摘要:
A substrate handling apparatus includes a transfer arm having a substrate support. The apparatus includes at least one image acquisition sensor configured to acquire images of a substrate supported by the substrate support. In addition, the apparatus includes a controller coupled to the image acquisition sensor and configured to control the image acquisition sensor to acquire at least one image of the substrate supported on the substrate support. The controller is further configured to receive the images acquired by the image acquisition sensor and to determine an initial position of the substrate based on the acquired images. The controller is further coupled to the substrate support to control movement thereof to move the substrate to a new position based on the substrate's initial position. The apparatus also can be used to determine a substrate identification and to detect certain substrate defects either before or after processing the substrate in a thermal processing chamber. A method of positioning a substrate on a transfer arm also is disclosed.
摘要:
A technique for heating a substrate support, such as a susceptor, includes establishing respective final temperature setpoints for first and second heating elements in the susceptor. The temperatures of the heating elements are raised to their respective final temperature setpoints based on a predetermined heating rate. The temperatures of the first and second heating elements are controlled so that the difference between the temperatures of the first and second heating elements does not exceed the predetermined value while the temperatures of the heating elements are raised to their respective final temperature setpoints. Controlling the temperatures includes setting interim setpoints for the first and second heating elements, where the interim setpoint for the heating element having the greater heating capacity depends on the current value of the interim setpoint of the other heating element and the predetermined value. The temperatures of the first and second heating elements are raised toward their respective interim temperature setpoints for a predetermined delay period. At the end of the delay period, new interim setpoints can be established and the process repeated until the temperature of at least one of the first and second heating elements is close to its respective final setpoint. A relatively high duty cycle can be achieved which also reduces the likelihood of deformation of the substrate support.
摘要:
A substrate handling apparatus includes a transfer arm having a substrate support. The apparatus includes at least one image acquisition sensor configured to acquire images of a substrate supported by the substrate support. In addition, the apparatus includes a controller coupled to the image acquisition sensor and configured to control the image acquisition sensor to acquire at least one image of the substrate supported on the substrate support. The controller is further configured to receive the images acquired by the image acquisition sensor and to determine an initial position of the substrate based on the acquired images. The controller is further coupled to the substrate support to control movement thereof to move the substrate to a new position based on the substrate's initial position. The apparatus also can be used to determine a substrate identification and to detect certain substrate defects either before or after processing the substrate in a thermal processing chamber. A method of positioning a substrate on a transfer arm also is disclosed.
摘要:
A substrate processing system includes a processing chamber and a plasma source located external to the chamber. A conduit connects the plasma source to an interior region of the chamber to provide a reactive species to the chamber interior for cleaning interior surfaces of the chamber. A shower head, disposed between the plasma source and an interior region of the chamber, can serve as an electrode and also can serve as a gas distribution mechanism. The shower head includes a surface treatment, such as a non-anodized aluminum outer layer, an electro-polished surface of bare aluminum, or a fluorine-based protective outer layer. The surface-treated shower head improves the rate of removal of materials deposited on the interior surfaces of the chamber during cleaning, reduces contamination of substrates during processing, and provides more efficient use of the power source used for heating the substrate during processing.
摘要:
In a first aspect, a substrate positioning system includes a plurality of pushers arranged in a spaced relation about a stage adapted to support a substrate. Each pusher is adapted to assume a retracted position so as to permit the substrate to be loaded onto and unloaded from the stage, extend toward an edge of the substrate that is supported by the stage, contact the edge of the substrate, and continue extending so as to cause the substrate to move relative to the stage until the substrate is calibrated to the stage. Numerous other aspects are provided.
摘要:
A system and method for supporting and transferring a substrate relative to a plurality of testing columns are provided. The system includes a testing table adapted to support and move the substrate relative to the plurality of testing columns. The testing table may include an end effector disposed therein to transfer the substrate relative to an upper surface of the testing table. The method includes transferring the substrate to the testing table and moving the substrate relative to the plurality of testing columns. Signals indicative of electronic device performance are sensed to determine operability of the devices on the substrate.
摘要:
A sensing system includes a plurality of probes arranged in a spaced relation around a stage that is adapted to support a substrate. Each probe includes a detection portion adapted to move from a known starting position toward an edge of the substrate that is supported by the stage; detect the edge of the substrate while the substrate is supported by the stage; generate a detection signal following said detection; and stop moving toward the edge of the substrate following said detection. A controller may determine an edge position of the substrate relative to the stage based on the known starting position of each detection portion and based on the detection signal generated by each detection portion. Numerous other aspects are provided.
摘要:
An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame.
摘要:
A sensor apparatus for an inkjet printing device is provided. The sensor apparatus may include 1) at least one print head adapted to deposit ink on a top surface of a substrate, wherein the substrate is in motion relative to the print head, 2) at least one sensor adapted to detect the distance of the at least one sensor from the top surface of the substrate, and 3) a controller adapted to determine the substrate to nozzle distance based on the distance of the sensor to the top surface of the substrate, and adjust the trajectory of the ink being deposited on the substrate based on the substrate to nozzle distance. Numerous other aspects are provided.
摘要:
A method and apparatus for grounding a chamber isolation valve are provided. Generally, the method makes use of an electrically conductive elastomeric member or members to effectively ground a chamber isolation valve and/or isolation valve door while avoiding metal-to-metal contact between moving parts in the processing system. In one embodiment, the elastomeric member is attached to and in electrical communication with the door of the chamber isolation valve. The elastomeric member is brought into contact with a grounded component of the plasma processing system when the door is in the closed position. In another embodiment, the conductive elastomeric member is attached to a bracing member of the isolation valve and is brought into contact with a grounded component of the plasma processing system when the bracing member is deployed to hold the isolation valve door in place during substrate processing. Other configurations are also provided.