公开(公告)号：US20250072168A1

公开(公告)日：2025-02-27

申请号：US18783052

申请日：2024-07-24

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA

IPC: H01L33/20 ,  H01L25/075

Abstract: A light-emitting device includes a wiring substrate and a plurality of light-emitting elements arrayed on the wiring substrate along a first direction and each having a rectangular shape. The light-emitting elements each include a first portion, and a plurality of second portions disposed on either side of the first portion in the first direction. The first portion includes a first semiconductor layered body and an electrode. The second portions each include a second semiconductor layered body, and a reflective layer connected to the second semiconductor layered body. The first portion includes a first length section and a second length section. In the first length section, a length of the first semiconductor layered body in the first direction is a first length. In the second length section, a length of the first semiconductor layered body in the first direction is a second length shorter than the first length.

公开(公告)号：US20230411569A1

公开(公告)日：2023-12-21

申请号：US18334773

申请日：2023-06-14

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA

IPC: H01L33/50 ,  H01L33/52 ,  H01L33/00

CPC classification number: H01L33/505 ,  H01L33/52 ,  H01L33/005 ,  H01L2933/0041 ,  H01L2933/005

Abstract: A method for manufacturing a light-emitting device includes: providing a substrate on which a semiconductor portion is disposed; providing a support substrate having conductivity, including a first surface and a second surface on a side opposite to the first surface, and including a groove portion formed at the first surface; electrically connecting the semiconductor portion and the support substrate by disposing the semiconductor portion on the first surface across the groove portion in a plan view; removing the substrate from the semiconductor portion; bonding a wavelength conversion member to the semiconductor portion from which the substrate has been removed; supplying a resin member having light reflectivity into the groove portion and a space between the support substrate and the wavelength conversion member; and exposing the resin member in the groove portion from the support substrate by removing part of the support substrate from the second surface side.

公开(公告)号：US20230099246A1

公开(公告)日：2023-03-30

申请号：US17891132

申请日：2022-08-19

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA ,  Koji NISHINO ,  Kenji OZEKI

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62

Abstract: A method for manufacturing a light-emitting device includes preparing first and second members. The first member includes first elements having first bonding parts. The second member includes a wiring substrate and second bonding parts. The method includes bonding the first bonding part and the second bonding part at a first bonding condition. The method includes evaluating an electrical characteristic of the first elements. The method includes removing, from the wiring substrate, a defective first element determined by the evaluation to be defective. The method includes placing a second element having a third bonding part on a region of the wiring substrate at which the defective first element had been removed. The method includes bonding the first bonding part and the second bonding part, and the third bonding part and the second bonding part at a second bonding condition.

公开(公告)号：US20220293573A1

公开(公告)日：2022-09-15

申请号：US17826160

申请日：2022-05-27

Applicant: NICHIA CORPORATION

Inventor： Takashi ISHII ,  Dai WAKAMATSU ,  Hiroaki KAGEYAMA

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/60 ,  H01L25/16

Abstract: A light emitting device that includes a plurality of element structures, a frame, and a covering member. Each of the plurality of element structures includes a light emitting element. The frame surrounds the plurality of element structures. The covering member is disposed on an inner side of the frame. The covering member is disposed between the frame and an element structure of the plurality of element structures adjacent to the frame and between adjacent element structures of the plurality of element structures. An upper surface and a lower surface of each of the plurality of element structures are exposed from the covering member.

公开(公告)号：US20210336109A1

公开(公告)日：2021-10-28

申请号：US17241567

申请日：2021-04-27

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA

IPC: H01L33/62 ,  H01L25/13

Abstract: A light-emitting device includes: a substrate; n light-emitting elements (n being a natural number of 2 or more) mounted on the substrate, each comprising a first bonding member electrically connected to a first semiconductor layer, and a second bonding member electrically connected to a second semiconductor layer; and n+1 interconnects provided on the substrate, the n+1 interconnects comprising a first interconnect comprising a first external connection portion, a second interconnect comprising a second external connection portion, and a third interconnect comprising a third external connection portion. In a top-view, the first light-emitting element is located between a first side of the substrate and a second light-emitting element, and the second light-emitting element is located between a first light-emitting element and a second side.

公开(公告)号：US20210317958A1

公开(公告)日：2021-10-14

申请号：US17224816

申请日：2021-04-07

Applicant: NICHIA CORPORATION

Inventor： Hiroaki KAGEYAMA ,  Takashi ISHII

IPC: F21S4/28 ,  F21K9/90 ,  F21V23/00 ,  F21V29/503

Abstract: A light emitting device includes: a plurality of element structural bodies, each including: a substrate, a light emitting element mounted on or above the substrate, and a light-transmissive member disposed on or above the light emitting element, wherein at least three of the plurality of element structural bodies are disposed along a first direction; a first covering member that covers lateral surfaces of the substrate, the light emitting element, and the light-transmissive member of each of the plurality of element structural bodies; and a support member that covers a lateral surface of the first covering member, wherein at least a portion of the support member is disposed lateral to the plurality of element structural bodies and extends along the first direction. A rigidity of the support member is greater than a rigidity of the first covering member.

公开(公告)号：US20170084787A1

公开(公告)日：2017-03-23

申请号：US15267691

申请日：2016-09-16

Applicant: NICHIA CORPORATION

Inventor： Keiji EMURA ,  Yoshiki INOUE ,  Hiroaki KAGEYAMA

IPC: H01L33/38 ,  H01L33/40 ,  H01L33/58 ,  H01L33/62 ,  H01L33/50 ,  H01L27/15 ,  H01L33/24

CPC classification number: H01L33/387 ,  H01L33/20 ,  H01L33/38 ,  H01L33/382 ,  H01L33/62

Abstract: A light-emitting element includes a light transmissive substrate; a first semiconductor stacked body including: a first n-side semiconductor layer, and a first p-side semiconductor layer, the first p-side semiconductor layer having a hole formed therein; a first p-electrode; a first n-electrode having a portion above the first p-electrode, and a portion extending into the hole, the first n-electrode being electrically connected to the first n-side semiconductor layer through the hole; a second semiconductor stacked body including: a second n-side semiconductor layer located around a periphery of the first semiconductor stacked body, and a second p-side semiconductor layer located above the second n-side semiconductor layer and located outside of an inner edge portion of the second n-side semiconductor layer; a second p-electrode; and a second n-electrode having a portion above the second p-electrode, and being electrically connected to the inner edge portion of the second n-side semiconductor layer.