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    DISPLAY APPARATUS INCORPORATING VERTICALLY ORIENTED ELECTRICAL INTERCONNECTS
    21.
    发明申请
    DISPLAY APPARATUS INCORPORATING VERTICALLY ORIENTED ELECTRICAL INTERCONNECTS 审中-公开
    显示设备包括垂直的电气互连

    公开(公告)号：US20140071142A1

    公开(公告)日：2014-03-13

    申请号：US13615091

    申请日：2012-09-13

    申请人： Jasper Lodewyk Steyn

    发明人： Jasper Lodewyk Steyn

    IPC分类号： G02B26/00 ,  G09G5/39 ,  G02B26/02 ,  H01J9/24 ,  G02F1/01

    CPC分类号： B81C1/00095 ,  B81B2201/047 ,  G02B26/023 ,  G02B26/08 ,  G09G3/346 ,  H01L27/124

    摘要： This disclosure provides systems, methods and apparatus for enabling a display to have a faster switching rate and an increased aperture ratio by using vertically oriented electrical interconnects with a reduced footprint. In one aspect, a display apparatus includes an array of display elements and an electrical interconnect connected to at least one display element in the array of display elements. A cross sectional aspect ratio of the electrical interconnect can be up to 1:1 or greater than 1:1.

    摘要翻译： 本公开提供了通过使用具有减小的占地面积的垂直取向的电互连使得显示器具有更快的开关速率和增加的开口率的系统，方法和装置。 一方面，显示装置包括显示元件阵列和连接到显示元件阵列中的至少一个显示元件的电互连。 电互连的截面纵横比可以高达1：1或大于1：1。

    SYSTEMS AND METHODS FOR MEMS LIGHT MODULATOR ARRAYS WITH REDUCED ACOUSTIC EMISSION
    22.
    发明申请
    SYSTEMS AND METHODS FOR MEMS LIGHT MODULATOR ARRAYS WITH REDUCED ACOUSTIC EMISSION 有权
    具有减少声发射的MEMS光调制器阵列的系统和方法

    公开(公告)号：US20120154455A1

    公开(公告)日：2012-06-21

    申请号：US13330924

    申请日：2011-12-20

    申请人： Jasper Lodewyk Steyn ,  Jignesh Gandhi

    发明人： Jasper Lodewyk Steyn ,  Jignesh Gandhi

    IPC分类号： G09G5/10 ,  H05K13/00 ,  G02B26/02

    CPC分类号： G02B26/04 ,  G02B26/02 ,  G09G3/3413 ,  G09G3/3433 ,  G09G2300/0456 ,  G09G2300/0842 ,  G09G2300/0857 ,  G09G2310/0235 ,  G09G2310/0251 ,  G09G2310/0262 ,  G09G2310/08 ,  G09G2320/041 ,  G09G2320/0626 ,  G09G2360/144 ,  Y10T29/49002

    摘要： Systems and methods for a display having an array of pixels, a substrate, and a control matrix formed on the substrate are described. The array of pixels includes mechanical light modulators that can be referred to as micro-electro-mechanical or MEMS light modulators. The MEMS light modulators may be shutter-based light modulators, and an array of apertures may be formed on the substrate corresponding spatially to the shutters in the array of shutter-based light modulators. Each modulator is configured to be driven from a-light-blocking state to a-light-transmissive state through a movement direction. The array of light modulators are arranged to reduce the correlations in movement directions of neighboring pixels, thereby reducing the amplitude of acoustic emissions from the display.

    摘要翻译： 描述了具有形成在基板上的像素阵列，基板和控制矩阵的显示器的系统和方法。 像素阵列包括可被称为微机电或MEMS光调制器的机械光调制器。 MEMS光调制器可以是基于快门的光调制器，并且可以在基板上形成孔阵列，空间上对应于基于快门的光调制器阵列中的百叶窗。 每个调制器被配置为通过移动方向从遮光状态驱动到透光状态。 光调制器的阵列被布置为减少相邻像素的移动方向上的相关性，从而减少来自显示器的声发射的幅度。

    Input interface device with semiconductor strain gage
    28.
    发明授权
    Input interface device with semiconductor strain gage 有权

    公开(公告)号：US10948367B2

    公开(公告)日：2021-03-16

    申请号：US15903005

    申请日：2018-02-22

    申请人： Jasper Lodewyk Steyn

    发明人： Jasper Lodewyk Steyn

    IPC分类号： G01L1/22 ,  H05K1/18 ,  H05K1/02

    摘要： The invention provides for an interface device that measures strain on a specific area of the printed circuit board. The measurements are converted into an electrical signal and sent for processing. The processing results in the apparatus performing a desired function.
    The interface device includes a printed circuit board. The printed circuit board comprises a plurality of layers, including a conductive layer. The interface device further includes a strain sensing device. The strain sensing device is mounted on the printed circuit board and includes a substrate, a strain sensing element, and associated circuitry. In some instances, the strain sensing device includes one strain sensing element and in other instances multiple strain sensing elements can also be used. In one embodiment, the strain sensing device can include a piezoresistive strain gage combined with signal conditioning circuitry such that a single electronic component can be mounted on the printed circuit board for reduced cost and improved signal-to-noise performance.
    In operation, a user or another device applies force on the printed circuit board in the area of the strain sensing device. The strain sensitive element deforms in response to the applied force or strain on the printed circuit board. The deformation results in the change of resistance or conductivity of the strain sensitive element. The associated circuitry, which can be a signal conditioning circuit, converts the change in resistance or conductivity into a digital signal.
    Once the conversion occurs, the associated circuitry uses the conductive layer of the printed circuit board to communicate the digital signal to either the processor or the processing circuit of the electronic apparatus. The processor or processing circuit receives the digital signal and responds by performing a desired action.
    In one instance the interface device may be used to measure the magnitude of the force applied by a finger pressing on the touch screen of an electronic apparatus such as a cell phone. The magnitude of the applied force can then be used to control, the operation of the cell phone. A high magnitude force would result in a higher strain being sensed and can cause the apparatus to operate in one way, whereas a low magnitude force would result in a lower strain being sensed and can cause the apparatus to operate in another way, e.g., in a mobile phone environment where an application is used to draw a picture, a light force applied to the touch screen could be processed to result in a thin line being drawn and a stronger force could be processed to result in a wider line being drawn.
    In another instance the interface device may be used to measure the magnitude of the force applied to a control toggle on the steering wheel of a car. The toggle may be used to control the intensity of the sound emitted from the audio system in the car. A high magnitude force could be processed to cause the intensity of the sound to change rapidly whereas a low magnitude force could be processed to cause the intensity of the sound to change slowly.