Polishing composition for semiconductor wafer, method for production thereof and polishing method
    21.
    发明授权
    Polishing composition for semiconductor wafer, method for production thereof and polishing method 失效
    半导体晶片抛光组合物及其制造方法及研磨方法

    公开(公告)号:US07753974B2

    公开(公告)日:2010-07-13

    申请号:US12153111

    申请日:2008-05-14

    CPC分类号: H01L21/3212 C09G1/02

    摘要: The present invention relates to a polishing composition for a substrate including a metal such as wiring, etc., formed on a semiconductor wafer, which can provide a high polishing rate without causing scratches on the wiring metal, a method of producing the polishing composition, and a polishing method. The polishing composition for a semiconductor wafer comprises an acid and an aqueous medium dispersion containing positively-charged silica particles having an amino group-containing silane coupling agent bonded on a surface thereof, the polishing composition having a pH of 2 to 6.

    摘要翻译: 本发明涉及一种用于基板的抛光组合物,其包括形成在半导体晶片上的诸如布线等的金属,其能够提供高的抛光速率而不会在布线金属上产生划痕,制造抛光组合物的方法, 和抛光方法。 用于半导体晶片的抛光组合物包括酸和包含在其表面上结合有含氨基的硅烷偶联剂的带正电荷的二氧化硅颗粒的水性介质分散体,该抛光组合物的pH为2至6。

    Polishing composition for semiconductor wafer
    22.
    发明申请
    Polishing composition for semiconductor wafer 审中-公开
    半导体晶圆抛光组合物

    公开(公告)号:US20100163786A1

    公开(公告)日:2010-07-01

    申请号:US12653683

    申请日:2009-12-17

    IPC分类号: C09K13/00

    摘要: A polishing composition for semiconductor wafer polishing comprising, colloidal silica prepared from an active silicic acid aqueous solution obtained by removal of alkali from alkali silicate and at least one nitrogen containing basic compound selected from a group consisting of ethylenediamine, diethylenediamine, imidazole, methylimidazole, piperidine, morpholine, arginine, and hydrazine, wherein pH of the colloidal silica is of 8.5 to 11.0 at 25° C. by containing quaternary ammonium hydroxide.

    摘要翻译: 一种用于半导体晶片抛光的抛光组合物,其包括由通过从碱金属硅酸盐除去碱而获得的活性硅酸水溶液制备的胶体二氧化硅和至少一种选自乙二胺,二乙二胺,咪唑,甲基咪唑,哌啶 ,吗啉,精氨酸和肼,其中胶体二氧化硅的pH在25℃下为8.5〜11.0,含有氢氧化季铵。

    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION THEREOF
    23.
    发明申请
    SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCTION THEREOF 审中-公开
    半导体器件及其制造方法

    公开(公告)号:US20100025725A1

    公开(公告)日:2010-02-04

    申请号:US12514637

    申请日:2007-11-13

    申请人: Hiroaki Tanaka

    发明人: Hiroaki Tanaka

    IPC分类号: H01L29/739 H01L21/331

    摘要: A semiconductor device has a drift region (20) (third semiconductor region) of an n-type (first conductivity type); a body region (50) (second semiconductor region) of a p-type (second conductivity type) provided on the drift region (20); an emitter region (60) (first semiconductor region) of the n-type formed in the top surface of the body region (50) and separated from the drift region (20) by the body region (50); a trench (14) extending from the top surface of the emitter region (60) through the body region (50) into the drift region (20); a trench gate electrode (13) filled in the trench (14); and a semiconductor region (70) (fourth semiconductor region) of the p-type formed in contact with side faces of the trench protruding into the drift region (20). Therefore, the semiconductor device can suppress a surge voltage at turn-off, and can be produced easily.

    摘要翻译: 半导体器件具有n型(第一导电型)的漂移区域(20)(第三半导体区域); 设置在漂移区域(20)上的p型(第二导电型)的体区(50)(第二半导体区域); 所述n型的发射极区域(60)(第一半导体区域)形成在所述主体区域(50)的顶表面中并且通过所述主体区域(50)与所述漂移区域(20)分离。 从所述发射极区域(60)的顶表面延伸通过所述体区(50)延伸到所述漂移区域(20)中的沟槽(14)。 填充在沟槽(14)中的沟槽栅电极(13); 以及形成为与突出到漂移区域(20)中的沟槽的侧面接触的p型半导体区域(第四半导体区域)(第四半导体区域)。 因此,半导体装置能够抑制关断时的浪涌电压,能够容易地制造。

    Polishing composition for semiconductor wafer and polishing method
    25.
    发明申请
    Polishing composition for semiconductor wafer and polishing method 失效
    半导体晶圆抛光组合物及抛光方法

    公开(公告)号:US20080311750A1

    公开(公告)日:2008-12-18

    申请号:US12081829

    申请日:2008-04-22

    IPC分类号: H01L21/304 B24B1/00 C09K3/14

    摘要: The present invention relates to a polishing composition for a semiconductor wafer which is excellent in polishing property, and a polishing method. The polishing composition for a semiconductor wafer comprises colloidal silica consisting of non-spherical silica particles having a ratio of long axis to short axis of 1.5 to 15. The polishing method for a semiconductor wafer uses the polishing composition. The polishing composition can provide a remarkably high polishing rate compared with a polishing composition using spherical colloidal silica, and can provide good mirror-polishing without causing scratches. In addition, small alkali metal content enables reduction of adverse effects on a semiconductor wafer, such as residual abrasives after polishing.

    摘要翻译: 本发明涉及抛光性优异的半导体晶片用研磨用组合物及研磨方法。 用于半导体晶片的抛光组合物包括由长轴与短轴的比率为1.5至15的非球形二氧化硅颗粒组成的胶体二氧化硅。半导体晶片的抛光方法使用抛光组合物。 抛光组合物与使用球形胶体二氧化硅的抛光组合物相比可以提供非常高的抛光速率,并且可以提供良好的镜面抛光而不会产生划痕。 此外,小的碱金属含量可以减少半导体晶片的不利影响,例如抛光后的残留磨料。

    Human cDNAs and proteins and uses thereof
    27.
    发明授权
    Human cDNAs and proteins and uses thereof 失效
    人类cDNA和蛋白质及其用途

    公开(公告)号:US07285631B2

    公开(公告)日:2007-10-23

    申请号:US10485231

    申请日:2001-10-15

    IPC分类号: C07K14/435

    摘要: The invention concerns GENSET polynucleotides and polypeptides. Such GENSET products may be used as reagents in forensic analyses, as chromosome markers, as tissue/cell/organelle-specific markers, in the production of expression vectors. In addition, they may be used in screening and diagnosis assays for abnormal GENSET expression and/or biological activity and for screening compounds that may be used in the treatment of GENSET-related disorders.

    摘要翻译: 本发明涉及GENSET多核苷酸和多肽。 在产生表达载体中,这种GENSET产品可用作法医分析中的试剂,作为染色体标记物,作为组织/细胞/细胞器特异性标志物。 此外,它们可用于异常GENSET表达和/或生物活性的筛选和诊断测定,并用于筛选可用于治疗GENSET相关疾病的化合物。

    Agent for improving physiological motor functions
    28.
    发明申请
    Agent for improving physiological motor functions 审中-公开
    改善生理运动功能的药剂

    公开(公告)号:US20070099853A1

    公开(公告)日:2007-05-03

    申请号:US10561171

    申请日:2004-05-14

    IPC分类号: A61K31/7048 A61K31/353

    CPC分类号: A61K31/352 A23L33/105

    摘要: The present invention provides an agent for improving physiological motor functions which is characterized in containing proanthocyanidin as an effective ingredient. It is useful as an agent for preventing and improving the fatigue in which rise in lactic cid value upon physical exercise is suppressed whereby muscular fatigue is reduced and continuous exercise is made easy, and particularly as an agent for prevention and improvement of muscular fatigue, and as a health food for prevention and improvement of fatigue.

    摘要翻译: 本发明提供一种改善生理运动功能的药剂,其特征在于含有原花色素作为有效成分。 作为用于预防和改善体育锻炼时乳酸值上升被抑制从而减轻肌肉疲劳并使连续运动变得容易的疲劳的作用剂,特别是作为预防和改善肌肉疲劳的药剂是有用的,以及 作为预防和改善疲劳的保健食品。

    Compact pressure sensor with high corrosion resistance and high accuracy
    29.
    发明授权
    Compact pressure sensor with high corrosion resistance and high accuracy 有权
    紧凑型压力传感器,具有高耐腐蚀性和高精度

    公开(公告)号:US07168326B2

    公开(公告)日:2007-01-30

    申请号:US11079475

    申请日:2005-03-15

    IPC分类号: F02P5/00

    摘要: A pressure sensor mainly includes a sensor chip, a circuit chip, and a substrate. The sensor chip is configured to generate an electrical signal representative of a pressure being sensed and includes a sensing area and a plurality of contact pads. The circuit chip includes a circuit configured to process the electrical signal and a plurality of contact pads. The substrate includes a resin sheet having an opening and a plurality of conductors within the resin sheet. The substrate is joined to both the sensor chip and circuit chip so that the sensing area of the sensor chip is to be exposed to the pressure being sensed through the opening of the resin sheet, the contact pads of the sensor chip and circuit chip are electrically connected to the conductors of the substrate, and all the contact pads and conductors are hermetically embedded in the resin sheet of the substrate.

    摘要翻译: 压力传感器主要包括传感器芯片,电路芯片和基板。 传感器芯片被配置为产生代表正在感测的压力的电信号,并且包括感测区域和多个接触焊盘。 电路芯片包括被配置为处理电信号的电路和多个接触焊盘。 基板包括在树脂片内具有开口和多个导体的树脂片。 基片连接到传感器芯片和电路芯片上,以使传感器芯片的感测区域暴露于通过树脂片的开口感测的压力,传感器芯片和电路芯片的接触垫电气 连接到基板的导体,并且所有接触焊盘和导体都气密地嵌入在基板的树脂片中。

    Pressure sensor
    30.
    发明申请
    Pressure sensor 有权
    压力传感器

    公开(公告)号:US20060288793A1

    公开(公告)日:2006-12-28

    申请号:US11444302

    申请日:2006-06-01

    申请人: Hiroaki Tanaka

    发明人: Hiroaki Tanaka

    IPC分类号: G01L9/00

    CPC分类号: G01L19/147 G01L19/0627

    摘要: A pressure sensor for detecting a pressure and for outputting a signal based on the piezoresistance effect includes a substrate having a sensor chip on one side in a thin portion and a concave portion on another side, a piezo-resistor in the sensor chip, a pedestal being attached to the substrate and having a through hole for introducing the pressure to the sensor chip and a gel material filled in the concave portion and the through hole for protecting the sensor chip. A ratio of a diameter of the through hole to a thickness of the pedestal is substantially within a range between 1 and 3.

    摘要翻译: 用于检测压力并基于压阻效应输出信号的压力传感器包括:具有在薄壁一侧的传感器芯片和另一侧的凹部的基板,传感器芯片中的压电电阻器,基座 附着在基板上,并具有用于将压力引入传感器芯片的通孔和填充在凹部中的凝胶材料和用于保护传感器芯片的通孔。 通孔的直径与基座的厚度的比率基本上在1和3之间的范围内。