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公开(公告)号：US10520817B2
公开(公告)日：2019-12-31
申请号：US15605259
申请日：2017-05-25
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: In a method for producing a wired circuit board includes a step (1), in which the insulating layer having an inclination face is provided; a step (2), in which a metal thin film is provided on the surface of the insulating layer including the inclination face; a step (3), in which a photoresist is provided on the surface of the metal thin film; a step (4), in which a photomask is disposed so that a first light exposure portion and a second light exposure portion in the photoresist are exposed to light, and the photoresist is exposed to light; a step (5), in which the first light exposure portion and the second light exposure portion are removed; and a step (6), in which the first wire and the second wire are provided on the surface of the metal thin film.
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公开(公告)号：US10327327B2
公开(公告)日：2019-06-18
申请号：US15696270
申请日：2017-09-06
Applicant: Nitto Denko Corporation
Inventor： Daisuke Yamauchi , Hiroyuki Tanabe
Abstract: In a suspension board, a first insulating layer is formed on a support substrate. A ground layer and a power wiring trace are formed on the first insulating layer. The ground layer has electric conductivity higher than that of the support substrate. A second insulating layer is formed on the first insulating layer to cover the ground layer and the power wiring trace. A write wiring trace is formed on the second insulating layer to overlap with the ground layer. In a stacking direction of the support substrate, the first insulating layer and the second insulating layer, a distance between the ground layer and the write wiring trace is larger than a distance between the power wiring trace and the write wiring trace.
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公开(公告)号：US10143088B2
公开(公告)日：2018-11-27
申请号：US15386744
申请日：2016-12-21
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe
Abstract: The method for producing a wired circuit board including an insulating layer and a conductive pattern provided on the insulating layer includes the steps of the following: a step (1), in which the insulating layer is provided; a step (2), in which a metal thin film is provided on an inclined face of the insulating layer; a step (3), in which a photoresist is provided on the metal thin film; a step (4), in which a photomask is disposed so that in the photoresist, a portion where the conductive pattern is to be provided is shielded from light, and the photoresist is exposed to light through the photomask; a step (5), in which the portion of the photoresist shielded from light by the photomask is removed to expose the metal thin film corresponding to the portion; and a step (6), in which the conductive pattern is provided on the metal thin film exposed from the photoresist. When exposing the photoresist, reflection is caused by the metal thin film positioned on the inclined face to reduce light projected to the portion.
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公开(公告)号：US10028378B2
公开(公告)日：2018-07-17
申请号：US15373573
申请日：2016-12-09
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki Tanabe , Naohiro Terada , Yuu Sugimoto , Daisuke Yamauchi
Abstract: A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.
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公开(公告)号：US09713245B2
公开(公告)日：2017-07-18
申请号：US15058502
申请日：2016-03-02
Applicant: NITTO DENKO CORPORATION
Inventor： Hiroyuki Tanabe , Yoshito Fujimura , Yuu Sugimoto
CPC classification number: H05K1/0213 , G11B5/4853 , H05K1/118 , H05K1/18 , H05K1/181 , H05K3/341 , H05K2201/05 , H05K2203/048 , Y02P70/613
Abstract: A wired circuit board includes a first insulating layer, a conductive pattern disposed on the first insulating layer and including a plurality of terminals arranged in parallel to be spaced apart from each other, and a second insulating layer disposed on the first insulating layer so as to cover the conductive pattern. Each of the terminals includes a main body portion and a protruding portion protruding from the main body portion and having a dimension in a parallel arrangement direction of the terminals which is shorter than a dimension of the main body portion thereof. The second insulating layer includes a plurality of end-portion covering portions disposed individually on both end portions of the main body portion in the parallel arrangement direction and exposing a middle portion of the main body portion and the protruding portion.
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Patent Agency Ranking
公开(公告)号：US09418687B2
公开(公告)日：2016-08-16
申请号：US14936102
申请日：2015-11-09
Applicant: NITTO DENKO CORPORATION
Inventor： Naohiro Terada , Yoshito Fujimura , Hiroyuki Tanabe , Saori Kanezaki , Yuu Sugimoto
CPC classification number: G11B5/4826 , G11B5/484 , G11B5/4853 , G11B5/486
Abstract: A suspension board with circuit includes a slider mounting region configured to mount a slider thereon, a pedestal portion provided in the slider mounting region and configured to support the slider, and a dam portion provided in the slider mounting region and configured to prevent an adhesive fixing the slider from flowing out of the slider mounting region. The thickness of the pedestal portion is thicker than that of the dam portion.
Abstract translation: 具有电路的悬挂板包括：滑块安装区域，其构造成在其上安装滑块;基座部，设置在滑块安装区域中并构造成支撑滑块;以及阻挡部，其设置在滑块安装区域中并且构造成防止粘合固定 滑块从滑块安装区域流出。 基座部的厚度比坝部的厚度厚。
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公开(公告)号：US09147412B2
公开(公告)日：2015-09-29
申请号：US14580850
申请日：2014-12-23
Applicant: NITTO DENKO CORPORATION
Inventor： Tomoaki Okuno , Hiroyuki Tanabe , Yoshito Fujimura , Naohiro Terada
CPC classification number: G11B5/4826 , G11B5/4853 , G11B5/4873 , G11B21/24
Abstract: A head gimbal assembly includes a suspension board with circuit, a pair of piezoelectric elements mounted on the suspension board with circuit to be expandable/contractible, and a slider on which a magnetic head is mounted and which is mounted on the suspension board with circuit and configured to be able to swing with expansion/contraction of the pair of piezoelectric elements. The pair of piezoelectric elements are placed on the suspension board with circuit such that a first imaginary line extending along an expanding/contracting direction of one of the piezoelectric elements crosses a second imaginary line extending along an expanding/contracting direction of the other piezoelectric element.
Abstract translation: 头万向架组件包括具有电路的悬挂板，安装在具有可扩张/收缩的电路的悬挂板上的一对压电元件和安装有磁头的滑块，并且其上安装有具有电路的悬挂板 被构造成能够随着所述一对压电元件的膨胀/收缩而摆动。 一对压电元件被放置在具有电路的悬挂板上，使得沿着一个压电元件的扩张/收缩方向延伸的第一假想线与沿另一个压电元件的扩展/收缩方向延伸的第二假想线交叉。
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公开(公告)号：US10808329B2
公开(公告)日：2020-10-20
申请号：US16479071
申请日：2018-01-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe
IPC: H05K1/05 , G11B5/48 , C25D5/02 , C25D7/00 , C25D3/48 , C25D5/50 , H05K3/24 , C25D5/10 , C25D5/36 , H05K3/18 , H05K3/46 , H05K1/03 , H05K1/11 , H05K1/02
Abstract: The wired circuit board includes a metal supporting board, an insulating layer and a conductor layer disposed at one side in the thickness direction of the metal supporting board, a gold plate layer disposed at the other side in the thickness direction of the metal supporting board, and an adherence layer disposed between the metal supporting board and the gold plate layer. The material of the metal supporting board is a corrosion resistant alloy. In the adherence layer, gold and the metal contained in the corrosion resistant alloy are mixedly present.
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公开(公告)号：US10687427B2
公开(公告)日：2020-06-16
申请号：US15478711
申请日：2017-04-04
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Hiroyuki Tanabe , Yoshito Fujimura
Abstract: A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.
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公开(公告)号：US10251263B2
公开(公告)日：2019-04-02
申请号：US15712613
申请日：2017-09-22
Applicant: NITTO DENKO CORPORATION
Inventor： Yuu Sugimoto , Yoshito Fujimura , Hiroyuki Tanabe
Abstract: A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.
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