosing the core. By using the fiber, the optical amplifier of the invention has a gain bandwidth of more than 300 nm including 1300-1600 nm band in low-loss optical communication.

Abstract translation: 光放大器包括具有掺杂有过渡金属离子的芯的光纤和包围芯的至少一个玻璃包层。 通过使用光纤，本发明的光放大器在低损耗光通信中具有大于300nm的增益带宽，包括1300-1600nm波段。

公开(公告)号：US20060164717A1

公开(公告)日：2006-07-27

申请号：US11039822

申请日：2005-01-24

Applicant: Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Jian-Cheng Chen ,  Chiang-Yuan Chuang ,  Chien-Chih Lai ,  Yen-Sheng Lin ,  Ping-hui Yeh

Inventor： Sheng-Lung Huang ,  Chia-Yao Lo ,  Kwang-Yao Huang ,  Jian-Cheng Chen ,  Chiang-Yuan Chuang ,  Chien-Chih Lai ,  Yen-Sheng Lin ,  Ping-hui Yeh

IPC: H01S3/00

CPC classification number: H01S3/06754 ,  C03C13/008 ,  C03C13/045 ,  H01S3/06716 ,  H01S3/1623 ,  H01S3/1643

Abstract: An optical amplifier includes an optical fiber having a core doped with transition metal ions, and at least one glass cladding enclosing the core. By using the fiber, the optical amplifier of the invention has a gain bandwidth of more than 300 nm including 1300-1600 nm band in low-loss optical communication.

Abstract translation: 光放大器包括具有掺杂有过渡金属离子的芯的光纤和包围芯的至少一个玻璃包层。 通过使用光纤，本发明的光放大器在低损耗光通信中具有大于300nm的增益带宽，包括1300-1600nm波段。

公开(公告)号：US06201299B1

公开(公告)日：2001-03-13

申请号：US09339035

申请日：1999-06-23

Applicant: Su Tao ,  Chih-Ming Chung ,  Jian-Cheng Chen ,  Chun-Chi Lee

Inventor： Su Tao ,  Chih-Ming Chung ,  Jian-Cheng Chen ,  Chun-Chi Lee

IPC: H01L23053

CPC classification number: H01L24/97 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3128 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/06136 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A substrate structure mainly comprises a plurality of substrate units and a plurality of dispensing holes thereon. A main hole is provided on the surface of the substrate unit, the two ends of which are adjacent to the dispensing hole for dispensing liquified encapsulant material to form a semiconductor package. The semiconductor package mainly comprises a chip, a substrate and an encapsulant. The chip is adhesively attached to the substrate, and the encapsulant covers around the are along one side of the chip. Then the encapsulant flows from the upper surface of the substrate to the lower surface to cover wire areas by means of the liquified encapsulant material flowing through the dispensing hole from the upper surface of the substrate to the lower surface.

Abstract translation: 基板结构主要包括多个基板单元和多个分配孔。 主孔设置在基板单元的表面上，其两端与用于分配液化的密封剂材料的分配孔相邻以形成半导体封装。 半导体封装主要包括芯片，衬底和密封剂。 芯片粘附到基板上，围绕芯片的密封剂覆盖在芯片的一侧。 然后，密封剂从基板的上表面流到下表面，通过从基板的上表面流到分配孔的液化的密封剂材料覆盖电线区域到下表面。