Scaffolded nucleic acid polymer particles and methods of making and using
    22.
    发明授权
    Scaffolded nucleic acid polymer particles and methods of making and using 有权
    支架核酸聚合物颗粒及其制备和使用方法

    公开(公告)号:US08574835B2

    公开(公告)日:2013-11-05

    申请号:US12785685

    申请日:2010-05-24

    摘要: The invention provides particle compositions having applications in nucleic acid analysis. Nucleic acid polymer particles of the invention allow polynucleotides to be attached throughout their volumes for higher loading capacities than those achievable solely with surface attachment. In one aspect, nucleic acid polymer particles of the invention comprise polyacrylamide particles with uniform size distributions having low coefficients of variations, which result in reduced particle-to-particle variation in analytical assays. Such particle compositions are used in various amplification reactions to make amplicon libraries from nucleic acid fragment libraries.

    摘要翻译: 本发明提供了在核酸分析中具有应用的颗粒组合物。 本发明的核酸聚合物颗粒允许多核苷酸在其整个体积中被连接,以便比仅通过表面附着可实现的更高的负载能力。 在一个方面,本发明的核酸聚合物颗粒包含具有低变异系数的具有均匀尺寸分布的聚丙烯酰胺颗粒,这导致分析测定中粒子与粒子变化的减少。 这种颗粒组合物用于各种扩增反应以制备来自核酸片段文库的扩增子文库。

    Methods of Making Libraries of Nucleic Acids Using Porous Particles
    24.
    发明申请
    Methods of Making Libraries of Nucleic Acids Using Porous Particles 审中-公开
    使用多孔颗粒制备核酸图谱的方法

    公开(公告)号:US20110195459A1

    公开(公告)日:2011-08-11

    申请号:US13029664

    申请日:2011-02-17

    IPC分类号: C12P19/34

    摘要: The invention provides particle compositions having applications in nucleic acid analysis. Nucleic acid polymer particles of the invention allow polynucleotides to be attached throughout their volumes for higher loading capacities than those achievable solely with surface attachment. In one aspect, nucleic acid polymer particles of the invention comprise polyacrylamide particles with uniform size distributions having low coefficients of variations, which result in reduced particle-to-particle variation in analytical assays. Such particle compositions are used in various amplification reactions to make amplicon libraries from nucleic acid fragment libraries.

    摘要翻译: 本发明提供了在核酸分析中具有应用的颗粒组合物。 本发明的核酸聚合物颗粒允许多核苷酸在其整个体积中被连接,以便比仅通过表面附着可实现的更高的负载能力。 在一个方面,本发明的核酸聚合物颗粒包含具有低变异系数的具有均匀尺寸分布的聚丙烯酰胺颗粒,这导致分析测定中粒子与粒子变化的减少。 这种颗粒组合物用于各种扩增反应以制备来自核酸片段文库的扩增子文库。

    Tissue factor targeted antibodies as anticoagulants
    26.
    发明授权
    Tissue factor targeted antibodies as anticoagulants 失效
    组织因子靶向抗体作为抗凝剂

    公开(公告)号:US07579000B2

    公开(公告)日:2009-08-25

    申请号:US10512215

    申请日:2004-04-30

    IPC分类号: A61K39/395

    摘要: This invention relates to novel antibodies that bind with greater affinity to the factor VIIa/tissue factor (FVIIa/TF) complex than to tissue factor (TF) alone, do not compete for binding to TF with FVII and FX, an inhibit FX activation. The antibodies bind at the site of injury and prevent the initiation of thrombosis. The antibodies can be used to treat a variety of thrombotic conditions including but not limited to deep vein thrombosis, disseminated intravascular coagulation, and acute coronary syndrome.

    摘要翻译: 本发明涉及与单独的组织因子(TF)相比,与因子VIIa /组织因子(FVIIa / TF)复合物具有更高亲和力结合的新型抗体,不竞争与FVII和FX的结合,抑制FX激活。 抗体在损伤部位结合并防止血栓形成的发生。 抗体可用于治疗各种血栓形成病症,包括但不限于深静脉血栓形成,弥散性血管内凝血和急性冠状动脉综合征。

    Layered metal structure for interconnect element
    27.
    发明申请
    Layered metal structure for interconnect element 有权
    用于互连元件的分层金属结构

    公开(公告)号:US20080093108A1

    公开(公告)日:2008-04-24

    申请号:US11801336

    申请日:2007-05-09

    申请人: David Light

    发明人: David Light

    IPC分类号: H01B5/00 H01R43/00

    摘要: A layered metal structure is provided in accordance with an aspect of the invention. The structure can be used, for example, to fabricate a conductive interconnect element for conductively interconnecting one or more microelectronic elements. The layered structure includes first and second metal layers each of which may include one or more of copper or aluminum, for example. An intervening layer, may include for example, chromium between the first and second metal layers, chromium being resistant to an etchant usable to pattern the first and second metal layers selectively to the intervening layer. An etchant such as cupric chloride, ferric chloride (FeCl3), a peroxysulfuric composition, or a persulfate composition may be used to pattern the first and second metal layers in such case.

    摘要翻译: 根据本发明的一个方面提供了层状金属结构。 该结构可以用于例如制造导电互连一个或多个微电子元件的导电互连元件。 层状结构包括例如可以包括铜或铝中的一种或多种的第一和第二金属层。 中间层可以包括例如在第一和第二金属层之间的铬,铬耐腐蚀剂可以选择性地将第一和第二金属层图案化成中间层。 在这种情况下,可以使用诸如氯化铜,氯化铁(FeCl 3 N 3),过氧化硫组合物或过硫酸盐组合物的蚀刻剂来图案化第一和第二金属层。

    Thrombomodulin analogs for pharmaceutical use
    29.
    发明授权
    Thrombomodulin analogs for pharmaceutical use 失效
    用于药物用途的血栓调节蛋白类似物

    公开(公告)号:US06632791B1

    公开(公告)日:2003-10-14

    申请号:US09880484

    申请日:2001-06-12

    IPC分类号: A61K3800

    CPC分类号: C07K14/7455 A61K38/00

    摘要: The present invention relates to the design, production and use of analogs of thrombomodulin (TM) that have the ability to enhance the thrombin-mediated activation of protein C but which have a significantly reduced ability to promote activation of thrombin-activatable fibrinolysis inhibitor (TAFI). These analogs are useful in, for example, antithrombotic therapy.

    摘要翻译: 本发明涉及血栓调节蛋白(TM)类似物的设计,生产和使用,其具有增强凝血酶介导的蛋白质C活化但能显着降低促凝血酶激活性纤维蛋白溶解抑制剂(TAFI)活化能力的能力 )。 这些类似物可用于例如抗血栓治疗。

    Peelable lead structure and method of manufacture
    30.
    发明授权
    Peelable lead structure and method of manufacture 有权
    可剥离的铅结构及其制造方法

    公开(公告)号:US06333207B1

    公开(公告)日:2001-12-25

    申请号:US09577474

    申请日:2000-05-24

    IPC分类号: H01L2144

    摘要: A microelectronic component connection is made by providing a lead, extending along the surface of a first element such as a semiconductor chip or wafer, such that at least a part of the lead adheres to the surface of the first element. The adhesion between this part of the lead and the surface of the first element is released by altering the temperature of at least this part of the lead. This part of the lead can then be peeled away from the surface of the first element. This part of the lead may be connected to a second element such as a microelectronic connection component, and the lead may be deformed by moving the elements relative to one another.

    摘要翻译: 通过提供沿着诸如半导体芯片或晶片的第一元件的表面延伸的引线来制造微电子部件连接,使得至少一部分引线粘附到第一元件的表面。 引线的这一部分与第一元件的表面之间的粘附通过改变至少该部分引线的温度来释放。 然后可以将该部分引线从第一元件的表面剥离。 引线的这一部分可以连接到诸如微电子连接部件的第二元件,并且引线可以通过相对于彼此移动元件而变形。