摘要:
The method of manufacturing a semiconductor device includes the steps of forming copper wiring; reducing an oxide film on the surface of the copper wiring by heating the copper wiring to a temperature in a range of 250° C.-450° C. under reductive gas or by treating the copper wiring in plasma of reductive gas; and then forming a film of a material not containing oxygen on the copper wiring without exposing the copper wiring to external atmosphere, and can provide a semiconductor device with good copper wiring.
摘要:
A damascene wiring structure having: a lower wiring structure; an interlayer insulating film covering the lower wiring structure; a wiring trench formed in the interlayer insulating film from an upper surface thereof, and a via hole passing through the interlayer insulating film from a lower surface of the wiring trench in an inner area thereof and reaching the lower wiring structure, the via hole having a diameter smaller than a width of the wiring trench; an insulating pillar pattern projecting upward from the lower surface of the wiring trench in an area outside of the via hole, the insulating pillar pattern being made of a same material as the interlayer insulating film, wherein a first occupied area factor of the insulating pillar pattern in a first area of the wiring trench near said via hole is higher than a second occupied area factor of the insulating pillar pattern in a second area of the wiring trench remote from the via hole; and a dual damascene wiring formed by filling the wiring trench and said via hole with conductive material. A damascene wiring structure having a high reliability and a semiconductor device having such a damascene wiring structure can be formed.
摘要:
An optical disk having a plurality of substantially concentric tracks, each of which includes a plurality of segments each comprising a servo area ARs provided with servo pits for giving servo information to a disk drive and a data area ARd. Identification marks SGM, ADM, STM1, STM2 are recorded in the servo area ARs. The identification marks SGM, ADM, STM1, STM2 provide information for identifying the respective segments depending on the recording position in the servo area ARs.
摘要:
An apparatus which includes a recording or reproducing unit for recording or reproducing data on or from a disc, a data transmission/reception unit for transmitting playback data reproduced by the recording and reproducing unit from the disc to an external computer and receiving recording data supplied from the computer for supplying the received recording data to the recording and reproducing unit, a system controller for receiving a command supplied from the computer for controlling the data receiving unit, a temperature sensor for detecting the temperature within a main body of the disc recording and reproducing apparatus, and a recording/playback controller for controlling the operation of the recording and reproducing unit responsive to the command supplied from the computer via the system controller and a detection output of the temperature sensor. The recording/playback controller initially decides, when a command is supplied via the system controller from the computer, whether or not the temperature within the main body of the apparatus is outside a pre-set temperature range and inhibits the recording or reproducing operation when the temperature is outside the pre-set temperature range before starting the recording or reproducing operation. Further, if, during recording or reproducing it is detected that the temperature is outside of the pre-set temperature range, the recording/playback controller terminates the recording or reproducing operation after first recording or reproducing a pre-set amount of the recording or playback data, respectively, conforming to the command from the computer.
摘要:
A method of manufacturing a semiconductor device, including: forming a moisture resistant ring surrounding a multilayer interconnection structure in a layered body formed of stacked layers of a plurality of interlayer insulating films lower in dielectric constant than a SiO2 film and including the multilayer interconnection structure; forming a groove in the layered body between the moisture resistant ring and a scribe line, the groove reaching a surface of a semiconductor substrate; forming a film including Si and C as principal components and covering sidewall surfaces and a bottom surface of the groove; and forming a protection film on the film along the sidewall surfaces and the bottom surface of the groove.
摘要:
An apparatus for holding a medical device has an arm unit equipped with, for example, a polyarticular arm, which holds the medical device such as endoscope movably in the space. Additionally to a determination unit and a controller, the holding apparatus has an operation unit equipped with a plurality of operation members with which an operator's operation causes the arm unit to be moved spatially. The determination unit determines whether or not operator's operations at the plurality of operation members corresponds to an improper state deviating from a properly operated state in which at least two predetermined operation members have been operated within a predetermined period of time which is set to measure simultaneity for operations. If it is determined that the operation is in the improper state, the controller prohibits the arm unit from moving. As long as the operation is proper, the arm unit can be moved.
摘要:
A method of manufacturing a semiconductor device, including: forming a moisture resistant ring surrounding a multilayer interconnection structure in a layered body formed of stacked layers of a plurality of interlayer insulating films lower in dielectric constant than a SiO2 film and including the multilayer interconnection structure; forming a groove in the layered body between the moisture resistant ring and a scribe line, the groove reaching a surface of a semiconductor substrate; forming a film including Si and C as principal components and covering sidewall surfaces and a bottom surface of the groove; and forming a protection film on the film along the sidewall surfaces and the bottom surface of the groove.
摘要:
A surgery equipment holding device including a holder for holding surgical equipment, a bar connected to the holder, a brake which operatively engages the bar for stopping movement of the bar, and a pair of switches for switching being an active state and an inactive state of the brake. The surgery equipment holding device is characterized in the operation thereof at the time of disengaging the fixation state, and exhibits excellent operability.
摘要:
A method of manufacturing a semiconductor device, including: forming a moisture resistant ring surrounding a multilayer interconnection structure in a layered body formed of stacked layers of a plurality of interlayer insulating films lower in dielectric constant than a SiO2 film and including the multilayer interconnection structure; forming a groove in the layered body between the moisture resistant ring and a scribe line, the groove reaching a surface of a semiconductor substrate; forming a film including Si and C as principal components and covering sidewall surfaces and a bottom surface of the groove; and forming a protection film on the film along the sidewall surfaces and the bottom surface of the groove.
摘要:
A photodynamic hyperthermic chemotherapy of cancer comprising topically injecting a photosensitive dye agent, specifically indocyanine green, in the form of an acidic liquid formulation to a tumor or cancer tissue, or a surgically removed site thereof of a patient, and irradiating the tissue or site with light having such an output wavelength that the photosensitive dye agent absorbs the light and generates heat; and an apparatus and a system for photodynamic hyperthermic chemotherapy of cancer comprising a light source and a probe having a light introducing portion capable of topically irradiating a tumor or cancer tissue or a surgically removed site thereof of a patient with light derived from the light source by a continuous wave or a pulse wave at an output wavelength of 600 to 1600 nm and an output of 5000 mW or more.