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公开(公告)号：US20240166844A1
公开(公告)日：2024-05-23
申请号：US18184698
申请日：2023-03-16
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Hung-Yi Chang , Chia-Lin Liu , Wei-Ru Huang
IPC: C08K3/22 , C08K5/5419
CPC classification number: C08K3/22 , C08K5/5419 , C08K2003/2237
Abstract: A resin composition and use thereof, wherein the resin composition includes a resin base, an inorganic filler and a siloxane coupling agent. The resin base includes bismaleimide resins, benzoxazine resins, and naphthenic epoxy resins, and the inorganic filler includes strontium titanate or calcium-doped strontium titanate.
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公开(公告)号：US20240166817A1
公开(公告)日：2024-05-23
申请号：US18298393
申请日：2023-04-11
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Yu-Ting Liu , Hung-Yi Chang , Chia-Lin Liu , Wei-Ru Huang
CPC classification number: C08G73/1067 , C08K13/02
Abstract: A resin composition including a modified maleimide resin is provided. The modified maleimide resin is formed from a dicyclopentadiene (DCPD)-based resin having an amino group and a maleic anhydride by a condensation polymerization. The dicyclopentadiene-based resin having an amino group is formed by nitration reaction and hydrogenation reaction of dicyclopentadiene phenolic resin.
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公开(公告)号：US11859083B2
公开(公告)日：2024-01-02
申请号：US17740301
申请日：2022-05-09
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Hung-Yi Chang , Chia-Lin Liu , Chien-Kai Wei
CPC classification number: C08L71/126 , B32B15/06 , B32B15/08 , C08L9/06 , B32B2260/021 , B32B2260/046 , B32B2262/101 , B32B2264/1021 , B32B2305/076 , B32B2307/204 , B32B2457/04 , C08L2203/20 , C08L2205/03 , C08L2205/05 , C08L2207/324 , C08L2312/00 , C08L2666/72 , C08L71/126 , C08L9/06 , C08L79/085 , C08K3/36
Abstract: A low-dielectric rubber resin material and a low-dielectric metal substrate are provided. The rubber resin material includes a low-dielectric rubber resin composition and inorganic fillers. The low-dielectric rubber resin composition includes: 5 wt % to 40 wt % of a liquid rubber, 20 wt % to 70 wt % of a polyphenylene ether resin, 5 wt % to 30 wt % of a bismaleimide resin, and 20 wt % to 45 wt % of a crosslinker. A molecular weight of the liquid rubber ranges from 800 g/mol to 6000 g/mol. An iodine value of the liquid rubber ranges from 30 g/100 g to 60 g/100 g.
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Patent Agency Ranking
公开(公告)号：US20240228755A1
公开(公告)日：2024-07-11
申请号：US18173775
申请日：2023-02-23
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
IPC: C08L9/06
CPC classification number: C08L9/06 , C08L2201/08 , C08L2203/20 , C08L2205/03
Abstract: A resin composition includes SBS resin, BMI resin, a crosslinking agent, and a modified polyphenylene ether resin has a following general formula:
wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.-
公开(公告)号：US20240228705A1
公开(公告)日：2024-07-11
申请号：US18171299
申请日：2023-02-17
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu
IPC: C08G73/12 , C08G65/333 , C08G65/48 , C08K3/36 , C08K5/18 , C08K5/5425
CPC classification number: C08G73/12 , C08G65/33337 , C08G65/485 , C08K3/36 , C08K5/18 , C08K5/5425
Abstract: A resin composition is provided, which includes diamine, a BMI resin, and a modified polyphenylene ether resin having a following structural formula:
wherein R represents a chemical group of a bisphenol compound located between two hydroxyphenyl functional groups thereof, and n is an integer ranging from 3 to 25.-
公开(公告)号：US20240150547A1
公开(公告)日：2024-05-09
申请号：US17993851
申请日：2022-11-23
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Hung-Yi Chang , Chia-Lin Liu , Wei-Ru Huang
CPC classification number: C08K3/36 , B32B15/08 , B32B15/20 , C08G59/245 , C08G61/122 , C08G73/10 , C08J5/18 , C08J5/244 , B32B2250/03 , B32B2307/204 , B32B2307/306 , B32B2311/12 , B32B2457/00 , C08K2201/003 , C08K2201/014
Abstract: A composite material substrate includes an inorganic filler, a resin composition, and a dispersant. The resin composition includes a bismaleimide resin, a naphthalene ring-containing epoxy resin, and a benzoxazine resin. The inorganic filler, the resin composition, and the dispersant are mixed together.
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公开(公告)号：US20230072223A1
公开(公告)日：2023-03-09
申请号：US17549880
申请日：2021-12-14
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Wei-Ru Huang , Hung-Yi Chang , Chia-Lin Liu , Chien Kai Wei
IPC: C08F136/06 , C08L71/12 , C08K3/36 , C08K5/14 , C08K5/3492 , C08K5/5419 , C08K5/5313
Abstract: A resin composition, including resin and peroxide, is provided. The resin includes liquid rubber resin, polyphenylene ether resin, and a crosslinking agent. The sum of the liquid rubber resin, the polyphenylene ether resin, and the crosslinking agent is 100 parts by mass. The amount of the peroxide used is between 0.1 phr and 5 phr. The peroxide is composed of tertiary butyl cumyl peroxide and an inorganic compound.
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公开(公告)号：US11008451B2
公开(公告)日：2021-05-18
申请号：US16202165
申请日：2018-11-28
Applicant: NAN YA PLASTICS CORPORATION
Inventor： Te-Chao Liao , Ying-Te Huang , Chih-Kai Chang , Hung-Yi Chang , Hao-Sheng Chen , Chia-Lin Liu
Abstract: A fluorocarbon resin composition is applicable to produce a prepreg for use in making a high-frequency circuit board, including a polytetrafluoroethylene resin; a fluorine-containing copolymer of poly fluoroalkoxy or fluorinated ethylene propylene; inorganic powders and an impregnation additive such as hydroxyethyl cellulose; resulted in that the prepreg is capable of increasing a plurality of times for proceeding impregnation-coating, the surface defects prone to occur on a fluorocarbon prepreg during drying, baking and sintering after impregnation are therefore improved at the same time.
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