公开(公告)号：US5611014A

公开(公告)日：1997-03-11

申请号：US349151

申请日：1994-12-07

Applicant: Nagesh R. Basavanhally

Inventor： Nagesh R. Basavanhally

IPC: G02B6/30 ,  G02B6/36 ,  G02B6/42

CPC classification number: G02B6/3652 ,  G02B6/30 ,  G02B6/3636 ,  G02B6/3692 ,  G02B6/3696

Abstract: A waveguide mounting board having an array of ridge type waveguides on a surface thereof is automatically centered with an optical fiber board having a corresponding array of optical fibers by seating elongated alignment rails on the waveguide mounting board within alignment V-grooves in the fiber board. The alignment rails each comprises a short length of an optical fiber mounted on a pair of parallel alignment ridges. The alignment ridges are generally similar to the ridge type waveguides and are formed simultaneously therewith using a common photomask.

Abstract translation: 具有其表面上的脊状波导阵列的波导安装板通过在光纤板中的对准V形槽内的波导安装板上放置细长的对准轨道而将光纤自动对中，该光纤板具有相应的光纤阵列。 对准导轨各自包括安装在一对平行对准脊上的光纤的短长度。 对准脊通常类似于脊型波导，并且使用公共光掩模与其同时形成。

公开(公告)号：US5568892A

公开(公告)日：1996-10-29

申请号：US260860

申请日：1994-06-16

Applicant: Nagesh R. Basavanhally

Inventor： Nagesh R. Basavanhally

IPC: B23K1/005 ,  B23K31/02 ,  G02B6/42 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K3/3436 ,  G02B6/4225 ,  G02B6/4238 ,  G02B6/4226 ,  H05K1/0212 ,  H05K2203/1476 ,  H05K3/3494 ,  Y02P70/613

Abstract: A method for aligning and soldering a first device (11) to a substrate (16) comprises the steps of providing a plurality of solder elements (17) between the first device and the substrate, aligning the first device, and then reflowing and cooling the solder elements to bond the first device to the substrate. The improvement comprises, first, reflowing only a first group of solder elements and then cooling the elements of the first group, thereby to tack the first device to the substrate. Thereafter, we reflow only a second group of the plurality of solder elements and cool the second group, thereby to provide a more secure bond between the device and the substrate without interfering with the alignment of the first device. This method reduces the amount of energy needed for each reflow step, thereby reducing stresses and maintaining better alignment. In an illustrative embodiment, three groups of solder elements are provided, each group containing four solder elements to be heated by individual heater elements (39). Separate circuits (27, 28, 29) are provided for energizing sequentially the three groups for reflow. Thus, four solder elements are initially reflowed and cooled to provide good tacking between the first device and the substrate. Thereafter, the other groups are actuated sequentially with heat dissipation occurring between each successive actuation. Thermal barriers (34, 38) are preferably included between each heater element and the first device and between the heater element and the substrate to concentrate heat on the solder element (17). The first device is illustratively a laser (11) that is aligned with an optical fiber (12) prior to bonding.

Abstract translation: 用于将第一装置（11）对准和焊接到基板（16）的方法包括以下步骤：在第一装置和基板之间提供多个焊料元件（17），对准第一装置，然后回流和冷却 焊接元件将第一器件结合到衬底。 改进之处在于，首先仅回流第一组焊料元件，然后冷却第一组的元件，从而将第一器件固定到衬底上。 此后，我们仅回流第二组多个焊料元件并冷却第二组，从而在不干扰第一器件的对准的情况下，在器件和衬底之间提供更牢固的结合。 该方法减少了每个回流步骤所需的能量，从而减少了应力并保持了更好的对准。 在说明性实施例中，提供了三组焊接元件，每组包含四个待单独加热元件（39）加热的焊料元件。 提供独立电路（27,28,29），用于顺序地激励三组用于回流。 因此，首先回流和冷却四个焊料元件以在第一器件和衬底之间提供良好的粘合。 此后，其他组依次致动，每个连续致动之间发生散热。 优选地，在每个加热器元件和第一装置之间以及加热器元件和基板之间包括热障（34,38）以将热量集中在焊料元件（17）上。 第一装置示例性地是在接合之前与光纤（12）对准的激光器（11）。

公开(公告)号：US5135590A

公开(公告)日：1992-08-04

申请号：US705229

申请日：1991-05-24

Applicant: Nagesh R. Basavanhally ,  Richard Borutta ,  Theodore Sizer, II ,  James A. Walker

Inventor： Nagesh R. Basavanhally ,  Richard Borutta ,  Theodore Sizer, II ,  James A. Walker

IPC: G02B6/40 ,  B81B1/00 ,  B81C3/00 ,  G02B6/32 ,  G02B6/36 ,  G02B6/38 ,  G02B6/44

CPC classification number: G02B6/362 ,  G02B6/32 ,  G02B6/3834 ,  G02B6/3839 ,  G02B6/3885 ,  G02B6/3887 ,  G02B6/4439 ,  G02B6/3644 ,  G02B6/3652 ,  G02B6/3672 ,  G02B6/3692 ,  G02B6/3854

Abstract: A bundle (12) of optical fibers (13) is fixed in a matrix array by apertures in a guiding plate (14) and a securing plate (15). The apertures (18) in the guiding plate are larger than those in the securing plate and the securing plate apertures (17) are funnel-shaped to aid in insertion of the fibers. Each row of optical fibers may be inserted simultaneously by mounting the row on a uniquely designed vacuum holder (26).

Abstract translation: 束（12）的光纤（13）通过引导板（14）和固定板（15）中的孔被固定成矩阵阵列。 引导板中的孔（18）大于固定板中的孔（18），并且固定板孔（17）为漏斗形以有助于插入纤维。 每行光纤可以通过将行安装在独特设计的真空保持器（26）上而同时插入。

公开(公告)号：US5065933A

公开(公告)日：1991-11-19

申请号：US584831

申请日：1990-09-19

Applicant: Nagesh R. Basavanhally

Inventor： Nagesh R. Basavanhally

IPC: H01L21/60 ,  B23K1/018 ,  H05K3/34 ,  H05K13/04

CPC classification number: H05K13/0486 ,  B23K1/018 ,  H01L24/75 ,  H01L24/81 ,  H01L2924/14

Abstract: A robotically controlled pick-uo to tool (11) is modified by connecting to it a load cell (26) that generates a signal indicative of stress on the pick-up tool. The pick-up tool is directed toward a chip (12) to be removed and movement is stopped when the load cell generates a first signal indicative of a first level of stress. In addition to stopping movement of the pick-up tool, the first signal actuates heating of the tool to a temperature sufficient to melt the solder (13) bonding the chip to the substrate (14). The melting of the solder bonds (13) results in a reduction of stress on the tool, which causes the load cell (26) to generate a signal indicative of the second level of stress. The second signal actuates the vacuum of the pick-up tool to cause adhesion of the chip to the pick-up tool and also initiates movement of the pick-up tool so as remove the chip from the substrate.

公开(公告)号：US07832462B2

公开(公告)日：2010-11-16

申请号：US12080408

申请日：2008-03-31

Applicant: Nagesh R. Basavanhally ,  Marc Scott Hodes ,  Paul Robert Kolodner ,  Avinoam Kornblit ,  Thomas Nikita Krupenkin ,  Wonsuck Lee ,  Alan Michael Lyons ,  Todd Richard Salamon ,  Brijesh Vyas

Inventor： Nagesh R. Basavanhally ,  Marc Scott Hodes ,  Paul Robert Kolodner ,  Avinoam Kornblit ,  Thomas Nikita Krupenkin ,  Wonsuck Lee ,  Alan Michael Lyons ,  Todd Richard Salamon ,  Brijesh Vyas

IPC: F28D15/00

CPC classification number: F28D15/046

Abstract: Device having first wick evaporator including first membrane and plurality of first thermally-conductive supports. First membrane has upper and lower surfaces. First membrane also has plurality of pores with upper pore ends at upper surface of first membrane and with lower pore ends at lower surface of first membrane. Each of first thermally-conductive supports has upper and lower support ends. Upper support ends of first thermally-conductive supports are in contact with first membrane. Each of first thermally-conductive supports has longitudinal axis extending between the upper and lower support ends, average cross-sectional area along axis, and membrane support cross-sectional area at upper support end, the membrane support cross-sectional area effectively being smaller than average cross-sectional area. First thermally-conductive supports are configured to conduct thermal energy from lower support ends of first thermally-conductive supports to first membrane. Process includes providing wick evaporator, providing liquid working fluid in contact with lower or upper surface of membrane, and causing liquid working fluid to be evaporated from liquid-vapor interface in membrane.

Abstract translation: 具有第一灯芯蒸发器的设备包括第一膜和多个第一导热支撑件。 第一膜具有上表面和下表面。 第一膜还具有多个孔，第一膜的上表面具有上孔端，在第一膜的下表面具有较低的孔端。 每个第一导热支撑件具有上和下支撑端。 第一导热支撑件的上支撑端与第一膜接触。 每个第一导热支撑件具有在上支撑端和下支撑端之间延伸的纵向轴线，沿着轴线的平均横截面积以及在上支撑端处的膜支撑横截面积，膜支撑横截面面积有效地小于 平均横截面积。 第一导热支撑件构造成将热能从第一导热支撑件的下支撑端传导到第一膜。 工艺过程包括提供油芯蒸发器，提供与膜的下表面或上表面接触的液体工作流体，并使液体工作流体从膜中的液 - 气界面蒸发。

公开(公告)号：US20090242175A1

公开(公告)日：2009-10-01

申请号：US12080408

申请日：2008-03-31

Applicant: Nagesh R. Basavanhally ,  Marc Scott Hodes ,  Paul Robert Kolodner ,  Avinoam Kornblit ,  Thomas Nikita Krupenkin ,  Lee Wonsuck ,  Alan Michael Lyons ,  Todd Richard Salamon ,  Brijesh Vyas

Inventor： Nagesh R. Basavanhally ,  Marc Scott Hodes ,  Paul Robert Kolodner ,  Avinoam Kornblit ,  Thomas Nikita Krupenkin ,  Lee Wonsuck ,  Alan Michael Lyons ,  Todd Richard Salamon ,  Brijesh Vyas

IPC: F28D15/00

CPC classification number: F28D15/046

Abstract: Device having first wick evaporator including first membrane and plurality of first thermally-conductive supports. First membrane has upper and lower surfaces. First membrane also has plurality of pores with upper pore ends at upper surface of first membrane and with lower pore ends at lower surface of first membrane. Each of first thermally-conductive supports has upper and lower support ends. Upper support ends of first thermally-conductive supports are in contact with first membrane. Each of first thermally-conductive supports has longitudinal axis extending between the upper and lower support ends, average cross-sectional area along axis, and membrane support cross-sectional area at upper support end, the membrane support cross-sectional area effectively being smaller than average cross-sectional area. First thermally-conductive supports are configured to conduct thermal energy from lower support ends of first thermally-conductive supports to first membrane. Process includes providing wick evaporator, providing liquid working fluid in contact with lower or upper surface of membrane, and causing liquid working fluid to be evaporated from liquid-vapor interface in membrane.

Abstract translation: 具有第一灯芯蒸发器的设备包括第一膜和多个第一导热支撑件。 第一膜具有上表面和下表面。 第一膜还具有多个孔，第一膜的上表面具有上孔端，在第一膜的下表面具有较低的孔端。 每个第一导热支撑件具有上和下支撑端。 第一导热支撑件的上支撑端与第一膜接触。 每个第一导热支撑件具有在上支撑端和下支撑端之间延伸的纵向轴线，沿着轴线的平均横截面积以及在上支撑端处的膜支撑横截面积，膜支撑横截面面积有效地小于 平均横截面积。 第一导热支撑件构造成将热能从第一导热支撑件的下支撑端传导到第一膜。 工艺过程包括提供油芯蒸发器，提供与膜的下表面或上表面接触的液体工作流体，并使液体工作流体从膜中的液 - 气界面蒸发。

公开(公告)号：US20090008430A1

公开(公告)日：2009-01-08

申请号：US11825490

申请日：2007-07-06

Applicant: Nagesh R. Basavanhally ,  Raymond A. Cirelli ,  Avinoam Kornblit

Inventor： Nagesh R. Basavanhally ,  Raymond A. Cirelli ,  Avinoam Kornblit

IPC: B23K1/20

CPC classification number: B23K1/0008 ,  B23K35/3006 ,  B23K35/3013 ,  B23K35/322 ,  B23K2101/36

Abstract: Methods include providing substrate having substrate surface, forming metal-containing pad on substrate surface, and forming metal-containing protective shell enclosing metal-containing body on metal-containing pad. Methods may include forming sacrificial layer on metal-containing pad and including top surface and cavity, cavity having side wall extending between metal-containing pad and top surface; and forming metal-containing protective shell in cavity. Methods may also include providing first, second, third and fourth metal-containing pads on first, second, third and fourth substrate surfaces; forming first metal-containing protective shell on first or second metal-containing pad; forming second metal-containing protective shell on third or fourth metal-containing pad; heating first metal-containing protective shell to form solder-bond between first and second substrate surfaces; and heating second metal-containing protective shell to form solder-bond between third and fourth substrate surfaces.

Abstract translation: 方法包括提供具有基板表面的基板，在基板表面上形成含金属垫，以及在含金属垫上形成包围含金属的主体的含金属保护壳。 方法可以包括在含金属垫上形成牺牲层，并且包括顶表面和空腔，具有在含金属垫和顶表面之间延伸的侧壁的空腔; 并在空腔中形成含金属的保护壳。 方法还可以包括在第一，第二，第三和第四衬底表面上提供第一，第二，第三和第四含金属焊盘; 在第一或第二含金属垫上形成第一含金属保护壳; 在第三或第四含金属垫上形成第二含金属保护壳; 加热第一含金属的保护壳，以在第一和第二基底表面之间形成焊料接合; 并加热第二含金属的保护壳，以在第三和第四衬底表面之间形成焊料接合。

公开(公告)号：US20080316563A1

公开(公告)日：2008-12-25

申请号：US12199236

申请日：2008-08-27

Applicant: Vladimir A. Aksyuk ,  Nagesh R. Basavanhally ,  Omar D. Lopez ,  Chien-Shing Pai

Inventor： Vladimir A. Aksyuk ,  Nagesh R. Basavanhally ,  Omar D. Lopez ,  Chien-Shing Pai

IPC: G02B26/08

CPC classification number: B81C1/00476 ,  B81B2201/038 ,  B81C1/00801

Abstract: The present invention provides an apparatus. The apparatus, may include an actuator located over a substrate, a movable feature located over and coupled to the actuator, and a layer of material located above the actuator and movable feature and not constituting part of a beam/spring associated with the movable feature, the layer of material configured as a reservoir having an interior capable of holding a liquid, the movable feature being exposed to the interior.

Abstract translation: 本发明提供一种装置。 该装置可以包括位于基板上的致动器，位于致动器上方并联接到致动器的可移动特征，以及位于致动器和可移动特征上方的材料层，并且不构成与可移动特征相关联的梁/弹簧的一部分， 所述材料层被构造为具有能够保持液体的内部的储存器，所述可移动特征暴露于内部。

公开(公告)号：US07231106B2

公开(公告)日：2007-06-12

申请号：US11239940

申请日：2005-09-30

Applicant: Nagesh R. Basavanhally ,  Dan M. Marom

Inventor： Nagesh R. Basavanhally ,  Dan M. Marom

IPC: G02B6/26 ,  G02B6/42

CPC classification number: G02B6/3546 ,  G02B6/3512 ,  G02B6/356

Abstract: The invention includes an apparatus for receiving an optical signal from an optical input means and directing the optical signal to one of a plurality of optical output means. The apparatus includes a solid signal propagating material having a refractive index greater than the refractive index of air. The solid signal propagating material includes a first transparent surface optically cooperating with the optical input and output means, a second transparent surface optically cooperating with a first light directing mechanism, and a reflective surface optically cooperating with the first light directing mechanism. A first reflecting component of the light directing mechanism directs a received optical signal to a second reflecting component of the light directing mechanism via the reflective surface of the signal propagating material. The second reflecting component of the light directing mechanism directs the respective incident optical signal to the selected one of the plurality of optical output means.

Abstract translation: 本发明包括一种用于从光输入装置接收光信号并将光信号引导到多个光输出装置之一的装置。 该装置包括具有大于空气折射率的折射率的固体信号传播材料。 固体信号传播材料包括与光学输入和输出装置光学协作的第一透明表面，与第一光引导机构光学协作的第二透明表面和与第一光引导机构光学协作的反射表面。 光引导机构的第一反射部件经由信号传播材料的反射表面将接收到的光信号引导到光引导机构的第二反射部件。 导光机构的第二反射部件将相应的入射光信号引导到多个光输出装置中选定的一个。

公开(公告)号：US6106161A

公开(公告)日：2000-08-22

申请号：US153386

申请日：1998-09-15

Applicant: Nagesh R. Basavanhally ,  Michael F. Brady

Inventor： Nagesh R. Basavanhally ,  Michael F. Brady

IPC: G02B6/42 ,  G02B6/36

CPC classification number: G02B6/4232 ,  G02B6/4237 ,  G02B6/4238 ,  G02B6/4202 ,  G02B6/4248

Abstract: Compliant, resilient mounting means are provided for minimizing stress on the platform of an optical sub-assembly package caused by temperature change and the like so as to maintain good alignment between the laser beam emitted from a laser chip mounted on the platform and the lens of an optical fiber also mounted on the platform. The resilient means comprise resilient solder bumps of the order of 625 microns thick interposed between the platform and the base to provide a resilient connection between the platform and the base, thereby maintaining good alignment between the laser beam and the lens by reducing the stresses on the optical sub-assembly platform that tend to be caused by temperature changes or the mounting of the package to a rigid, external platform, as by bolting.

Abstract translation: 提供了合适的弹性安装装置，用于最小化由温度变化等引起的光学组件包装平台上的应力，从而保持从安装在平台上的激光芯片发出的激光束与透镜之间的良好对准 还安装在平台上的光纤。 弹性装置包括介于平台和基座之间的625微米厚度的弹性焊料凸块，以在平台和基座之间提供弹性连接，由此通过减小激光束和透镜之间的应力来保持激光束和透镜之间的良好对准 光学子组件平台倾向于由温度变化引起，或者通过螺栓固定将包装件安装到刚性的外部平台上。