Abstract:
To detect the rotational speed and angular position of a rotating wheel, a non-contact sensor (e.g., an optical sensor or a Hall sensor) scans scan marks on the wheel, and generates a pulse train. The amplitude of the pulses is compared in a comparator with a variable switching threshold. To achieve accurate measurement results, and to compensate for offset and long-term drift of the sensor, the switching threshold is adjusted if one or more of the following conditions is met: (i) the difference between the pulse amplitude and the switching threshold exceeds a fixable first maximum, (ii) the difference of the amplitudes of two successive pulses exceeds a fixable second maximum, (iii) the difference of the frequencies of successive pulses exceeds a fixable third maximum. The method is particularly advantageous in a motor vehicle, to detect the rotational speed and angular position for an electronic ignition system, or the rotational speed and angular position of the wheels for an ABS braking system, an anti-skid system, or a vehicle stabilization system.
Abstract:
Two-wire sensors for measuring physical quantities have only two connections (A1, A2), which serve to connect the power supply and also to conduct the measuring signals. However, because two-wire sensors have the property of controlled current sources, they can be connected only in parallel. Consequently, for a parallel circuit of n two-wire sensors disposed at different locations, two n lines are required. To reduce the number of lines, a two-wire sensor is provided with an end stage (W), which generates an output voltage (UA), which is a measure of the physical quantity measured by a measuring sensor (S) and which is always greater than an adjustable reference voltage signal (Uref). Because the inventive two-wire sensor therefore has the property of a voltage source, several of them can be connected in series. Consequently, even for a series circuit of several two-wire sensors, only two lines are required.
Abstract:
A system for processing a signal s(t) from a sensor to recover sensed signal information within the bandwidth of the summation signal, wherein the signal s(t) includes a sensed signal m(t) and an offset signal having a first frequency f1. The system comprises: a sampling device for sampling the signal s(t) at a second frequency f2 that is a multiple of the first frequency f1, to create a sequence of sampled values; and an averaging device for averaging the sequence of sampled values to provide a sequence of averaged sampled values indicative of the sensed signal m(t).
Abstract:
A collector contact (6) is fabricated which is attached on the side to the collector zone (1), and around which a moat (3) is produced which laterally restricts the collector zone (1). The depth of the moat (3) is so dimensioned to be at least equal to the vertical thickness of the collector zone (1). The collector contact (6) comprises a polycrystalline silicon layer which contains dopants of the same conductivity type as the collector zone (1), and covers a highly doped contacting zone (7') which has been diffused from the adjoining collector contact (6).
Abstract:
In fabricating the contact, the electrode layer of polycrystalline silicon whose rim portion is bonded via a layer portion of insulating material to the substrate, is used at least throughout the length of a part of its rim portion for the lateral delimitation of a etching process, as an etch mask, in the course of which a frame-shaped layer portion is formed underneath the rim portion of the electrode layer, and the contact area of the substrate as bordering on the layer portion is exposed. Following the deposition of a metal layer of a metal forming a silicide in a thickness smaller than the thickness of the layer portion, and the heating for forming the silicide, the metal which has so far not reacted with the silicon, is removed by using an etching agent selectively dissolving the metal.
Abstract:
The invention includes a method of manufacture of monolithic integrated VLSI circuits comprising bipolar transistors whose base regions are contacted in a self-aligned manner in proximity to the respective emitter regions by the use of silicide layers. The invention starts out from a process which, when using an insulating masking layer portion covering up the emitter area of the planar transistor, permits the self-aligned fabrication of emitter regions extending to the adjoining base region and to the base contacting region. Further embodiments of the process according to the invention permit the simultaneous manufacture of co-integrated CMOS circuits and of polycrystalline. Si-conductor leads whose resistances are reduced owing to the use of silicide layers.
Abstract:
A method of manufacturing bipolar transistors is described. The emitter areas are protected by means of an oxidation masking layer and subsequently after applying a photo-resist layer which defines the base areas two implantation processes of ions of the base zone conductivity type are performed. The one is performed with low doping dose and high acceleration voltage sufficient to render the masking layer penetrable and the other with high doping dose and low acceleration voltage as to render the masking layer impenetrable.
Abstract:
The invention proposes a process for manufacturing a monolithic integrated circuit comprising at least one bipolar transistor in which the dopings of the regions are inserted into the substrate (2) exclusively by way of ion implantations. The invention deals with the problem of the current gain value variations during mass-production. This problem is solved in that during the implantation of the base dopings, in which the base area (32) is defined by means of a photoresist mask (5), the emitter area (11) is covered with an oxidation masking layer portion (71), with the ions of the base region (3) being implanted into the substrate surface once at a low accelerating energy and a great dose, with the oxidation masking layer portion (71) serving as the mask and, the next time, at a high accelerating energy and a relatively small dose, in the course of which the oxidation masking layer portion (1) is penetrated.
Abstract:
This relates to a method of producing a monolithic integrated I.sup.2 L circuit including a bipolar analog circuit part. In order to realize good current gain values in the I.sup.2 L transistors as well as high collector breakdown voltages in the analog circuit part, the base zone of the analog circuit part is prediffused prior to diffusion of the I.sup.2 L base and injector regions. After such prediffusion, excessive doping material from the diffusion masking layer is removed and simultaneously windows in the diffusion mask over the I.sup.2 L base and injector regions are opened. Next, doping material having a lower concentration than that which was used for the prediffusion of the analog base region is prediffused into the exposed regions of the substrate. This results in an expanded prediffused base region in the analog circuit part.