公开(公告)号：US20230050400A1

公开(公告)日：2023-02-16

申请号：US17866566

申请日：2022-07-18

Applicant: MEDIATEK INC.

Inventor： Che-Hung Kuo ,  Chung-Min Yang

IPC: H01L25/18 ,  H01L23/538 ,  H01L23/498 ,  H01L23/31

Abstract: A semiconductor package includes a logic die surrounded by a molding compound; a memory die disposed in proximity to the logic die; a plurality of vias around the logic die for electrically connecting the logic die to the memory die. Each of the plurality of vias has an oval shape or a rectangular shape when viewed from above. The vias have a horizontal pitch along a first direction and a vertical pitch along a second direction. The vertical pitch is greater than the horizontal pitch.

公开(公告)号：US20220130814A1

公开(公告)日：2022-04-28

申请号：US17494851

申请日：2021-10-06

Applicant: MEDIATEK INC.

Inventor： Che-Hung Kuo ,  Yi-Jyun Lee

IPC: H01L27/01 ,  H01L25/065

Abstract: A semiconductor package includes a package substrate; a semiconductor die mounted on a top surface of the package substrate; a plurality of conductive elements disposed on a bottom surface of the package substrate; and a land-side silicon capacitor disposed on the bottom surface of the package substrate and surrounded by the plurality of conductive elements. The land-side silicon capacitor includes at least two silicon capacitor unit dies adjoined to each other with an integral scribe line region.

公开(公告)号：US20210193540A1

公开(公告)日：2021-06-24

申请号：US17190584

申请日：2021-03-03

Applicant: MediaTek Inc.

Inventor： Nan-Cheng Chen ,  Che-Ya Chou ,  Hsing-Chih Liu ,  Che-Hung Kuo

IPC: H01L23/31 ,  H01L25/065 ,  H01L23/538 ,  H01L23/00 ,  H01L23/48 ,  H01L23/482 ,  H01L25/04

Abstract: A semiconductor device includes a substrate, a body structure and an electronic component. The body structure is disposed above the substrate and includes a semiconductor die, a molding compound, a conductive component and a lower redistribution layer (RDL). The semiconductor die has an active surface. The molding compound encapsulates the semiconductor die and has a lower surface, an upper surface opposite to the lower surface and a through hole extending to the upper surface from the lower surface. The conductive component is formed within the through hole. The lower RDL is formed on the lower surface of the molding compound, the active surface of the semiconductor die and the conductive component exposed from the lower surface. The electronic component is disposed above the upper surface of the molding compound and electrically connected to the lower RDL through the conductive component.

公开(公告)号：US20180358685A1

公开(公告)日：2018-12-13

申请号：US15974700

申请日：2018-05-09

Applicant: MEDIATEK INC.

Inventor： Fu-Yi Han ,  Che-Ya Chou ,  Che-Hung Kuo ,  Wen-Chou Wu ,  Nan-Cheng Chen

IPC: H01Q1/22 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15321

Abstract: One embodiment of the present disclosure provides a semiconductor package including a bottom chip package having a first side and a second side opposing the first side, and a top antenna package mounted on the first side of the bottom chip package. The bottom chip package further includes a semiconductor chip. The semiconductor chip may include a RFIC chip. The top antenna package has at least one radiative antenna element.

公开(公告)号：US20180102298A1

公开(公告)日：2018-04-12

申请号：US15722315

申请日：2017-10-02

Applicant: MEDIATEK INC.

Inventor： Nan-Cheng Chen ,  Che-Ya Chou ,  Hsing-Chih Liu ,  Che-Hung Kuo

IPC: H01L23/31 ,  H01L23/48 ,  H01L25/04 ,  H01L23/482

CPC classification number: H01L23/31 ,  H01L23/145 ,  H01L23/147 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/4824 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/20 ,  H01L25/043 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2225/06541 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/10253 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A semiconductor device includes a substrate, a body structure and an electronic component. The body structure is disposed above the substrate and includes a semiconductor die, a molding compound, a conductive component and a lower redistribution layer (RDL). The semiconductor die has an active surface. The molding compound encapsulates the semiconductor die and has a lower surface, an upper surface opposite to the lower surface and a through hole extending to the upper surface from the lower surface. The conductive component is formed within the through hole. The lower RDL is formed on the lower surface of the molding compound, the active surface of the semiconductor die and the conductive component exposed from the lower surface. The electronic component is disposed above the upper surface of the molding compound and electrically connected to the lower RDL through the conductive component.

公开(公告)号：US20180053665A1

公开(公告)日：2018-02-22

申请号：US15623361

申请日：2017-06-14

Applicant: MEDIATEK INC.

Inventor： Che-Hung Kuo ,  Che-Ya Chou ,  Nan-Cheng Chen

IPC: H01L21/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/50

Abstract: A pre-bumped redistribution layer (RDL) structure is disclosed. The pre-bumped RDL structure includes at least a dielectric layer, a first metal layer on the first surface, a second metal layer on the second surface, and a via layer electrically connecting the first metal layer and the second metal layer. At least a bump pad is formed in the first metal layer. A bump is disposed on the bump pad. The bump comprises a copper layer with its lower end directly jointed to a top surface of the bump pad.