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    LIGHT EMITTING DEVICE PACKAGE
    21.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 有权
    发光装置包装

    公开(公告)号：US20150060897A1

    公开(公告)日：2015-03-05

    申请号：US14476404

    申请日：2014-09-03

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Bong Kul MIN ,  Won Jung KIM ,  Heung Ju LEE ,  Chang Man LIM

    IPC: H01L33/60 ,  H01L33/62 ,  H01L27/15

    CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: Embodiments relate to a light emitting device package including a first lead frame and a second lead frame spaced apart from each other, a light emitting device disposed on the first lead frame, a reflecting part disposed on the first lead frame and the second lead frame and a light transmitting part including a lower end part disposed on the reflecting part, the first lead frame and the second lead frame and an upper end part disposed on the lower end part. The upper end part has a side surface vertically aligned with a location of a sidewall between upper and lower ends of the reflecting part.

    Abstract translation: 实施例涉及包括彼此间隔开的第一引线框架和第二引线框架的发光器件封装，设置在第一引线框架上的发光器件，设置在第一引线框架和第二引线框架上的反射部件， 一个透光部分，包括设置在反射部分上的下端部分，第一引线框架和第二引线框架，以及设置在下端部分上的上端部分。 上端部具有与反射部的上端和下端之间的侧壁的位置垂直对准的侧表面。

    LIGHT-EMITTING DEVICE PACKAGE AND LIGHT SOURCE MODULE
    22.
    发明申请
    LIGHT-EMITTING DEVICE PACKAGE AND LIGHT SOURCE MODULE 有权

    公开(公告)号：US20210210665A1

    公开(公告)日：2021-07-08

    申请号：US17059132

    申请日：2019-05-29

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Ki Seok KIM ,  Chang Man LIM ,  Won Jung KIM

    IPC: H01L33/62 ,  H01L33/48

    Abstract: A light-emitting device package according to one embodiment comprises: a body including a through-hole formed in an upper surface and a lower surface; a light-emitting device arranged on the upper surface of the body and including first and second bonding units spaced apart from each other; and first and second metal units arranged so as to be spaced apart from each other on the rear surface of the body, wherein a partial area of each of the first and second bonding units overlaps with the through-hole in a vertical direction, the first and second metal units respectively includes first and second extension portions extending to the through-hole; the first and second extension portions is electrically connected to the first and second bonding units, respectively; and the first and second extension portions face each other within the through-hole.

    LIGHT EMITTING DEVICE PACKAGE
    23.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 有权

    公开(公告)号：US20210193890A1

    公开(公告)日：2021-06-24

    申请号：US16768304

    申请日：2018-11-30

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Chang Man LIM ,  June O SONG ,  Ki Seok KIM

    IPC: H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L33/52 ,  H01L33/60

    Abstract: A light emitting device package according to an embodiment may include first and second frames, a body, a light emitting device, first and second conductive parts, and first and second conductors. According to the embodiment, first and second frames may be spaced apart from each other and include first and second openings, respectively. The body may be disposed between the first and second frames. The light emitting device may be disposed on the body and include first and second bonding parts. The first and second conductive parts may be disposed under the first and second bonding parts. The first and second conductors may be disposed in the first and second openings, respectively. According to the embodiment, the first and second conductive parts may extend into the first and second openings from the first and second bonding parts, respectively, and the first and second conductors may be disposed between the first and second conductive parts and the first and second frames, respectively.

    LIGHT-EMITTING DEVICE PACKAGE AND LIGHTING DEVICE HAVING SAME
    25.
    发明申请
    LIGHT-EMITTING DEVICE PACKAGE AND LIGHTING DEVICE HAVING SAME 审中-公开

    公开(公告)号：US20200335673A1

    公开(公告)日：2020-10-22

    申请号：US16759907

    申请日：2018-10-31

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Ki Seok KIM ,  Jung Hwa JUNG ,  Na Young KIM ,  Won Jung KIM ,  Suk Kyung PARK ,  Sang Jun LEE ,  Nak Hun KIM ,  Chang Man LIM

    IPC: H01L33/54 ,  H01L33/60 ,  H01L33/50

    Abstract: A light emitting device package disclosed in an embodiment of the invention includes a substrate including first and second frames; a light emitting device including a first bonding portion facing the first frame and a second bonding portion facing the second frame; a phosphor layer on the light emitting device; a first resin disposed around the upper surface of the substrate and the light emitting device; a second resin between the first resin and side surfaces of the light emitting device; and an adhesive layer between the phosphor layer and the light emitting device, wherein the adhesive layer includes a thickness thinner than a thickness of the phosphor layer, and the first resin comprises a reflective resin material and is disposed on the side surface of the phosphor layer. The second resin may include a transparent resin material, and the second resin may include a curved surface with an outer surface facing the first resin.

    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SOURCE DEVICE
    26.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SOURCE DEVICE 审中-公开

    公开(公告)号：US20200279982A1

    公开(公告)日：2020-09-03

    申请号：US16646660

    申请日：2018-09-12

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Chang Man LIM ,  June O SONG ,  Sung Min KONG ,  Ki Seok KIM

    IPC: H01L33/54 ,  H01L33/24 ,  H01L33/62

    Abstract: The light emitting device package disclosed in the embodiment includes first and second frames spaced apart from each other; a body disposed between the first and second frames; a light emitting device disposed on the first and second frames; a first resin disposed between the body and the light emitting device, wherein each of the first and second frames includes a through hole, the through hole overlaps the light emitting device in a vertical direction, and the body includes a recess recessed toward a lower surface of the body between the first and second frames, and the recess overlaps the light emitting device in the vertical direction, the first resin is disposed in the recess, and a length of the recess is smaller than a width of the light emitting device.

    LIGHT EMITTING DEVICE PACKAGE
    27.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE 审中-公开

    公开(公告)号：US20200227373A1

    公开(公告)日：2020-07-16

    申请号：US16646623

    申请日：2018-09-14

    Applicant: LG INNOTEK CO., LTD.

    Inventor： June O SONG ,  Ki Seok KIM ,  Chang Man LIM

    IPC: H01L23/00 ,  H01L33/48 ,  H01L33/60 ,  H01L33/62

    Abstract: A light emitting device package according to an embodiment may include a first package body including first and second openings passing through the upper surface and lower surface thereof; a second package body disposed on the first package body and including a third opening passing through the upper surface and lower surface thereof; a light emitting device disposed in the third opening; a first resin disposed between the upper surface of the first package body and the light emitting device; and a second resin disposed in the third opening. According to the embodiment, the upper surface of the first package body may be coupled to the lower surface of the second package body, the first package body may include a recess recessed from the upper surface of the first package body to the lower surface of the first package body, the first resin may be disposed in the recess, the first resin and the second resin include materials different from each other, and the first resin may be in contact with the light emitting device and the second resin.

    LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE APPARATUS
    28.
    发明申请
    LIGHT EMITTING DEVICE PACKAGE AND LIGHT SOURCE APPARATUS 审中-公开

    公开(公告)号：US20190088837A1

    公开(公告)日：2019-03-21

    申请号：US15766444

    申请日：2017-09-29

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Tae Sung LEE ,  June O SONG ,  Chang Man LIM

    IPC: H01L33/56 ,  H01L33/40 ,  F21V23/00 ,  H01L33/48

    CPC classification number: H01L33/56 ,  F21V23/007 ,  H01L24/16 ,  H01L33/40 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16257 ,  H01L2224/26175 ,  H01L2224/73204

    Abstract: A light emitting device package can include first and second frames spaced apart from each other; a package body including a body portion between the first and second frames; a light emitting device including first and second electrode pads; first and second through holes in the first and second frames, respectively; a first resin between the body portion and the light emitting device; and a conductive material in the first and second through holes, in which the first and second electrode pads of the light emitting device respectively overlap with the first and second through holes, the first and second electrode pads are spaced apart from each other, and the conductive material in the first and second through holes respectively contacts the first and second electrode pads, and a first side surface of the first electrode pad and a second side surface of the second electrode pad facing the first side surface both contact the first resin.

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