公开(公告)号：US6114864A

公开(公告)日：2000-09-05

申请号：US833221

申请日：1997-04-14

申请人： Koji Soejima ,  Naoji Senba

发明人： Koji Soejima ,  Naoji Senba

IPC分类号： G01R31/26 ,  G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  H01L21/66

CPC分类号： G01R1/07342 ,  G01R1/06711 ,  G01R1/06744 ,  G01R1/0735 ,  G01R3/00

摘要： A probe card comprises the following elements. An insulation film is provided which is flexible and extends on a first surface of a substrate. The insulation film has a first surface in contact with the first surface of the substrate, to form a space region which is defined between the first surface of the substrate and the first surface of the insulation film so as to allow part of the insulation film to move into the space. Probe patterns extend on a second surface of the insulation film so that the probe patterns.

摘要翻译： 探针卡包括以下元件。 提供了一种柔性的并在衬底的第一表面上延伸的绝缘膜。 绝缘膜具有与基板的第一表面接触的第一表面，以形成限定在基板的第一表面和绝缘膜的第一表面之间的空间区域，以使绝缘膜的一部分 进入空间。 探针图案在绝缘膜的第二表面上延伸，使得探针图案。

公开(公告)号：US5883426A

公开(公告)日：1999-03-16

申请号：US844320

申请日：1997-04-18

申请人： Kenichi Tokuno ,  Ikushi Morisaki ,  Akihiro Doya ,  Manabu Bonkohara ,  Naoji Senba ,  Yuuzou Shimada ,  Kazuaki Utumi

发明人： Kenichi Tokuno ,  Ikushi Morisaki ,  Akihiro Doya ,  Manabu Bonkohara ,  Naoji Senba ,  Yuuzou Shimada ,  Kazuaki Utumi

IPC分类号： H01L23/427 ,  H01L23/31 ,  H01L23/367 ,  H01L25/065 ,  H01L25/07 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H01L23/02

CPC分类号： H01L23/3672 ,  H01L23/3107 ,  H01L23/467 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1094 ,  H01L23/427 ,  H01L2924/15311 ,  H01L2924/15331

摘要： A stack module is provided which relieves thermal stress generated in a heat-radiating element and provides improved cooling efficiency. Connection bumps of a plurality of mounting substrates, onto which are mounted semiconductor chips are used to stack the substrates to four levels, three wave-shaped heat-radiating elements, made of copper, being in thermal contact between the semiconductor chips of three of the mounting substrates and the rear surfaces of three of the mounting substrates, making use of the spring elasticity of the heat-radiating elements to establish this thermal contact.

摘要翻译： 提供了一种减轻在散热元件中产生的热应力并提供改善的冷却效率的堆叠模块。 使用安装有半导体芯片的多个安装基板的连接凸块将基板堆叠成四个级别，三个由铜构成的波浪形散热元件在三个半导体芯片的半导体芯片之间热接触 安装基板和三个安装基板的后表面，利用散热元件的弹簧弹性来建立这种热接触。